| Patents for C22C 13 - Alloys based on tin (1,972) |
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| 08/11/2005 | US20050175901 Electrode material for anode of rechargeable lithium battery, electrode structural body using said electrode material, rechargeable lithium battery using said electrode structural body, process for producing said electrode structural body, and process for producing said rechargeable lithium battery |
| 08/11/2005 | US20050172994 Thermoelectric material and thermoelectric element |
| 08/04/2005 | US20050167827 Solder alloy and semiconductor device |
| 08/02/2005 | US6924044 Tin-silver coatings |
| 08/02/2005 | US6923875 Tin, silver, copper alloy |
| 07/27/2005 | EP1557476A1 Low melting point alloy of tin, bismuth and antimony for fusible elements of low voltage fuses |
| 07/27/2005 | EP1557235A1 Lead-free solder and soldered article |
| 07/27/2005 | CN1644729A High plasticity tin-based material for metal ornaments |
| 07/27/2005 | CN1644301A Low melting point tin-zinc solder without lead and soldering paste |
| 07/26/2005 | CA2288817C Lead free solder alloy |
| 07/21/2005 | US20050158529 Tin-silver coatings |
| 07/20/2005 | EP1554410A1 Friction-resistant alloy for use as a bearing |
| 07/14/2005 | US20050153157 Exhibits good work adhesion between the steel blank and the organic resin film even when the thickness is reduced due to a severe working such as flanging and necking; chromium free; cans with good corrosion resistance |
| 07/12/2005 | US6917118 Semiconductor device |
| 07/07/2005 | US20050145997 Layer sequence for producing a composite material for electromechanical components |
| 07/06/2005 | EP1483419A4 Lead-free tin-silver-copper alloy solder composition |
| 07/05/2005 | US6913184 Alloy composition and method for low temperature fluxless brazing |
| 06/29/2005 | EP1545826A2 Solder hierarchy for lead free solder joint |
| 06/29/2005 | CN1633513A Lead-free tin-silver-copper alloy solder composition |
| 06/23/2005 | DE202005006151U1 Lead-free, tin-based solder alloy for electrical and electronic components, is doped with specified quantity of phosphorus |
| 06/21/2005 | US6908693 Sn-based metal-coated steel strip excellent in appearance and process for producing same |
| 06/15/2005 | EP1540027A1 Sn-based metal-coated steel strip excellent in appearance and process for producing same |
| 06/09/2005 | US20050124233 Contact terminal with doped coating |
| 06/07/2005 | US6902102 Soldering method and solder joint member |
| 05/26/2005 | WO2005048303A2 Anti-tombstoning lead free alloys for surface mount reflow soldering |
| 05/19/2005 | US20050106060 Lead-free solder balls and method for the production thereof |
| 05/19/2005 | US20050106059 Controlled melting; silver with silver or copper; reduced expansion; stress relieving |
| 05/18/2005 | EP1531025A1 Tin-zinc lead-free solder and solder-joined part |
| 05/18/2005 | EP1531024A1 Tin-zinc lead-free solder, its mixture, and solder-joined part |
| 05/17/2005 | US6893512 For use in electric or electronic device |
| 05/17/2005 | US6892925 Solder hierarchy for lead free solder joint |
| 05/12/2005 | US20050100474 Anti-tombstoning lead free alloys for surface mount reflow soldering |
| 05/11/2005 | CN1615204A Alloy composition and method for low temperature fluxless brazing |
| 05/11/2005 | CN1615203A Improvements in fluxless brazing |
| 05/11/2005 | CN1613597A Tin and silver co-crystal solder without lead against oxidation |
| 05/04/2005 | EP1526943A1 Brazing product and method of manufacturing a brazing product |
| 05/04/2005 | EP1399600A4 Compositions, methods and devices for high temperature lead-free solder |
| 04/27/2005 | EP1337377B1 Solder material and electric or electronic device in which the same is used |
| 04/27/2005 | EP1332831B1 Alloy for solder and solder joint |
| 04/27/2005 | CN1610993A Contact terminal with doped coating |
| 04/27/2005 | CN1610600A Tin-zinc lead-free solder and solder-joined part |
| 04/27/2005 | CN1610599A Tin-zinc lead-free solder, its mixture, and solder-joined part |
| 04/26/2005 | US6884389 For mounting an electronic part to a printed wiring substrate |
| 04/26/2005 | US6883698 Planting device for planting solder balls onto a chip |
| 04/20/2005 | EP1333957B1 Lead-free solders |
| 04/20/2005 | CN1607990A Fluxless brazing method and compositions of layered material systems for brazing aluminum or dissimilar metals |
| 04/14/2005 | US20050079092 Pb-free solder alloy, and solder material and solder joint using same |
| 04/13/2005 | CN1605427A Pb-free solder alloy, and solder material and solder joint using same |
| 04/06/2005 | CN1604832A 无铅软焊料 Lead-free solder |
| 04/05/2005 | US6875332 Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied |
| 03/31/2005 | US20050069725 Comprising tin and silver as well as an additive having a low coefficient of thermal expansion such as fused silica or zirconium oxide to combat thermal shock; for soldering to glass or ceramic substrates such as automobile windows |
| 03/31/2005 | US20050067189 joining electronic terminals plated with lead-free metals; semiconductors; printed circuits |
| 03/30/2005 | EP1518635A1 Sn-Ag BASED LEAD-FREE SOLDER |
| 03/16/2005 | CN1192850C Leadless soldering tin alloy |
| 02/24/2005 | US20050042868 Method for forming plating film |
| 02/24/2005 | US20050040926 Fuse element and method for making same |
| 02/24/2005 | US20050039943 Straight angle conductor and method of manufacturing the same |
| 02/24/2005 | DE102004030018A1 Gleitelement Slider |
| 02/24/2005 | DE102004030017A1 Gleitelement Slider |
| 02/23/2005 | CN1583352A Sn-Ag-Cu-X eutectic alloy leadless welding materials for electronic elements |
| 02/17/2005 | US20050035841 Current fuse and method of making the current fuse |
| 02/15/2005 | US6854636 Structure and method for lead free solder electronic package interconnections |
| 02/10/2005 | US20050031483 Chromium alloy with tin, zinc, bismuth, and/or indium, and another metal component for regulating the bonding capability so that the solder can be used to bond various metallic materials and non-metallic materials |
| 02/09/2005 | CN1188241C Alloy for solder and solder joint |
| 02/02/2005 | CN1574426A Anode material and battery using the same |
| 01/26/2005 | CN1571210A Nonaqueous electrolyte secondary battery |
| 01/26/2005 | CN1570166A Lead free solder alloy and its preparation method |
| 01/18/2005 | US6843862 Alloy of tin, silver, indium, copper |
| 01/13/2005 | US20050008525 Lead-free soft solder |
| 01/13/2005 | US20050005736 Controlling concentration; solder alloy melt |
| 01/12/2005 | EP1495830A1 Solder alloy and soldered joint |
| 01/04/2005 | US6837947 Lead-free solder |
| 12/30/2004 | US20040265691 Cycle stability; laminated disk shaped anode, cathode with separator in packages; iron, tin, silicon alloy |
| 12/30/2004 | US20040265618 Sliding member |
| 12/30/2004 | US20040264820 Sliding member |
| 12/30/2004 | US20040261833 Half-Heusler alloy; performance |
| 12/29/2004 | EP1492179A2 Anode material and battery using the same |
| 12/23/2004 | US20040258993 a positive electrode; a negative electrode containing an alloy having a CeNiSi2 type crystal structure; a nonaqueous electrolyte; excellent in both the charge-discharge cycle life |
| 12/22/2004 | EP1488880A2 Solder joint structure, soldering method, and electronic-component manufacturing apparatus using the same structure and the method |
| 12/22/2004 | CN1555961A Composite solder ball and its preparation method |
| 12/22/2004 | CN1555960A Tin zinc copper leadless solder alloy |
| 12/22/2004 | CN1555958A Low melting point rare earth oxide reinforced composite leadless solder butter |
| 12/16/2004 | US20040253474 Solder joint structure, soldering method, and electronic-component manufacturing apparatus using the same structure and the method |
| 12/08/2004 | EP1484174A1 Resin coated steel sheet and can formed by pressing the same |
| 12/08/2004 | EP1483419A2 Lead−free tin−silver−copper alloy solder composition |
| 12/02/2004 | WO2004105053A1 Conductive ball, method of forming electrode of electronic part, electronic part and electronic equipment |
| 12/02/2004 | WO2003071621A3 Fuel cell electrocatalyst of pt-mo-ni/fe/sn/w |
| 12/02/2004 | US20040241039 High temperature lead-free solder compositions |
| 12/02/2004 | US20040237304 Ultrasonic bonding process for making a microfluid device |
| 12/01/2004 | CN1551247A Plated material and method of manufacturing the same, terminal member for connector, and connector |
| 11/18/2004 | WO2004100293A1 Negative active material and method for production thereof, non-aqueous electrolyte secondary cell using the same |
| 11/18/2004 | US20040229077 Plated material and method of manufacturing the same, terminal member for connector, and connector |
| 11/17/2004 | CN1175956C Leadfree SnZn-base alloy solder containing rare-earth elements |
| 11/16/2004 | US6818322 Surface treated steel sheet with less environmental impact for electronic components, excellent in solder wettability, a rust-proof property and a whisker-proof property |
| 11/09/2004 | US6815086 Methods for fluxless brazing |
| 11/04/2004 | WO2004095594A1 Thermoelectrically transducing material, thermoelectric transducer using the material, and generating method and cooling method using the transducer |
| 11/02/2004 | US6811672 Method for forming plating film and electronic component having plating film formed theron by same method |
| 10/21/2004 | US20040208779 Lead-free alloy |
| 10/20/2004 | EP1469538A2 Nonaqueous electrolyte secondary battery |
| 10/19/2004 | US6805974 Coupling electroconductive pads |