Patents for C22C 13 - Alloys based on tin (1,972) |
---|
02/07/2007 | CN1298489C Fluxless brazing method and compositions of layered material systems for brazing aluminum or dissimilar metals |
02/06/2007 | US7173188 Straight angle conductor and method of manufacturing the same |
02/06/2007 | US7172726 Lead-free solder |
02/01/2007 | WO2006122240A3 Tin alloy solder compositions |
01/31/2007 | CN1298051C Semiconductor device |
01/30/2007 | US7170028 Continuous metal matrix composite consolidation |
01/25/2007 | WO2007010927A1 SOLDER FREE FROM LEAD FOR ADDITIONAL SUPPLY AND METHOD OF REGULATING Cu CONCENTRATION AND Ni CONCENTRATION IN SOLDER BATH |
01/18/2007 | WO2007007840A1 Solder alloy for oxide bonding |
01/18/2007 | US20070013472 Current fuse and method of making the current fuse |
01/18/2007 | US20070012750 Current fuse and method of making the current fuse |
01/17/2007 | EP1399600B1 Compositions, methods and devices for high temperature lead-free solder |
01/17/2007 | CN1897789A Semiconductor device |
01/17/2007 | CN1295783C 电子装置 Electronic devices |
01/17/2007 | CN1295054C Sn-Ag-Cu-X eutectic alloy leadless welding materials for electronic elements |
01/16/2007 | US7164096 Continuous metal matrix composite consolidation |
01/11/2007 | WO2007004394A1 High-purity tin or tin alloy and process for producing high-purity tin |
01/09/2007 | CA2162613C Friction bearing alloy |
01/04/2007 | WO2007001598A2 Lead-free semiconductor package |
01/03/2007 | CN1293676C Conductive metal band and plug-in connector |
12/26/2006 | US7153591 Sliding member |
12/21/2006 | US20060285994 High resistance to electrode leaching; cobalt, silver, copper, and tin |
12/20/2006 | EP1406745B1 Soldering flux vehicle additive |
12/20/2006 | CN1880493A Tin-base bearing alloy and method for preparing same |
12/20/2006 | CN1880492A Welding alloy for sputtering target production and sputtering target |
12/12/2006 | US7148426 Lead-free solder, and connection lead and electrical component using said lead-free solder |
12/12/2006 | US7147933 For electrical or electronic connectors such as contacts or terminals used in automotive applications, consisting of preferably from 3.0 wt % to 10 wt %, silver and the balance tin, applied by immersing the substrate material in a molten tin-silver bath; long cycle life; economical |
12/07/2006 | WO2006129713A1 Lead-free solder alloy |
12/07/2006 | US20060275663 Negative electrode active material and nonaqueous electrolyte secondary battery |
11/30/2006 | US20060266446 Whisker-free electronic structures |
11/23/2006 | US20060263689 Anode active material and battery |
11/23/2006 | US20060263235 Solder alloy and a semiconductor device using the solder alloy |
11/23/2006 | US20060263234 Tin alloy solder compositions |
11/23/2006 | DE102006005271A1 Lötlegierung und eine unter Verwendung derselben hergestellte Halbleitervorrichtung Solder alloy and a semiconductor device produced by using the same |
11/22/2006 | EP1724050A1 Solder paste |
11/22/2006 | CN1866587A Preparation method for high-capacity Sn-Ni alloy compound as lithium ion battery negative electrode material |
11/22/2006 | CN1865468A Method for preparing high content stannum-cobalt alloy lithium ion battery cathode material |
11/21/2006 | US7138086 Soldering alloy |
11/16/2006 | WO2006122240A2 Tin alloy solder compositions |
11/16/2006 | CA2607286A1 Tin alloy solder compositions |
11/09/2006 | WO2006118183A1 Tin powder-containing colloidal liquid and method for producing same |
11/08/2006 | CN1284197C Alloy temperature fuse and wire material therefor |
11/08/2006 | CN1283820C High plasticity tin-based material for metal ornaments |
11/07/2006 | US7132020 Solder for use on surfaces coated with nickel by electroless plating |
11/07/2006 | US7131566 Packaging method using lead-free solder |
11/02/2006 | US20060243256 Surface reactor |
11/02/2006 | EP1716264A2 Lead-free solder composition for substrates |
10/31/2006 | US7128528 Bearings for CO2 refrigerant compressor use, compressor using the same, and applications of the same |
10/26/2006 | US20060239855 Reflow soldering method using Pb-free solder alloy and hybrid packaging method and structure |
10/18/2006 | EP1711334A2 Method for the production of fibre-reinforced plastic pieces and device therefor |
10/18/2006 | EP1048392B1 Pb-FREE SOLDER-CONNECTED STRUCTURE AND ELECTRONIC DEVICE |
10/18/2006 | CN1848514A 电池 Battery |
10/05/2006 | US20060222958 Battery |
10/05/2006 | US20060222559 electrical conductors having improved microstructural stability and reduced formation of slags, when soldering |
10/04/2006 | EP1707302A2 Pb-free solder alloy compositions comprising essentially tin (Sn), silver (Ag), copper (Cu), and phosphorus (P) |
09/27/2006 | EP1705258A2 Composition, methods and devices for high temperature lead-free solder |
09/26/2006 | US7111771 Doped tin-indium; superplasticity; microelectronics; for use in computers, wireless communicators, hand-held devices, automobiles, locomotives, aircraft, watercraft, and spacecraft |
09/21/2006 | US20060210420 Sn-zn lead-free solder alloy, its mixture, and soldered bond |
09/20/2006 | CN1275734C Lead-less joining material and joining method using such material |
09/14/2006 | US20060204397 Sn-zn lead-free solder alloy, and solder junction portion |
09/13/2006 | CN1832058A Precursor for fabricating nb*sn superconducting wire, and nb*sn superconducting wire, and method for fabricating the same |
08/31/2006 | US20060193744 Lead-free solder system |
08/30/2006 | CN1826664A Conductive ball, method of forming electrode of electronic part, electronic part and electronic equipment |
08/29/2006 | US7097090 Solder ball |
08/24/2006 | WO2006088690A2 Method and arrangement for thermally relieved packages with different substrates |
08/23/2006 | CN1820889A Non low eutectic lead free solder composition |
08/23/2006 | CN1271645C Plated material and method of manufacturing the same, terminal member for connector, and connector |
08/17/2006 | US20060180639 Method and arrangement for thermally relieved packages with different substrates |
08/16/2006 | CN1818110A Lead-free golden-plating materials |
08/16/2006 | CN1818107A Solid mercury with high content |
08/09/2006 | EP1554410A4 Friction-resistant alloy for use as a bearing |
08/08/2006 | US7087315 Method for forming plating film |
08/03/2006 | WO2006080289A1 Electrically conductive fine particles and anisotropic electrically conductive material |
08/02/2006 | EP1685586A2 Anti-tombstoning lead free alloys for surface mount reflow soldering |
08/02/2006 | EP1453636B1 Lead-free soft solder |
08/02/2006 | CN1267243C Soldering tin paste |
08/01/2006 | CA2314116C Pb-free solder-connected structure and electronic device |
07/27/2006 | WO2006077826A1 Bearing of motor driven fuel pump |
07/19/2006 | EP1681131A1 Semiconductor device |
07/13/2006 | US20060151580 Coating compositions for solder spheres, powders and preforms, methods of production and uses thereof |
07/12/2006 | EP1679149A1 Lead-free solder ball |
07/11/2006 | US7075183 Electronic device |
07/06/2006 | WO2006070797A1 LEAD-FREE SOLDER FLUX and SOLDER PASTE |
07/06/2006 | US20060147337 Solder composition |
07/06/2006 | US20060145352 Electronic device |
07/06/2006 | DE102004030017B4 Gleitelement Slider |
07/05/2006 | CN1263201C Conductive metal band and plug-in connector made therefrom |
07/05/2006 | CN1262389C Soldering flux additive |
07/04/2006 | US7070736 Sn-Zn lead-free solder alloy and soldered bond |
06/28/2006 | CN1795280A Temperature fuse element, temperature fuse and battery using the same |
06/28/2006 | CN1261701C Bearing for carbon dioxide refrigerant compressor, compressor using said bearing and use thereof |
06/22/2006 | WO2006064880A1 Seal material, image display device using seal material, method of producing image display device, and image display device produced by the production method |
06/21/2006 | CN1789454A Ti-containing Sn-based alloy and its smelting preparation method |
06/21/2006 | CN1260042C Low silver lead-free solder |
06/14/2006 | CN1786221A Preparation method of high capacity tin antimony nickel alloy complex lithium ion battery cathode material |
06/14/2006 | CN1259678C Electronic component, and electronic apparatus in which the electronic component is mounted and its manufacturing method |
06/08/2006 | WO2006059115A1 Solder alloy |
06/08/2006 | US20060120911 Method of forming composite solder by cold compaction and composite solder |
06/08/2006 | CA2589259A1 Solder alloy |
06/01/2006 | US20060115994 Pb-free solder-connected structure and electronic device |
06/01/2006 | US20060115734 Anode active material and battery using the same |