| Patents for C22C 13 - Alloys based on tin (1,972) |
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| 08/08/2007 | CN101014726A 无铅焊料合金 Lead-free solder alloy |
| 08/02/2007 | US20070178007 Lead-free solder, solder joint product and electronic component |
| 08/01/2007 | EP1495830B1 Solder alloy and soldered joint |
| 07/31/2007 | US7250135 Pb-free solder alloy |
| 07/26/2007 | WO2007082459A1 Lead-free solder and its preparation method |
| 07/26/2007 | US20070172381 Lead-free solder with low copper dissolution |
| 07/26/2007 | US20070170227 Soldering method |
| 07/25/2007 | EP1810775A1 Electric or electronic device having a soldered bond |
| 07/24/2007 | US7248141 Current fuse and method of making the current fuse |
| 07/19/2007 | WO2007081775A2 Lead-free solder with low copper dissolution |
| 07/19/2007 | WO2007081006A1 Solder alloy, solder ball and solder joint using same |
| 07/19/2007 | WO2007079671A1 Lead-free solder and its preparation method |
| 07/18/2007 | CN101000838A Fusible temp-sensing element for fire probe |
| 07/11/2007 | CN1995422A Environment-friendly type high temperature oxidation-resistance stannum alloy |
| 07/11/2007 | CN1325689C Tin-silver coating |
| 07/11/2007 | CN1325680C Sn-Ag-Cu-Cr alloy lead-free solder preparation method |
| 07/11/2007 | CN1325679C Sn-Zn-Bi-Cr alloy lead-free solder preparation method |
| 07/10/2007 | US7241348 Changes in quality by aging are very small and can resist to preheating under high temperature |
| 07/05/2007 | US20070151701 Continuous Metal Matrix Composite Consolidation |
| 07/04/2007 | CN1323798C Products of fluxless brazing and method of discreteness connected by braze welding combination |
| 06/28/2007 | US20070148489 Tin-silver coatings |
| 06/27/2007 | EP1801252A1 Novel materials for the production of environmentally-friendly ammunition and other applications |
| 06/26/2007 | US7235309 Electronic device having external terminals with lead-free metal thin film formed on the surface thereof |
| 06/21/2007 | WO2007070548A2 Lead-free solder alloys and solder joints thereof with improved drop impact resistance |
| 06/21/2007 | WO2007068503A2 Sn-containing heavy-duty material composition, method for the production of a heavy-duty coating, and use thereof |
| 06/21/2007 | US20070140892 Clean seas |
| 06/20/2007 | CN1983542A Method for manufacturing electronic device |
| 06/14/2007 | WO2006038907A3 Lead-free solder composition for substrates |
| 06/14/2007 | US20070134125 Lead-Free Solder Alloys And Solder Joints Thereof With Improved Drop Impact Resistance |
| 06/14/2007 | DE102005059544A1 Sn-haltige hochbelastbare Materialzusammensetzung; Sn-containing heavy-duty material composition; Verfahren zur Herstellung einer hochbelastbaren Beschichtung und deren Verwendung A process for producing a heavy-duty coating and their use |
| 06/13/2007 | EP1795293A1 Solder composition and solder layer forming method using the same |
| 06/12/2007 | US7229717 Tri-component active material including Sn; B, C, Al, or P; and Si, Mg, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Zr, Nb, Mo, Ag, In, Ce, Hf, Ta, W, or Bi; halogenated ethylene or propylene carbonate electrolyte solvent; high capacity and superior cycle characteristics |
| 06/07/2007 | US20070128068 Solder alloy, solder ball, and solder joint using the same |
| 06/07/2007 | US20070125449 High-temperature solder, high-temperature solder paste and power semiconductor device using same |
| 06/06/2007 | EP1791693A1 Electroplated metals with silvery-white appearance and method of making |
| 05/31/2007 | WO2007038490A3 Low melting temperature compliant solders |
| 05/31/2007 | US20070122646 Solder composition and soldering structure |
| 05/30/2007 | EP1250467B1 Soldering alloy |
| 05/23/2007 | EP1787741A1 Sliding material and process for producing the same |
| 05/23/2007 | EP1526943B1 Brazing product and method of manufacturing a brazing product with use of a plating bath |
| 05/23/2007 | CN1317101C Tin and silver co-crystal solder without lead against oxidation |
| 05/22/2007 | US7220493 contains 30 to 70 weight percent zinc, greater than 0 to 5 weight percent nickel, and the remaining weight percent tin with a liquid phase temperature of 260 degrees C. or greater |
| 05/17/2007 | US20070107214 Soldering method |
| 05/16/2007 | EP1785498A2 Solder alloy, solder ball, and solder joint using the same |
| 05/16/2007 | CN1964109A Anode active material and battery using the same |
| 05/16/2007 | CN1316605C Substrate for use in joining element and method thereof |
| 05/09/2007 | CA2529350A1 Pb-free sn-based solder alloys for high temperature soldering application |
| 05/03/2007 | WO2007050571A2 Technique for increasing the compliance of lead-free solders containing silver |
| 05/03/2007 | WO2007049025A1 Lead-free solder alloy |
| 05/02/2007 | CN1313631C Tin silver copper nickel aluminium series leadless welding flux alloy |
| 05/02/2007 | CN1313241C Low melting point tin-zinc solder without lead and soldering paste |
| 04/26/2007 | WO2007046390A1 Recording layer for optical information recording medium, optical information recording medium, and sputtering target for optical information recording medium |
| 04/26/2007 | WO2007045191A2 Lead-free solder alloy |
| 04/26/2007 | WO2005048303A3 Anti-tombstoning lead free alloys for surface mount reflow soldering |
| 04/26/2007 | US20070092396 Technique For Increasing The Compliance Of Lead-Free Solders Containing Silver |
| 04/25/2007 | CN1311950C Pb-free solder alloy, and solder material and solder joint using same |
| 04/19/2007 | US20070084904 Conductive ball, formation method for electrode of electronic component, electronic component and electronic equipment |
| 04/18/2007 | CN1310736C Lead-free soft solder |
| 04/12/2007 | WO2006045995A8 Improvements in or relating to solders |
| 04/11/2007 | EP1772225A1 Lead-free solder alloy |
| 04/11/2007 | CN1946510A Solder and mounted article using same |
| 04/05/2007 | WO2007038490A2 Low melting temperature compliant solders |
| 04/05/2007 | DE10337030B4 Schichtverbundwerkstoff, Herstellung und Verwendung Layered composite material, manufacture and use |
| 04/03/2007 | US7199697 Alloy type thermal fuse and material for a thermal fuse element |
| 03/29/2007 | US20070071634 Low melting temperature compliant solders |
| 03/28/2007 | CN1307023C Tin-zinc lead-free solder and solder-joined part |
| 03/28/2007 | CN1307022C Tin-zinc lead-free solder alloy and solder-joined part |
| 03/15/2007 | WO2007001598A3 Lead-free semiconductor package |
| 03/15/2007 | US20070059548 Grid array package using tin/silver columns |
| 03/14/2007 | CN1927565A Ink-jet printing head manufacturing method |
| 03/14/2007 | CN1305357C Welding method and welded parts |
| 03/13/2007 | US7189630 Layer sequence for producing a composite material for electromechanical components |
| 03/08/2007 | WO2007027428A2 Technique for increasing the compliance of tin-indium solders |
| 03/08/2007 | US20070054189 Capacity, service life, high temperature performance; containing intermetallic compound having La3Co2Sn7 type crystal structure with alkaline earth metal replacing lanthanum and alkyl carbonate solvent |
| 03/08/2007 | US20070051201 Liquid quenching atomizing metal powder containing copper, nickel, zinc and tin; excellent joint reliability |
| 03/07/2007 | CN1925038A Alloy membrane component capable of reinforcing near field light |
| 03/07/2007 | CN1923518A Method for making jet-ink printed head |
| 03/01/2007 | WO2007023284A1 Reducing joint embrittlement in lead-free soldering processes |
| 03/01/2007 | US20070048172 Technique for increasing the compliance of tin-indium solders |
| 02/28/2007 | CN1921977A Soldering method |
| 02/28/2007 | CN1920075A Method of preparing tin copper alloy material used for negative electrode of lithium ion battery |
| 02/27/2007 | US7183018 comprises glassy alloy on current collector; high capacity; improved charging/discharging |
| 02/22/2007 | WO2006055259A3 Lead-free solder alloy |
| 02/21/2007 | CN1916212A Low temperature amalgam suitable to round arranged machine |
| 02/21/2007 | CN1301560C Method of preparing Sn-Sb alloy material for negative electrode of lithium ion cell |
| 02/20/2007 | US7179417 Sn—Zn lead-free solder alloy, its mixture, and soldered bond |
| 02/15/2007 | US20070036671 Soldering material based on sn ag and cu |
| 02/15/2007 | US20070036670 Solder composition |
| 02/13/2007 | US7176388 Soldering method and solder joint member |
| 02/13/2007 | US7175805 magnesium content being effective quantity for forming a protective magnesium oxide film on the surface of solder and also for destroying said oxide film during soldering |
| 02/13/2007 | US7175804 Sn-Zn lead-free solder alloy, and solder junction portion |
| 02/08/2007 | WO2007015910A1 Alloy compositions for lithium ion batteries |
| 02/08/2007 | WO2007014530A1 Lead-free sn-ag-cu-ni-al system solder alloy |
| 02/08/2007 | WO2007014529A1 A low melting point lead-free solder alloy |
| 02/08/2007 | US20070031730 Electrode material for anode of rechargeable lithium battery, electrode structural body using said electrode material, rechargeable lithium battery using said electrode structural body, process for producing said electrode structural body, and process for producing said rechargeable lithium battery |
| 02/08/2007 | US20070031279 Solder composition for electronic devices |
| 02/07/2007 | CN1909265A Lithium ion battery negative electrode prepared by metal nano-wire and its preparation method |
| 02/07/2007 | CN1299371C Nonaqueous electrolyte secondary battery |
| 02/07/2007 | CN1298491C Separated out type soldering tin composition and soldering separating out method |
| 02/07/2007 | CN1298490C Product and method for low temperature fluxless brazing |