Patents for C22C 13 - Alloys based on tin (1,972) |
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03/26/2009 | US20090081412 Thin film forming method and transparent conductive film |
03/25/2009 | EP2039651A1 Hydrogen generating method, hydrogen generating alloy and method for manufacturing hydrogen generating alloy |
03/25/2009 | CN101395293A Surface-treated stainless-steel sheet excellent in salt damage/corrosion resistance and weld reliability for automotive fuel tank and for automotive fuel pipe and surface-treated stainless-steel weld |
03/25/2009 | CN100471983C Sn-based metal-coated steel strip with even gloss in appearance and process for producing same |
03/18/2009 | CN101390175A Precursor for manufacture of nb3sn superconducting wire rod, and nb3sn superconducting wire rod |
03/11/2009 | CN101384395A Lead-free solder alloy |
03/11/2009 | CN101381826A Sn-Cu base leadless solder alloy and preparation method |
03/05/2009 | WO2009028147A1 Bonding composition |
03/05/2009 | WO2009028143A1 Hydrogen gas generating member and hydrogen gas producing method therefor |
02/26/2009 | WO2009025207A1 Powder for negative electrode material for lithium ion battery |
02/25/2009 | EP1791693A4 Electroplated metals with silvery-white appearance and method of making |
02/25/2009 | CN101374630A Solder alloy, solder ball and solder joint using same |
02/25/2009 | CN100463761C Lead-free solder |
02/17/2009 | US7490403 Soldering method |
02/11/2009 | EP1545826A4 Solder hierarchy for lead free solder joint |
02/11/2009 | CN101363088A High wetting and antioxidizing leadless tin-base alloy |
02/10/2009 | US7488445 solders exhibiting satisfactory solderability in solder joints and high resistance to electrode leaching upon soldering or at high temperatures; pollution control |
01/28/2009 | CN101356293A Lead-free solder with low copper dissolution |
01/28/2009 | CN100455394C Soldering method |
01/22/2009 | WO2009011392A1 In-containing lead-free solder for on-vehicle electronic circuit |
01/22/2009 | WO2009011341A1 Lead-free solder for vehicle, and in-vehicle electronic circuit |
01/21/2009 | EP2017031A1 Solder paste |
01/21/2009 | CN101351297A Low melting temperature compliant solders |
01/21/2009 | CN101348875A Tin, bismuth and copper type low temperature lead-free solder alloy |
01/15/2009 | WO2009008383A1 Electroconductive fine particles, anisotropic electroconductive material, and connection structure |
01/15/2009 | WO2009008127A1 Thermoelectric conversion module and heat exchanger employing the same, thermoelectric temperature control device and thermoelectric generator |
01/15/2009 | US20090014746 Solder alloys |
01/07/2009 | CN101341266A Technique for increasing the compliance of tin-indium solders |
01/07/2009 | CN101339990A Negative electrode of lithium ionic secondary battery and preparing method thereof |
01/07/2009 | CN101339989A Aluminum-tin alloy film for lithium ionic cell negative electrode and method for preparing the same |
01/06/2009 | US7472927 Tubular member having an anti-galling coating |
01/06/2009 | US7472817 Solders |
12/31/2008 | EP1977022A4 Lead-free solder alloys and solder joints thereof with improved drop impact resistance |
12/31/2008 | EP1433190B1 Fuse element and method for making same |
12/31/2008 | EP1319093B1 Electroplating solutions for the preparation of ternary tin zinc cobalt alloy layers |
12/24/2008 | CN101327515A Method for processing thick line blank of alloy wire rod made from leadless metal spraying material |
12/18/2008 | DE102004030017C5 Gleitelement Slider |
12/17/2008 | EP1815034B1 Improvements in or relating to solders |
12/17/2008 | CN101326296A Sn-containing heavy-duty material composition, method for the production of a heavy-duty coating, and use thereof |
12/17/2008 | CN101326295A Lead-free solder alloys and solder joints thereof with improved drop impact resistance |
12/11/2008 | WO2008149910A1 Method for production of thermoelectric conversion element |
12/03/2008 | CN100440471C Method for manufacturing electronic device |
11/27/2008 | US20080292493 Quaternary Pb-free solder composition incorporating Sn-Ag-Cu-In |
11/27/2008 | US20080292492 Solder Alloy |
11/20/2008 | WO2008140435A1 Composite material, production method, degradation method and device |
11/20/2008 | US20080287303 Nb3Sn superconducting wire, precursor or same, and method for producing precursor |
11/19/2008 | EP1993153A1 Nb3Sn superconducting wire, precursor of same, and method for producing precursor |
11/19/2008 | CN100434552C Solid mercury with high content |
11/12/2008 | CN100433420C Electrode material, method of manufacturing the electrode material, electrode, and nonaqueous electrolyte battery |
11/06/2008 | WO2008132933A1 Electroconductive fine particles, anisotropic electroconductive material, and electroconductive connection structure |
10/15/2008 | EP1980355A1 Lead-free solder alloy |
10/15/2008 | CN100426563C Production of negative material of high-capacity lithium-ion battery with tin-antimony-silicon alloy |
10/08/2008 | EP1977022A2 Lead-free solder alloys and solder joints thereof with improved drop impact resistance |
10/08/2008 | EP1977021A2 Sn-containing heavy-duty material composition, method for the production of a heavy-duty coating, and use thereof |
10/07/2008 | US7431507 Sliding member |
10/02/2008 | US20080241552 Containing Ag, Al, Y the balance being Sn and unavoidable impurities; bonding strength directly to oxide materials such as glass ; airtight sealing performance |
10/01/2008 | EP1974850A1 Solder alloy, solder ball and solder joint using same |
10/01/2008 | CN101274823A Solder alloy and glass bonded body using the same |
09/24/2008 | EP1971699A2 Lead-free solder with low copper dissolution |
09/18/2008 | WO2008111617A1 Slide bearing |
09/18/2008 | WO2008111615A1 Anisotropic electroconductive material |
09/16/2008 | US7425299 Forming solder bumps on substrate ; alloy of silver, copper, tin |
09/09/2008 | US7422721 Lead-free solder and soldered article |
09/03/2008 | CN101255511A Leadless alloy wire |
09/03/2008 | CN101254513A Leadless alloy thread preparation |
08/28/2008 | US20080206087 Plain bearing and method of manufacturing the same |
08/27/2008 | CN101250645A Leadless metal spraying material for capacitor |
08/20/2008 | CN101245427A Leadless metal spraying material adding alloy element |
08/20/2008 | CN101245426A Method for producing semi-Hassler thermoelectric compound |
07/31/2008 | WO2007027428A3 Technique for increasing the compliance of tin-indium solders |
07/31/2008 | US20080179379 Solder joint structure, soldering method, and electronic-component manufacturing apparatus using the same structure and the method |
07/30/2008 | EP1948388A1 Lead-free solder alloy |
07/30/2008 | CN101233634A Alloy compositions for lithium ion batteries |
07/24/2008 | WO2008088790A1 Methods for transforming compounds using a metal alloy and related apparatus |
07/24/2008 | US20080175748 Tin, indium, silver, bismuth; suitable for lead free soldering of antennas, defrosters incorporated on or embedded within automotive glass |
07/23/2008 | CN100404193C Soldering filler metal, assembly method for semiconductor device using same, and semiconductor device |
07/17/2008 | WO2008084603A1 Manual soldering lead-free solder alloy |
07/16/2008 | CN101223002A Solder free from lead for additional supply and method of regulating Cu concentration and Ni concentration in solder bath |
07/09/2008 | CN100400217C Welding method and method of preparing component mounting board |
07/03/2008 | WO2008078653A1 Lead-free solder material and method of producing the same |
07/03/2008 | US20080159904 Solder alloy |
07/03/2008 | US20080159903 Solder alloy |
07/02/2008 | CN101213326A High-purity tin or tin alloy and process for producing high-purity tin |
07/02/2008 | CN101210294A A5B19 type alloy and preparation method thereof |
06/26/2008 | WO2008074344A1 Sliding bearing |
06/26/2008 | US20080152996 Intermetallic electrodes for lithium batteries |
06/25/2008 | CN101208790A 无铅半导体封装件 Lead-free semiconductor package |
06/25/2008 | CN101208174A Lead-free solder alloy |
06/19/2008 | WO2008073090A1 Lead-free solder alloy for printed circuit board assemblies for high-temperature environments |
06/19/2008 | US20080142124 Includes 3.0 to14.0 wt % Zn, 0.003 to 0.05 wt % Al, and the balance of Sn; good solder wicking characteristic, and good solderability; no Cu erosion |
06/19/2008 | CA2641812A1 Lead-free solder alloy for high-temperature environments |
06/18/2008 | EP1375689B1 Member having separation structure and method for manufacture thereof |
06/12/2008 | WO2007038490A8 Low melting temperature compliant solders |
06/11/2008 | CN101198436A Solder alloy for oxide bonding |
06/11/2008 | CN100393471C Non-eutectic solder composition and method for forming leadless solder melting system |
05/29/2008 | WO2008062650A1 Surface-treated stainless-steel sheet excellent in salt damage/corrosion resistance and weld reliability for automotive fuel tank and for automotive fuel pipe and surface-treated stainless-steel welded pipe with excellent suitability for pipe expansion processing for automotive petrol pipe |
05/29/2008 | CA2636327A1 Surface treated stainless steel sheet for automobile fuel tank and for automobile fuel pipe with excellent salt corrosion resistance and weld zone reliability and surface treated stainless steel welded pipe for automobile fuel inlet pipe excellent in pipe expandability |
05/28/2008 | EP1924393A1 Reducing joint embrittlement in lead-free soldering processes |
05/28/2008 | CN100390919C Alloy type temp fuse and wire for temp fuse element |
05/21/2008 | DE112006001732T5 Bleifreies Halbleitergehäuse Lead-free semiconductor package |