| Patents for C22C 13 - Alloys based on tin (1,972) |
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| 03/31/2010 | CN101689413A Electroconductive fine particles, anisotropic electroconductive material, and connection structure |
| 03/24/2010 | CN101680482A Slide bearing |
| 03/23/2010 | US7682468 Lead-free solder alloy |
| 03/17/2010 | EP2163340A1 Improvements in fluxless brazing |
| 03/17/2010 | CN101675558A Anisotropic electroconductive material |
| 03/17/2010 | CN101671784A Sn-Ag-Cu lead-free brazing alloy |
| 03/17/2010 | CN100594247C Leadless metal spraying material for capacitor |
| 03/16/2010 | CA2272193C Improved thermoelectric module and method of manufacturing the same |
| 03/11/2010 | US20100059576 Tin alloy solder composition |
| 03/02/2010 | US7670548 Lead free solder containing Sn, Ag and Bi |
| 02/17/2010 | CN100590213C Welding alloy for sputtering target production and sputtering target |
| 02/17/2010 | CN100589918C Solder and circuit basal plate using the same |
| 02/11/2010 | US20100031848 Alloy nanoparticles of sn-cu-ag, preparation method thereof and ink or paste using the alloy nanoparticles |
| 02/03/2010 | CN101638738A Optimized indium-sn-bismuth-amalgam |
| 01/27/2010 | EP2147740A1 Lead-free solder paste |
| 01/06/2010 | EP2140963A1 Pb-free solder-connected electronic article |
| 01/06/2010 | CN100577343C Lead-free solder alloy |
| 12/30/2009 | EP2139009A1 Electroconductive fine particles, anisotropic electroconductive material, and electroconductive connection structure |
| 12/30/2009 | CN101612694A Solder, and mounted components using the same |
| 12/17/2009 | WO2009151123A1 Method for joining substrate and object to be mounted using solder paste |
| 12/16/2009 | EP2133580A1 Slide bearing |
| 12/16/2009 | CN101604668A Pb-free solder-connected structure and electronic device |
| 12/10/2009 | US20090304545 Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member |
| 12/09/2009 | EP2131450A1 Anisotropic electroconductive material |
| 12/09/2009 | EP1908139B1 Alloy compositions for lithium ion batteries |
| 12/09/2009 | CN100566912C Leadless soft soldering material |
| 12/09/2009 | CN100566911C Leadless soft soldering material |
| 12/08/2009 | US7628308 Method of replenishing an oxidation suppressing element in a solder bath |
| 12/02/2009 | CN100565715C Conductive ball, method of forming electrode of electronic part, electronic part and electronic equipment |
| 12/02/2009 | CN100563974C Method for forming piezoelectric ceramic pattern |
| 11/26/2009 | US20090289102 SOLDER FREE FROM LEAD FOR ADDITIONAL SUPPLY AND METHOD OF REGULATING Cu CONCENTRATION AND Ni CONCENTRATION IN SOLDER BATH |
| 11/25/2009 | EP1446260B1 Method for manufacturing an article of manufacture for use in a fluxless brazing process. |
| 11/25/2009 | EP1039568B1 Electrode material for negative pole of lithium secondary cell, electrode structure using said electrode material, lithium secondary cell using said electrode structure, and method for manufacturing said electrode structure and said lithium secondary cell |
| 11/25/2009 | CN100562593C Transitional alloy layer for bearing alloy casting and its preparation method |
| 11/18/2009 | CN101580905A Sliding bearing alloy and preparation method thereof |
| 11/11/2009 | CN101577332A Lithium ion battery negative electrode material and preparation method thereof |
| 11/11/2009 | CN101577322A Copper-core pillar dipped with lead-tin alloy |
| 11/11/2009 | CN101575680A Lead-free solder alloy |
| 10/29/2009 | WO2009131178A1 Lead-free solder alloy suppressed in occurrence of shrinkage cavity |
| 10/29/2009 | WO2009131114A1 Lead-free solder |
| 10/21/2009 | CN101563185A Lead-free soft solder having improved properties at elevated temperatures |
| 10/20/2009 | US7604897 Nonaqueous electrolyte battery having a La3Co2Sn7 type crystal structure |
| 10/14/2009 | CN100549196C Method for preparing tin-base bearing alloy |
| 10/08/2009 | WO2009122912A1 Solder structure, method for forming solder structure, semiconductor module comprising solder structure, and portable device |
| 10/07/2009 | CN101549357A Toba and preparation method thereof |
| 09/24/2009 | US20090236013 Method for increasing the effectiveness of a component of a material |
| 09/23/2009 | EP2101951A1 Pb-free solder alloy |
| 09/17/2009 | WO2009111932A1 Lead-free high-temperature electronic solder and preparing method thereof |
| 09/17/2009 | US20090232696 Lead-free solder alloy |
| 09/16/2009 | EP2099580A1 Soldering filler metal, assembly method for semiconductor device using same, and semiconductor device |
| 09/16/2009 | CN100540206C Solder and mounted article using same |
| 09/11/2009 | WO2009110484A1 Non-aqueous electrolyte secondary battery and combined battery |
| 09/11/2009 | WO2009108975A1 Plain bearing alloy consisting of a tin-based white metal |
| 09/09/2009 | EP2097254A1 Sliding bearing |
| 09/09/2009 | CN101524794A Zinc granule reinforced tin-argentum- zinc composite solder and preparation method thereof |
| 09/02/2009 | CN100535145C Low temperature amalgam suitable to round arranged machine |
| 09/02/2009 | CN100534699C Lead-free welding flux alloy |
| 08/27/2009 | WO2009104294A1 Lead-free solder alloy and semiconductor device |
| 08/26/2009 | EP2092560A1 Lead-free solder alloy for printed circuit board assemblies for high-temperature environments |
| 08/20/2009 | US20090208363 Solder alloy for oxide bonding |
| 08/19/2009 | CN101508062A Lead-free solder alloy |
| 08/11/2009 | US7572552 a positive electrode; a negative electrode containing an alloy having a CeNiSi2 type crystal structure; a nonaqueous electrolyte; excellent in both the charge-discharge cycle life |
| 08/06/2009 | US20090197115 Tin-silver coatings |
| 08/06/2009 | US20090197103 Modification of pb-free solder alloy compositions to improve interlayer dielectric delamination in silicon devices and electromigration resistance in solder joints |
| 08/06/2009 | US20090196789 Solder alloy, solder ball and electronic member having solder bump |
| 08/05/2009 | CN101501807A Mercury releasing method |
| 08/05/2009 | CN101500744A Cream solder and method of soldering electronic part |
| 08/05/2009 | CN100524907C Anode active material and battery using the same |
| 08/05/2009 | CN100524899C Anode material and battery using the same |
| 07/29/2009 | CN201280585Y Vortex column nozzle and vortex column smelting unit |
| 07/22/2009 | CN100517857C 电池 Battery |
| 07/15/2009 | CN100514724C Anode active material and battery using it |
| 07/15/2009 | CN100513641C Environmentally friendly surface treated steel sheet for electronic parts |
| 07/08/2009 | EP1824638A4 Pb free solder alloy |
| 06/18/2009 | WO2009075314A1 Solder alloy and process for producing the same |
| 06/17/2009 | EP2070637A1 Product and method for low temperature fluxless brazing |
| 06/17/2009 | EP2069101A1 Lead-free soft solder having improved properties at elevated temperatures |
| 06/10/2009 | CN100497693C Improvements in or relating to solders |
| 06/03/2009 | CN100494436C Low melting point leadless welding flux alloy |
| 05/27/2009 | CN101441974A Solder, external electrode fluorescent lamp and liquid crystal display device |
| 05/27/2009 | CN100492727C Anode active material and method for production thereof, non-aqueous electrolyte secondary cell using the same |
| 05/27/2009 | CN100491557C Bearing of motor driven fuel pump |
| 05/27/2009 | CN100491054C Leadless soft soldering material |
| 05/26/2009 | US7537728 Method for increasing the effectiveness of a component of a material |
| 05/21/2009 | US20090129970 Pb free solder alloy |
| 05/20/2009 | CN101435036A Automobile fuel saving alloy according with environment protection requirement |
| 05/19/2009 | US7534528 comprises glassy alloy on current collector; high capacity; improved charging/discharging |
| 05/13/2009 | EP1531025B1 Tin-zinc lead-free solder and solder-joined part |
| 05/06/2009 | CN100484686C Method for producing leadless welding flux delamination structure |
| 04/29/2009 | CN101420835A Low melting point alloy thermal interface material |
| 04/28/2009 | CA2377689C Method of plugging a hole and a cooling element manufactured by said method |
| 04/23/2009 | WO2009051255A1 Solder joint |
| 04/23/2009 | WO2009051240A1 Lead-free soft solder |
| 04/23/2009 | WO2009051181A1 Lead-free solder alloy |
| 04/23/2009 | US20090104071 1.0% Of magnesium, 44.25-60% bismith and the balance being tin and impurities; low melting point for bonding glass and ceramics; high bonding strength; lead-free and environmentally friendly; hermetic sealing; precision electronic parts; simplification processing; cost efficiency |
| 04/16/2009 | US20090098012 High-Purity Tin or Tin Alloy and Process for Producing High-Purity Tin |
| 04/15/2009 | EP2047943A2 Cream solder and method of soldering electronic part |
| 04/08/2009 | CN101403057A Method for producing tin base alloy |
| 04/08/2009 | CN100475996C Compositions, methods and devices for high temperature lead-free solder |
| 04/07/2009 | US7514154 Exhibits good work adhesion between the steel blank and the organic resin film even when the thickness is reduced due to a severe working such as flanging and necking; chromium free; cans with good corrosion resistance |