| Patents for C22C 13 - Alloys based on tin (1,972) |
|---|
| 02/29/2012 | EP2422918A1 Soldering material and electronic component assembly |
| 02/23/2012 | WO2012023440A1 Solder ball for semiconductor mounting and electronic member |
| 02/16/2012 | US20120038042 Lead-free solder alloy, solder ball, and electronic member comprising solder bump |
| 02/16/2012 | US20120037199 Thermoelectric material and thermoelectric element |
| 02/15/2012 | CN102352446A Antioxidation reducing agent for tin or tin alloy |
| 02/09/2012 | WO2012018046A1 Semiconductor device bonding material |
| 02/01/2012 | CN102337422A Low-ablation lead-free tin plating alloy under high temperature |
| 01/25/2012 | CN102329979A Hg-rich type Sb-Sn-Hg alloy |
| 01/25/2012 | CN101812613B Bearing bush antifriction layer |
| 01/19/2012 | DE102010036130B3 Gleitlagerlegierung auf Zinn-Basis Tin-based plain bearing alloy |
| 01/18/2012 | CN102321831A High-spreadability tin-antimony-rare earth lead-free solder alloy and preparation method thereof |
| 01/11/2012 | CN101395293B Surface-treated stainless-steel sheet excellent in salt damage/corrosion resistance and weld reliability for automotive fuel tank and for automotive fuel pipe and surface-treated stainless-steel welded pipe with excellent suitability for pipe expansion processing for automotive petrol pipe |
| 01/04/2012 | CN101760665B Silicon-tin composite material with toughness and high hardness and production method thereof |
| 01/04/2012 | CN101689413B Electroconductive fine particles, anisotropic electroconductive material, and connection structure |
| 01/04/2012 | CN101374630B Solder alloy, solder ball and solder joint using same |
| 12/28/2011 | CN102296208A 用于制作温度保险丝的熔断芯的无铅低温合金及其制备方法 Unleaded low-temperature alloy and preparation method for the production of thermal fuse fuse core |
| 12/22/2011 | WO2011158834A1 Saw wire |
| 12/15/2011 | US20110303448 Pb-Free Sn-Ag-Cu-Al or Sn-Cu-Al Solder |
| 12/14/2011 | EP2395823A1 Mounted structure and motor |
| 12/14/2011 | CN102281988A 用于无铅焊料的焊剂组合物、无铅焊料组合物和树脂芯焊料 Flux composition for lead-free solder, lead-free solder composition and a resin core solder |
| 12/14/2011 | CN101390175B Nb<sub>3</sub>Sn超导线材的制备用前体和Nb<sub>3</sub>Sn超导线材 Nb <sub> 3 </ sub> Sn precursor for manufacturing a superconducting wire and Nb <sub> 3 </ sub> Sn superconducting wire |
| 12/14/2011 | CN101274823B 焊料合金及使用其的玻璃接合体 Solder alloy and the use of its glass assembly |
| 12/08/2011 | WO2011151894A1 No-clean lead-free solder paste |
| 11/30/2011 | CN101604668B 无Pb焊料连接结构和电子装置 Pb-free solder connection structure and electronic devices |
| 11/30/2011 | CN101500744B 膏状钎焊料和电子部件的软钎焊方法 A method of soldering of the solder cream and the electronic component |
| 11/30/2011 | CN101339990B 一种锂离子二次电池负极活性材料及其制备方法 A lithium ion secondary battery cathode active material and method |
| 11/29/2011 | US8067686 thermoelectric material which is represented by the following composition formula (1) or (2) and comprises as a major phase an MgAgAs type crystal structure:Zrb1Hfc1)xNiySn100-x-y composition formula (1);(Tia2Zrb2Hfc2)1-d)xNiySn100-x-y alloys |
| 11/24/2011 | WO2011145591A1 Lead-free solder composition for vehicle |
| 11/23/2011 | CN101762150B Reflecting furnace for smelting tin lead materials |
| 11/22/2011 | US8062585 Mercury releasing method |
| 11/16/2011 | CN102242293A Tin-based babbitt |
| 11/10/2011 | US20110274937 Lead-free solder alloy, fatigue resistant soldering materials containing the solder alloy, and joined products using the soldering materials |
| 10/19/2011 | CN102220516A High-plasticity tin-based Babbitt alloy |
| 10/18/2011 | CA2452779C Tungsten-tin composite material for green ammunition |
| 10/13/2011 | WO2011125140A1 Connecting material, semiconductor device, and process for producing same |
| 10/12/2011 | CN102216478A Solder alloy |
| 10/05/2011 | EP2097254B1 Sliding bearing |
| 10/05/2011 | EP1645646B1 Temperature fuse element, temperature fuse and battery using the same |
| 09/22/2011 | WO2011115305A1 Metal tape material, and interconnector for solar cell collector |
| 09/22/2011 | WO2011115297A1 Production apparatus and method for producing mg2si1-xsnx polycrystals |
| 09/22/2011 | WO2011114824A1 Low α-dose tin or tin alloy and method for producing same |
| 09/21/2011 | CN102196881A 钎料合金及半导体装置 Solder alloy and semiconductor device |
| 09/21/2011 | CN102189270A Method for chemically synthesizing nano lead-free solder particles with low melting point |
| 09/20/2011 | US8022551 Solder composition for electronic devices |
| 09/14/2011 | EP2364510A2 Clathrate compounds and their preparation and use |
| 09/14/2011 | CN1767921B Phase change lead-free super plastic solders and welding method therefor |
| 09/08/2011 | US20110218109 Clathrate compounds |
| 09/07/2011 | CN102174676A Preparation method for stannum, indium and stibium series lead-free solder tinning copper strip used for solar battery |
| 09/07/2011 | CN102172805A Low-cost anti-aging brazing filler material used for electronic packaging and preparation method thereof |
| 09/01/2011 | WO2011106421A2 Low melting temperature alloys with magnetic dispersions |
| 08/31/2011 | EP1212164B1 Ink-jet print head manufacturing process and ink-jet print head |
| 08/31/2011 | CN102170994A Flux composition and soldering paste composition |
| 08/31/2011 | CN101501807B Mercury releasing method |
| 08/31/2011 | CN101384395B Lead-free solder alloy |
| 08/25/2011 | WO2011102034A1 Lead-free solder alloy, and solder paste and packaged components using same |
| 08/25/2011 | US20110204121 Lead-free solder alloy having reduced shrinkage cavities |
| 08/24/2011 | EP2359981A1 Reducing dross method of lead-free solder |
| 08/18/2011 | US20110198755 Solder alloy and semiconductor device |
| 08/17/2011 | CN102154575A Amalgam for electrodeless lamp |
| 08/11/2011 | WO2011097438A1 Metal-carbon compositions |
| 08/11/2011 | CA2826551A1 Metal-carbon compositions |
| 08/03/2011 | EP2350328A1 Solder alloy |
| 07/28/2011 | US20110180311 Solder, electronic part, and method of fabricating electronic part |
| 07/13/2011 | CN102123820A Bonding composition |
| 07/07/2011 | WO2011080990A1 Solder paste and flux |
| 07/06/2011 | CN101223002B Solder free from lead for additional supply and method of regulating Cu concentration and Ni concentration in solder bath |
| 06/30/2011 | WO2011078344A1 Negative electrode material for a nonaqueous electrolyte secondary battery, and manufacturing method therefor |
| 06/21/2011 | CA2467583C Fluxless brazing method and compositions of layered material systems for brazing aluminum or dissimilar metals |
| 06/16/2011 | WO2011071006A1 Flux for solder paste, and solder paste |
| 06/16/2011 | WO2011071005A1 Solder paste |
| 06/16/2011 | CA2781958A1 Flux for solder paste and solder paste |
| 06/16/2011 | CA2781956A1 Solder paste |
| 06/15/2011 | EP2333129A1 Sliding layer |
| 06/15/2011 | CN102094900A Sliding layer |
| 06/15/2011 | CN101210294B Preparation method of A5B19 type alloy |
| 06/01/2011 | EP2328214A1 Negative electrode for rechargeable lithium battery and rechargeable lithium battery including same |
| 06/01/2011 | CN102082001A Flat cable and manufacturing method thereof |
| 05/26/2011 | WO2011062222A1 Process for producing solder powder |
| 05/25/2011 | CN102074536A Power semiconductor device and manufacturing method therefor |
| 05/19/2011 | US20110115084 Lead-free solder connection structure and solder ball |
| 05/18/2011 | CN1897789B Circuit board and connection structure |
| 05/18/2011 | CN102066044A Soldering material and electronic component assembly |
| 05/18/2011 | CN102066043A Lead-free solder alloy suppressed in occurrence of shrinkage cavity |
| 05/18/2011 | CN102066042A Lead-free solder |
| 05/12/2011 | US20110110813 Tin-indium based lead-free solders with zinc addition |
| 05/11/2011 | EP1484174B1 Resin coated steel sheet and can formed by pressing the same |
| 05/11/2011 | CN102054969A Negative electrode for rechargeable lithium battery and rechargeable lithium battery including same |
| 05/05/2011 | US20110104568 Negative Electrode For Rechargeable Lithium Battery and Rechargeable Lithium Battery Including Same |
| 05/04/2011 | CN102047397A Method for joining substrate and object to be mounted using solder paste |
| 05/04/2011 | CN101701295B Process for smelting tin-lead alloy by tin enriched slag reduction and reduction-smelting reflecting furnace |
| 04/27/2011 | CN102029479A Low-silver lead-free solder alloy and preparation method and device thereof |
| 04/27/2011 | CN101760655B Method for reinforcing silicon-tin composite material in fine crystalline way |
| 04/21/2011 | US20110091351 Bonding composition |
| 04/21/2011 | US20110089224 Lead-free solder |
| 04/20/2011 | EP2312622A2 Power semiconductor element bonded to a substrate by a Sn-Sb-Cu solder and manufacturing method therefor |
| 04/20/2011 | CN102021361A Novel Babbitt alloy material |
| 04/13/2011 | CN102011025A Ultrahigh-temperature-resistant lead-free solder |
| 04/07/2011 | WO2010055863A9 Negative electrode structure for lithium ion secondary battery, and method for producing same |
| 04/06/2011 | CN102006967A Lead-free solder alloy, fatigue-resistant soldering materials containing the solder alloy, and joined products using the soldering materials |
| 04/06/2011 | CN101108436B Product used for fluxless brazing and its preparing method |