| Patents for C22C 13 - Alloys based on tin (1,972) |
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| 06/01/2006 | US20060113683 Doped alloys for electrical interconnects, methods of production and uses thereof |
| 05/31/2006 | CN1780035A Electrode material, method of manufacturing the electrode material, electrode, and nonaqueous electrolyte battery |
| 05/30/2006 | US7052801 Anode thin film for lithium secondary battery and preparation method thereof |
| 05/26/2006 | WO2006055259A2 Lead-free solder alloy |
| 05/25/2006 | US20060110659 excellent in initial charge and discharge efficiency, discharge capacity per volume, and charge and discharge cycle characteristic |
| 05/24/2006 | CN1778000A Thermoelectric conversion material, thermoelectric conversion element using the material, and electric power generation method and cooling method using the element |
| 05/23/2006 | US7048813 Foil-form soldering metal and method for processing the same |
| 05/18/2006 | US20060104855 Lead-free solder alloy |
| 05/18/2006 | US20060104854 Lead-free solder, and a lead-free joint |
| 05/18/2006 | US20060102690 Lead-free solder and soldered article |
| 05/11/2006 | WO2006049024A1 High temperature lead-free solder and package for storing semiconductor element |
| 05/10/2006 | CN1770512A Anode active material and battery using it |
| 05/10/2006 | CN1255890C Electrode material for lithium secondary cell cathode and its application |
| 05/09/2006 | US7042327 Alloy type thermal fuse and wire member for a thermal fuse element |
| 05/04/2006 | US20060090819 Tin plating method |
| 05/04/2006 | DE19916618B4 Verwendung eines bleifreien Lötmittels Use of lead-free solder |
| 05/03/2006 | CN1767921A Phase change lead-free super plastic solders |
| 05/03/2006 | CN1254347C Solder alloy and soldered joint |
| 04/27/2006 | US20060088440 Pb-free solder alloy |
| 04/27/2006 | US20060088439 Solders |
| 04/20/2006 | WO2006040582A1 Solder alloy |
| 04/19/2006 | EP1647352A1 Solder material |
| 04/18/2006 | US7029760 Plated material and method of manufacturing the same, terminal member for connector, and connector |
| 04/18/2006 | US7029542 for forming solder bumps (flip chips) having high bonding strength and which do not undergo yellowing after soldering |
| 04/13/2006 | WO2006038907A2 Lead-free solder composition for substrates |
| 04/05/2006 | EP1643571A1 Anode active material and battery using it |
| 04/05/2006 | CN1248817C Soft brazing method |
| 04/04/2006 | US7022282 Lead-free solder and soldered article |
| 03/30/2006 | WO2006033304A1 Black material, black particle dispersion liquid, black light-blocking film using same, and base with black light-blocking film |
| 03/30/2006 | US20060068285 Anode active material and battery using it |
| 03/30/2006 | US20060067853 Lead free solder |
| 03/22/2006 | CN1749423A No-lead gold spraying material |
| 03/21/2006 | US7013564 Method of producing an electronic device having a PB free solder connection |
| 03/16/2006 | WO2006028668A1 Tin/indium lead-free solders for low stress chip attachment |
| 03/16/2006 | WO2006027403A1 Novel materials for the production of environmentally-friendly ammunition and other applications |
| 03/16/2006 | CA2580728A1 New materials for the production of ecological ammunition and their applications |
| 03/15/2006 | CN1747201A Production of negative material of high-capacity lithium-ion battery with tin-antimony-silicon alloy |
| 03/02/2006 | US20060045793 comprising copper, iron, gallium, tin and unavoidable impurities, used to prevent iron tips of soldering iron from deterioration |
| 02/22/2006 | CN1738694A Coating compositions for solder spheres, powders and preforms, methods of production and uses thereof |
| 02/22/2006 | CN1242869C 无铅焊料 Lead-free solder |
| 02/21/2006 | US7000823 Fluxless brazing |
| 02/15/2006 | EP1626099A2 Tin-bath for tin-plating supports for sliding bearings |
| 02/08/2006 | CN1730696A Tin-zinc-copper-nickel lead-free solder alloy |
| 02/08/2006 | CN1730695A Sn-Ag-Cu-Cr alloy lead-free solder preparation method |
| 02/08/2006 | CN1730694A Sn-Zn-Bi-Cr alloy lead-free solder preparation method |
| 02/08/2006 | CN1730693A Sn-Zn-Cr alloy lead-free solder preparation method |
| 02/02/2006 | US20060024194 Lead-free solder alloy and electronic component using this lead-free solder alloy |
| 02/02/2006 | US20060021466 Mixed alloy lead-free solder paste |
| 02/01/2006 | CN1239751C Ternary tin zinc alloy, electroplating solutions and galvanic method for producing ternary tin zinc alloy coatings |
| 02/01/2006 | CN1239291C Leadless welding flux |
| 02/01/2006 | CN1239290C Leadless soft brazing alloy for wave crest soldering |
| 01/19/2006 | US20060013722 Lead-free solder pastes with increased reliability |
| 01/19/2006 | US20060011702 Solder and packaging therefrom |
| 01/18/2006 | CN1237614C Metal electrical interconnection structure |
| 01/11/2006 | CN1718797A Tin silver copper nickel aluminium series leadless welding flux alloy |
| 01/11/2006 | CN1718796A Low melting point leadless welding flux alloy |
| 01/11/2006 | CN1235718C Tin-zinc base plumbum-free solder alloy and its preparing technology |
| 01/11/2006 | CN1235717C Non-lead solder, preparing process thereof and soldering method using same |
| 01/04/2006 | CN1234494C Micro fluid device and ultrasonic bonding process |
| 12/08/2005 | US20050269385 Soldering method and solder joints formed therein |
| 12/08/2005 | DE19750104B4 Verwendung einer Lotpaste für Chipkomponenten Using a solder paste for chip components |
| 12/07/2005 | CN1230567C Industrial pure tin with resistance to liquid surface oxidizing and application |
| 12/01/2005 | DE19827014B4 Belotungsverfahren Belotungsverfahren |
| 11/30/2005 | CN1703527A A lead-free solder, and a lead-free joint |
| 11/24/2005 | US20050260095 Lead-free solder alloy and preparation thereof |
| 11/23/2005 | EP1598142A1 Lead-free solder alloy and preparation thereof |
| 11/16/2005 | CN1698224A Anode active material and method for production thereof, non-aqueous electrolyte secondary cell using the same |
| 11/10/2005 | US20050248020 Lead-free solder ball |
| 11/09/2005 | EP1309447A4 Lead-free alloys with improved wetting properties |
| 11/08/2005 | US6963264 Alloy composition of 30-70% Sn, 0.3-20% Sb and a balance of Bi; nontoxic; lowered electrical resistance; improved thinning; a high operation accuracy; heat resistance stability to a heat cycle satisfactorily assured |
| 11/03/2005 | WO2005102594A1 Solder and mounted article using same |
| 11/03/2005 | DE10392947T5 Bleifreie Lötlegierung und bleifreier Anschluß Lead-free solder and lead-free connection |
| 11/01/2005 | US6960396 semiconductor; plated layer of tin-bismuth solder alloy on the lead; nontoxic; sufficient bonding strength and wettability; reduced whisker formation |
| 11/01/2005 | US6959853 aluminum-silicon clad aluminum brazing sheet composites; physical vapor deposition and layered sequencing of a metal substrate, eutectic-forming layer and braze-promoting layer; plasma or ion-cleaning minimizes environmental impact |
| 10/20/2005 | WO2005098979A1 THERMOELECTRIC MATERIAL USING ZrNiSn-BASED HALF HEUSLER STRUCTURES |
| 10/20/2005 | WO2005098931A1 Submount and manufacturing method thereof |
| 10/19/2005 | CN1224121C Electrode material for negative pole of lithium secondary cell and its use |
| 10/12/2005 | CN1681957A Sn-based metal-coated steel strip excellent in appearance and process for producing same |
| 10/12/2005 | CN1681620A Soldering filler metal, assembly method for semiconductor device using same, and semiconductor device |
| 10/12/2005 | CN1681618A Solder hierarchy for lead free solder joint |
| 10/06/2005 | US20050221110 Aluminum alloy which does not contain antimony, with antimony-silicon rich layer formed thereon having sliding surface; wear resistance |
| 10/06/2005 | US20050220661 Method of using an alloy type thermal fuse, and alloy type thermal fuse |
| 10/06/2005 | US20050218525 Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device |
| 10/06/2005 | US20050217715 thermoelectric material having a higher ZT value, ZT value is "dimensionless figure of merit" and therefore has higher thermoelectric conversion efficiency; specified metallic compound with little or no toxic metals such as lead |
| 10/05/2005 | EP1583125A1 Method of using an alloy type thermal fuse, and alloy type thermal fuse |
| 10/05/2005 | EP1582287A1 Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device |
| 10/05/2005 | CN1678428A Brazing product and method of manufacturing a brazing product |
| 10/05/2005 | CN1677596A Method of using an alloy type thermal fuse, and alloy type thermal fuse |
| 09/29/2005 | WO2005090622A1 Lead free solder alloy |
| 09/28/2005 | CN1673401A Low temperature leadless alloy |
| 09/27/2005 | US6949312 Electrode material for anode of rechargeable lithium battery, electrode structural body using said electrode material, rechargeable lithium battery using said electrode structural body, process for producing said electrode structural body, and process for producing said rechargeable lithium battery |
| 09/22/2005 | US20050208378 Negative active material and method for production thereof, non-aqueous electrolyte secondary cell using the same |
| 09/15/2005 | US20050199679 Sn-ag based lead-free solder |
| 08/31/2005 | CN1216715C Solder material and electric or electronic device using same |
| 08/30/2005 | US6936219 Lead-free Tin-Zinc alloy that contains Manganese and is suitable for use as a solder with commercially available fluxes; Various types of solders can be prepared from the alloy, like wire, cored wire, atomized powder, solder paste, thin sheet |
| 08/25/2005 | WO2005078823A1 Plated steel sheet for battery container, battery container using such plated steel sheet, and battery using such battery container |
| 08/25/2005 | WO2005077583A1 Soldering method |
| 08/24/2005 | EP1566083A2 Coating compositions for solder spheres, powders and preforms, methods of production and uses thereof |
| 08/24/2005 | CN1658998A Solder and packaging therefrom |
| 08/16/2005 | US6928731 Ultrasonic bonding process for making a microfluid device |