| Patents for C22C 13 - Alloys based on tin (1,972) |
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| 10/02/2013 | EP2644313A1 Solder alloy for acoustic device |
| 10/01/2013 | US8545942 Method for producing clathrate compounds |
| 09/26/2013 | WO2013141166A1 Solder-coated ball and method for manufacturing same |
| 09/26/2013 | WO2013140850A1 Metallic material for electronic component, connector terminal obtained using same, connector, and electronic component |
| 09/26/2013 | WO2013140699A1 Electric contact and socket for electric component |
| 09/25/2013 | EP2641689A1 Electroconductive material, method of connection with same, and connected structure |
| 09/24/2013 | US8541336 Metal-carbon compositions |
| 09/18/2013 | CN103314652A Wiring substrate and production method therefor |
| 09/17/2013 | CA2779474C Improvements in fluxless brazing |
| 09/17/2013 | CA2736641C Products and compositions of layered material systems for fluxless brazing of aluminum or dissimilar metals |
| 09/12/2013 | WO2013132954A1 Bonding method, bond structure, and manufacturing method for same |
| 09/12/2013 | WO2013132953A1 Bonding method, electronic device manufacturing method, and electronic component |
| 09/12/2013 | WO2013132942A1 Bonding method, bond structure, and manufacturing method for same |
| 09/11/2013 | CN103290259A Slide material and bearing device |
| 09/11/2013 | CN103290246A Preparation method of three-dimensional nano porous tin-base alloy for lithium-ion battery negative electrode |
| 09/10/2013 | US8530058 Oxidation resistant Pb-free solder alloys |
| 09/04/2013 | EP2634276A1 Slide material with a tin matrix and bearing device |
| 09/04/2013 | EP2633576A1 Si based negative electrode material |
| 08/28/2013 | EP2631934A1 Semiconductor junction structure and method for manufacturing semiconductor junction structure |
| 08/28/2013 | CN103269826A Lead-free solder flux and lead-free solder paste |
| 08/21/2013 | CN103262669A Mounting structure and production method for mounting structure |
| 08/14/2013 | CN103243234A Serial low-silver and lead-free solder for electronic packaging soft soldering and preparation method thereof |
| 08/14/2013 | CN102409300B Oxide ceramic sputtering target and preparation method thereof and used brazing alloy |
| 08/07/2013 | EP2623253A1 Soldering paste and flux |
| 08/06/2013 | US8503189 Pb-free solder-connected structure and electronic device |
| 08/06/2013 | US8501088 Solder alloy, solder ball and electronic member having solder bump |
| 08/01/2013 | WO2013111434A1 Assembly and semiconductor module |
| 07/30/2013 | US8496873 Alloy nanoparticles of SN-CU-AG, preparation method thereof and ink or paste using the alloy nanoparticles |
| 07/25/2013 | WO2013108599A1 Wiring substrate and production method therefor |
| 07/25/2013 | WO2013108421A1 Solder alloy for acoustic device |
| 07/24/2013 | EP2617515A1 Semiconductor device bonding material |
| 07/17/2013 | CN103208435A Method for of bonding parts to substrate using soldering paste |
| 07/17/2013 | CN103205601A Damping brazing alloy and preparation method thereof |
| 07/10/2013 | CN103194638A Amalgam globules for energy saving lamps and their manufacture |
| 07/03/2013 | CN101960933B Mounted structure and motor |
| 06/27/2013 | DE112010000752T5 Bleifreie Lotlegierung, ermüdungsbeständige Lötmaterialien, die die Lotlegierung enthalten, und kombinierte Produkte, die die Lötmaterialien verwenden Lead-free solder alloy, fatigue resistant solder materials containing the solder alloy and combined products that use the soldering materials |
| 06/26/2013 | EP2608642A1 Anisotropic conductive material |
| 06/26/2013 | CN103173651A Lead-free low-temperature alloy for fusible core of fuse at 212 DEG C and preparation method thereof |
| 06/20/2013 | WO2013088846A1 Negative electrode active material for electrical device |
| 06/19/2013 | CN103168392A Connecting structure |
| 06/19/2013 | CN103167926A Bonding method, bonding structure, electronic device, manufacturing method for electronic device, and electronic component |
| 06/19/2013 | CN103165559A Tin-based solder ball and semiconductor package including the same |
| 06/12/2013 | CN103155127A Semiconductor junction structure and method for manufacturing semiconductor junction structure |
| 06/12/2013 | CN103153528A Electroconductive material, method of connection with same, and connected structure |
| 06/12/2013 | CN103153527A Semiconductor device bonding material |
| 06/12/2013 | CN103146955A 198-DEG C lead-free low-temperature alloy for fuse burned-out core and preparation method thereof |
| 06/12/2013 | CN103146954A 205-DEG C lead-free low-temperature alloy for fuse burned-out core and preparation method thereof |
| 06/12/2013 | CN103146953A 185-DEG C lead-free low-temperature alloy for fuse burned-out core and preparation method thereof |
| 06/12/2013 | CN101960029B Plain bearing alloy consisting of a tin-based white metal |
| 05/29/2013 | CN103124614A Soldering paste and flux |
| 05/29/2013 | CN103122425A Smelting technique of Babbitt metal wire |
| 05/23/2013 | WO2013073324A1 Thermistor and manufacturing method therefor |
| 05/22/2013 | CN101496133B Low-pressure mercury vapor discharge lamp |
| 05/15/2013 | CN103103525A Preparation method of leadless aluminum wire in plating layer |
| 05/15/2013 | CN103100805A Preparation method for high-purity lead-free welding flux |
| 05/15/2013 | CN101801589B In-containing lead-free solder for on-vehicle electronic circuit |
| 05/08/2013 | CN101675558B Anisotropic electroconductive material |
| 05/02/2013 | WO2013062095A1 Reflow film, solder bump formation method, solder joint formation method, and semiconductor device |
| 04/24/2013 | EP2583792A1 Saw wire |
| 04/24/2013 | CN103060613A Anti-oxidation lead-free metal spraying material and preparation method thereof |
| 04/17/2013 | CN103045908A Novel environment-friendly zinc alloy material for welding and preparation method for same |
| 04/11/2013 | WO2013052428A1 A mn doped sn-base solder alloy and solder joints thereof with superior drop shock reliability |
| 04/10/2013 | EP2578350A1 No-clean lead-free solder paste |
| 04/10/2013 | CN103038019A Lead-free solder paste |
| 04/10/2013 | CN103031468A Materials for the production of ecological ammunition and other applications |
| 04/04/2013 | WO2013048664A1 White metal babbitt for rolling mill bushing |
| 04/04/2013 | US20130084209 White Metal Babbitt for Rolling Mill Bushing |
| 04/04/2013 | CA2850419A1 White metal babbitt for rolling mill bushing |
| 04/03/2013 | CN103014582A Alloy material for solder strip coating and coating method |
| 04/03/2013 | CN103014411A Sn-Nd-Ni intermediate alloy and preparation method thereof |
| 03/28/2013 | WO2013042572A1 Metal material for electronic components and method for producing same |
| 03/28/2013 | US20130078500 Non-aqueous electrolyte secondary battery and combined battery |
| 03/28/2013 | CA2849410A1 Metal material for electronic component and method for manufacturing the same |
| 03/27/2013 | CN102994803A Bearing alloy material with high softening-point temperature |
| 03/27/2013 | CN102994795A Copper removing method of Sn-Cu-Ni lead-free solder and PCB (Printed Circuit Board) production method |
| 03/27/2013 | CN101090797B Lead-free solder flux and solder paste |
| 03/21/2013 | WO2013038817A1 Electroconductive material, and connection method and connection structure using same |
| 03/21/2013 | WO2013038816A1 Electroconductive material, and connection method and connection structure using same |
| 03/21/2013 | WO2013038621A1 Electrical connection structure, electrical equipment provided therewith, and method of manufacturing electrical connection structure |
| 03/14/2013 | WO2012172428A3 Method for producing lead-free copper-bismuth alloys and ingots useful for same |
| 03/13/2013 | CN102962600A Multi-element alloy lead-free soldering flux |
| 02/27/2013 | EP2562853A1 Anode material of non-aqueous electrolyte secondary battery and method for producing same |
| 02/20/2013 | CN102936669A Low-melting-point lead-free solder alloy |
| 02/07/2013 | WO2013017883A1 High impact toughness solder alloy |
| 02/07/2013 | CA2843509A1 High impact toughness solder alloy |
| 02/06/2013 | CN102917835A Junction material, manufacturing method thereof, and manufacturing method of junction structure |
| 02/06/2013 | CN102912278A Lead-free metal spraying material |
| 02/06/2013 | CN102909481A Lead-free solder for vehicle, and in-vehicle electronic circuit |
| 02/06/2013 | CN102909362A Sub-micron solder alloy powder and preparation method thereof |
| 01/31/2013 | WO2013015329A1 Wiring member, method for producing same, and method for producing wiring member connection body |
| 01/31/2013 | US20130028786 Low alpha-Dose Tin or Tin Alloy, and Method for Producing Same |
| 01/23/2013 | EP2549489A1 Metal tape material, and interconnector for solar cell collector |
| 01/23/2013 | EP2548981A1 Low -dose tin or tin alloy and method for producing same |
| 01/23/2013 | EP2548845A1 Production apparatus and method for producing mg2si1-xsnx polycrystals |
| 01/03/2013 | WO2013002112A1 Process for producing solder joint with improved reliability |
| 01/02/2013 | CN102848094A Sn-Cu-based environment-friendly solder containing Zr and preparation method thereof |
| 01/02/2013 | CN102172805B Low-cost anti-aging brazing filler material used for electronic packaging and preparation method thereof |
| 12/27/2012 | US20120328361 Mn doped sn-base solder alloy and solder joints thereof with superior drop shock reliability |
| 12/26/2012 | CN101680482B Slide bearing |
| 12/20/2012 | WO2012172854A1 Bonding method and production method |