Patents
Sitemap › C22 - Metallurgy; Ferrous or non-ferrous alloys; Treatment of alloys or non-ferrous metals › C22C - Alloys › C22C 13 - Alloys based on tin
Patents for C22C 13 - Alloys based on tin (1,972)
02/2004
02/05/2004WO2004011188A1 Brazing product and method of manufacturing a brazing product
02/05/2004CA2493037A1 Brazing product and method of manufacturing a brazing product
02/04/2004CN1472764A Alloy temperature fuse and wire material therefor
01/2004
01/15/2004WO2004004967A1 Solder and packaging therefrom
01/15/2004US20040007384 Electronic device
01/14/2004EP1381066A2 Alloy type thermal fuse and wire member for a thermal fuse element
01/14/2004CN1468327A Ternary tin zinc alloy, electroplating solutions and galvanic method for producing ternary tin zinc alloy coatings
01/13/2004US6677056 Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the plating film
01/08/2004WO2004002674A1 Sn-Ag BASED LEAD-FREE SOLDER
01/08/2004WO2003081702A3 Fuel cell catalyst containing pt and rh and at least one of w, sn and cu and optionally mo.
01/02/2004EP1375689A1 Member having separation structure and method for manufacture thereof
12/2003
12/24/2003WO2003070994A3 Lead-free tin-silver-copper alloy solder composition
12/18/2003US20030231815 Bearings for C02 refrigerant compressor use, compressor using the same, and applications of the same
12/18/2003US20030230361 Lead-free solder alloy and lead-free solder paste using the same
12/10/2003CA2389446A1 Pb-free solder alloy compositions comprising essentially sn, ag, cu, and/or p
12/09/2003US6660226 Lead free solder and soldered article
12/03/2003EP1366338A1 Shotgun shot, pellets and bullets
12/02/2003US6656291 Sn-Bi solder powder; acid anhydride activating agent
11/2003
11/27/2003US20030219623 Solder joints with low consumption rate of nickel layer
11/26/2003EP1365459A2 Galvanic element
11/26/2003EP1364074A2 Constrained filament niobium-based superconductor composite and process of fabrication
11/19/2003EP1362932A1 Environmentally friendly surface treated steel sheet for electronic parts excellent in soldering wettability and resistance to rusting and formation of whisker
11/19/2003CN1128037C Rare earth contained tin base lead-less solder and its preparation method
11/18/2003US6649833 Negative volume expansion lead-free electrical connection
11/18/2003US6649127 Lead-free; tin alloy
11/18/2003US6648210 Tombstoning susceptibility and reflow peak temperature reduction; printed circuit boards; mixing with a SnBi alloy powder, which is lower melting to produce a Cu, Ag, Sb, Sn, Bi alloy
11/13/2003US20030211387 Galvanic element
11/12/2003CN1455126A Bearing for carbon dioxide refrigrant compressor, compressor using said bearing and use thereof
11/04/2003US6641930 Electrically conductive metal tape and plug connector
10/2003
10/30/2003US20030201310 Packaging method using lead-free solder
10/29/2003EP1357293A2 Bearing for CO2 refrigerant compressor
10/28/2003US6638643 Electrically conductive metal tape and plug connector made of it
10/23/2003WO2003086619A1 Surface reactor
10/23/2003US20030197050 Fluxless brazing method and compositions of layered material systems for brazing aluminum or dissimilar metals
10/09/2003US20030189082 Alloy composition and method for low temperature fluxless brazing
10/08/2003CN1447638A Welding method and welded parts
10/08/2003CN1447458A Cell
10/07/2003US6630251 Containing tin and lead with copper and/or nickel
10/02/2003WO2003081702A2 Fuel cell catalyst containing pt and rh and at least one of w, sn and cu and optionally mo.
10/01/2003CN1445048A Solder without lead and paste solder composite
09/2003
09/25/2003US20030178101 Lead-free solder, and paste solder composition
09/24/2003CN1444273A 电子装置 Electronic devices
09/24/2003CN1443626A Leadless welding flux with optimum informance and price ratio
09/22/2003CA2380704A1 Environmental friendly lead-free fishing, diving and net weight alloys
09/18/2003WO2003076183A1 Resin coated steel sheet and can formed by pressing the same
09/17/2003CN1442272A Leadless soft brazing alloy for wave crest soldering
09/17/2003CN1442271A Leadless soft brazing alloy
09/11/2003US20030168499 Soldering method and solder joint member
09/11/2003US20030168341 Applying functional alloy plating to an electronic component to be mounted using an electrolytic procedure with a pulse waveform, functional alloy plating comprising tin and silver
09/11/2003US20030168333 Metal or metal alloy based sputter target and method for the production thereof
09/11/2003US20030168123 Changes in quality by aging are very small and can resist to preheating under high temperature
09/10/2003EP1342726A1 Solder precipitating composition and solder precipitation method
09/10/2003CN1440854A Separated out type soldering tin composition and soldering separating out method
09/04/2003US20030164214 Foil-form soldering metal and method for processing the same
08/2003
08/28/2003WO2003071621A2 Fuel cell electrocatalyst of pt-mo-ni/fe/sn/w
08/28/2003WO2003070994A2 Lead-free tin-silver-copper alloy solder composition
08/28/2003US20030159761 Tin, silver, copper alloy
08/27/2003EP1337377A1 Solder material and electric or electronic device in which the same is used
08/27/2003CN1119204C Reduced catalyst composition, its preparing method and use
08/21/2003US20030156969 Coupling electroconductive pads
08/21/2003US20030156395 Electronic component and method of manufacturing same
08/21/2003US20030155409 Fluxless brazing
08/13/2003EP1333957A1 Lead-free solders
08/06/2003EP1332831A1 Alloy for solder and solder joint
08/06/2003CN1117166C Plain bearing
07/2003
07/31/2003WO2003061897A1 Lead-free solder material
07/31/2003WO2003061896A1 Solder alloy and soldered joint
07/31/2003US20030143104 Solder alloy and soldered bond
07/31/2003US20030141192 Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied
07/23/2003CN1115225C Leadless solder and welding product
07/22/2003US6596094 Solder alloy particle scattered or mixed in the flux including Sn and Zn; metal particle scattered or mixed in the flux and including an element in the IB group
07/17/2003US20030133826 Lead-free solder
07/08/2003US6589372 Plain bearing producing method
07/03/2003WO2003053686A1 Low pressure coated article with polymeric basecoat having the appearance of stainless steel
07/03/2003US20030121564 Tin, zinc alloy mixed with flux
07/01/2003US6585149 Packaging method using lead-free solder
06/2003
06/26/2003WO2003051572A1 Lead-free soft solder
06/19/2003WO2003050920A1 Contact terminal with doped coating
06/19/2003US20030113589 Low pressure coated article with polymeric basecoat having the appearance of stainless steel
06/18/2003EP1319093A2 Ternary tin zinc alloy, electroplating solutions and galvanic method for producing ternary tin zinc alloy coatings
06/18/2003CN1111656C Bearing liners and their manufacture
06/11/2003EP1317991A2 Solder paste
06/11/2003CN1422723A 焊锡膏 Paste
06/05/2003WO2003045619A1 Alloy composition and method for low temperature fluxless brazing
06/05/2003WO2003045618A1 Fluxless brazing method and compositions of layered material systems for brazing aluminum or dissimilar metals
06/05/2003CA2736641A1 Products and compositions of layered material systems for fluxless brazing of aluminum or dissimilar metals
06/04/2003EP0878265B1 Solder, solder paste and soldering method
05/2003
05/30/2003WO2003043777A1 Improvements in fluxless brazing
05/30/2003CA2779474A1 Improvements in fluxless brazing
05/29/2003US20030098338 Methods for fluxless brazing
05/15/2003US20030088981 Microfluid device and ultrasonic bonding process
05/14/2003EP1309447A1 Lead-free alloys with improved wetting properties
05/01/2003US20030082398 Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the plating film
04/2003
04/15/2003US6548187 Sn based alloy containing Sn—Ti compound, and precursor of Nb3SN superconducting wire
04/10/2003WO2003030199A1 Fuse element and method for making same
04/09/2003EP1300867A1 Fuse link and method of manufacture
04/09/2003CN1104991C Leadless alloy for solderin flux
04/02/2003CN1407141A Tinplating
03/2003
03/27/2003US20030059644 Multilayer; tin diffusion barrier
03/12/2003CN1401813A Tin-silver coating
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