| Patents for C22C 13 - Alloys based on tin (1,972) |
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| 03/29/2000 | EP0988920A1 Soldered article |
| 03/29/2000 | EP0765192B1 Intermetallic ruthenium-tin catalyst for use in aldehyde synthesis |
| 03/15/2000 | EP0985486A1 Leadless solder |
| 03/07/2000 | US6033488 Solder alloy |
| 03/01/2000 | EP0982090A1 Method of preparation of highly dispersed metal alloys |
| 02/29/2000 | US6030473 Method for manufacturing a granular material for producing ignition nuclei in propellants and fuels |
| 02/16/2000 | CN1244897A Lead-free tin alloy |
| 02/09/2000 | EP0977900A1 Lead-free solder |
| 02/02/2000 | EP0976489A1 Solder material |
| 01/12/2000 | CN1240889A Bush and its making method |
| 01/05/2000 | EP0969525A1 thermoelectric module |
| 01/04/2000 | US6010060 Lead-free solder process |
| 12/08/1999 | EP0962673A2 Sliding bearing shell and method of making the same |
| 11/30/1999 | US5993736 Lead-free tin-silver-based soldering alloy |
| 11/17/1999 | CN1235079A Solder alloy |
| 11/16/1999 | US5985212 Consisting of at least about 75 weight percent sn, between about 0.01 and 9.5 weight percent cu, between about 0.01 and 5.0 weight percent ga, between about greater than 0 and 6 percent in; tensile strength |
| 11/09/1999 | US5980822 Comprising bismuth, silver, antimony, copper, phosphorus, germanium, antins; solders for connecting electric circuit boards; nontoxic |
| 11/04/1999 | WO1999055924A1 Tin alloy wheel balancing weights |
| 11/04/1999 | CA2330035A1 Tin alloy wheel balancing weights |
| 11/03/1999 | EP0953400A1 Fatigue-resistant lead-free alloy |
| 10/26/1999 | US5973210 Intermetallic ruthenium tin-catalyst for use in aldehyde synthesis |
| 10/20/1999 | EP0748666B1 High-strength solder alloy |
| 10/12/1999 | US5965197 Mixing dispersoid particles with solder particles to coat surface, subjecting to plastic deformation to reduce thickness |
| 09/30/1999 | WO1999048639A1 Leadless solder |
| 09/28/1999 | US5958333 Tin-silver-based soldering alloy |
| 09/22/1999 | EP0800591B1 Amalgam for use in fluorescent lamps comprising lead, tin, mercury together with another of the group silver, magnesium, copper, nickel, gold and platinum |
| 09/14/1999 | US5952780 Amalgam for use in fluorescent lamps comprising lead, tin, mercury together with another of the group silver, magnesium, copper, nickel, gold and platinum. |
| 09/09/1999 | DE19824308C1 Plain bearing shell especially a steel-backed bearing shell with an aluminum-tin alloy running-in layer |
| 08/17/1999 | US5938862 Integrate circuit joint solder comprising tin-indium-silver-copper alloy having low reflow temperature and solidus/liquidus temperatures less than 200 degrees celcius |
| 08/04/1999 | EP0933010A1 Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards |
| 07/13/1999 | CA2049557C Process for soldering superconducting fibers into a copper channel |
| 07/06/1999 | US5918795 Soldering alloy, cream solder and soldering method |
| 06/30/1999 | EP0926735A2 Tin-nickel alloy and component surface-treated with alloy |
| 06/24/1999 | WO1999030866A1 Pb-FREE SOLDER-CONNECTED STRUCTURE AND ELECTRONIC DEVICE |
| 06/15/1999 | US5911513 Sliding bearing of copper-based alloy |
| 06/01/1999 | CA2122376C Solder alloy having decreased fatigue rupture occurring on soldered joints exposed to heat cycle stress |
| 03/31/1999 | EP0905218A2 Process for making a granulate for generate ignition germs in fuel and propellants |
| 02/23/1999 | US5874043 High solidus temperature, high strength, nontoxic solder for joining microelectronic structures |
| 01/28/1999 | WO1999004048A1 Tin-bismuth based lead-free solders |
| 01/26/1999 | US5863493 Consisting of tin, silver, nickle and copper alloy |
| 01/19/1999 | US5861217 Composite material having anti-wear property and process for producing the same |
| 12/24/1998 | DE19827014A1 Method and apparatus for soldering |
| 12/09/1998 | EP0882544A1 A lead-free tin-silver-based soldering alloy |
| 12/02/1998 | CN1200316A Solder and electronic elements utilizing same |
| 12/01/1998 | US5843371 Lead-free soldering material having superior solderability |
| 11/24/1998 | US5839496 Casting low melting tin alloy, cooling |
| 11/24/1998 | CA2118433C Lead-free alloy containing tin, zinc, indium and bismuth |
| 11/18/1998 | EP0878265A1 Solder, solder paste and soldering method |
| 11/17/1998 | US5837191 Alloy of antimony, copper, silver, nickel and tin |
| 10/29/1998 | WO1998048069A1 Lead-free solder |
| 10/29/1998 | CA2286810A1 Lead-free solder |
| 10/21/1998 | CN1040303C Universal non-lead solder |
| 10/21/1998 | CN1040302C Non-lead solder for electronic wiring supplied for electronic component |
| 10/14/1998 | CN1195592A Leadless alloy for soldering flux |
| 10/06/1998 | US5817194 Tin base soldering/brazing material |
| 10/06/1998 | CA2078538C Fatigue resistant eutectic solder |
| 08/05/1998 | EP0856376A1 Article comprising fine-grained solder compositions with dispersoid particles |
| 07/30/1998 | WO1998032886A1 Lead-free tin alloy |
| 07/30/1998 | CA2278143A1 Lead-free tin alloy |
| 07/14/1998 | US5779872 Iron-carbon alloys are electroplated with tin or nickel, immersed in zinc chloride-ammonium chloride flux |
| 07/01/1998 | CN1186009A Soft solder and electronic component using the same |
| 06/17/1998 | EP0847829A1 Lead-free solder composition |
| 06/17/1998 | EP0847828A1 Solder material and electronic part using the same |
| 06/17/1998 | CN1185036A Connecting material for electronic elements, and the connection and semiconductor device using same |
| 06/16/1998 | US5766776 Strip shaped or wire-shaped compound material |
| 06/09/1998 | US5762866 Article comprising a Pb-free solder having improved mechanical properties |
| 06/03/1998 | EP0845324A1 Solder Compositions |
| 06/03/1998 | CN1183335A 钎料合金 Solder alloy |
| 05/26/1998 | US5755896 Consisting of specified concentations of bismuth, tin,indiaum and minor propotions of other metals; electronics |
| 04/07/1998 | US5736920 Miniature female fuse with low melting temperature fusible link |
| 03/31/1998 | US5733501 Alloy of silver, indium, bismuth and tin |
| 03/25/1998 | CN1177017A Tech. for producing alloy steel contg. germanium and tin |
| 03/17/1998 | US5728913 Moisture based method of improving the performance of hydrocarbon fuels |
| 03/04/1998 | EP0826458A1 Tin-silver-based soldering alloy |
| 02/26/1998 | WO1998008362A1 Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards |
| 02/17/1998 | US5718868 Lead-free tin-zinc-based soldering alloy |
| 01/07/1998 | EP0817284A1 Superconducting structure |
| 01/06/1998 | US5705126 Tin, antimony, copper, silver, and zinc; compressive strength; turbines |
| 12/18/1997 | WO1997047426A1 Lead-free, high tin ternary solder alloy of tin, silver, and indium |
| 12/18/1997 | WO1997047425A1 Lead-free, high tin ternary solder alloy of tin, silver, and bismuth |
| 12/16/1997 | US5698160 Lead-free alloys for use in solder bonding |
| 11/20/1997 | WO1997043456A1 Tin base solder contains silver and indium |
| 10/30/1997 | DE19704156A1 Miniature fuse for automobile electrics |
| 10/15/1997 | EP0800591A1 Amalgam for use in fluorescent lamps comprising lead, tin, mercury together with another of the group silver, magnesium, copper, nickel, gold and platinum |
| 10/08/1997 | EP0538446B1 Solder for oxide layer-building metals and alloys |
| 09/03/1997 | CN1035750C Solder and its smelting process for brazing low smelting point aluminium without soldering flux |
| 08/19/1997 | US5658528 Comprises silver, indium, bismuth and tin |
| 08/14/1997 | WO1997028923A1 Solder, solder paste and soldering method |
| 08/06/1997 | EP0787559A1 Soldering alloy, cream solder and soldering method |
| 06/24/1997 | US5641454 Composite material having anti-wear property and process for producing the same |
| 05/02/1997 | EP0770449A1 Low temperature solder alloy and articles comprising the alloy |
| 04/29/1997 | US5625118 Method of improving the performance of hydrocarbon fuels |
| 04/17/1997 | DE19538365A1 High purity tin@ alloy target material for sputter coating process |
| 04/10/1997 | WO1997013000A1 Amalgam for use in fluorescent lamps comprising lead, tin, mercury together with another of the group silver, magnesium, copper, nickel, gold and platinum |
| 04/10/1997 | CA2207195A1 Amalgam for use in fluorescent lamps comprising lead, tin, mercury together with another of the group silver, magnesium, copper, nickel, gold and platinum |
| 04/02/1997 | EP0765192A1 Intermetallic ruthenium-tin catalyst for use in aldehyde synthesis |
| 03/19/1997 | CN1145594A Intermetallic ruthenium-tin catalyst for use in aldehyde synthesis |
| 03/13/1997 | WO1997009455A1 Soldering composition |
| 01/08/1997 | CN1139607A Non-lead solder with fine mechanical property |
| 01/08/1997 | CN1139606A Universal non-lead solder |