| Patents for C22C 13 - Alloys based on tin (1,972) |
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| 03/05/2015 | US20150064483 Metal deposition using organic vapor phase deposition (vpd) system |
| 02/25/2015 | EP2839920A1 Solder alloy |
| 02/25/2015 | EP2839904A1 Functional material |
| 02/24/2015 | US8960610 High-lift system of an aircraft |
| 02/12/2015 | WO2015019967A1 Lead-free solder alloy |
| 02/12/2015 | WO2015019966A1 Lead-free solder alloy |
| 02/11/2015 | CN104349865A 焊膏 Paste |
| 02/11/2015 | CN103409656B Sn及其制备方法 Sn and its preparation method |
| 02/04/2015 | CN102074536B 功率半导体装置及其制造方法 The power semiconductor device and manufacturing method thereof |
| 01/29/2015 | WO2015011680A1 A method of synthesizing intermetallic compounds and applications thereof |
| 01/28/2015 | EP2829637A1 Metallic material for electronic component, connector terminal obtained using same, connector, and electronic component |
| 01/28/2015 | CN104313390A 一种高强拉伸索具 A high strength and stretch rigging |
| 01/22/2015 | US20150020647 Method for producing microparticles |
| 01/13/2015 | US8932519 Solder alloy |
| 01/08/2015 | WO2015001817A1 Electromagnetic wave shield-use metal foil, electromagnetic wave shield material and shield cable |
| 01/07/2015 | CN104263995A 一种锡基合金线 One kind of tin-based alloy wire |
| 01/07/2015 | CN104263994A 一种石墨烯合金复合导热材料及其制备方法 One kind of thermal conductivity of graphene alloy composite material and its preparation method |
| 01/07/2015 | CN104263986A 一种超快速制备高性能SnTe基热电材料的方法 An ultra-fast performance SnTe preparation method based thermoelectric materials |
| 01/07/2015 | CN103146955B 198℃保险丝熔断芯的无铅低温合金及其制备方法 Unleaded low-temperature alloy and preparation method 198 ℃ fuse core |
| 01/07/2015 | CN103146953B 185℃保险丝熔断芯无铅低温合金及其制备方法 185 ℃ low temperature lead-free alloy core fuse and its preparation method |
| 01/01/2015 | US20150004490 INTERMETALLIC M-Sn5 (M=Fe, Cu, Co, Ni) COMPOUND AND A METHOD OF SYNTHESIS THEREOF |
| 12/25/2014 | US20140376845 Sintered bearing for motor-type fuel pump with superior corrosion resistance, wear resistance and conformability |
| 12/25/2014 | US20140376352 Materials for near field transducers, near field tranducers containing same, and methods of forming |
| 12/24/2014 | CN104246015A 电子部件用金属材料、使用其的连接器端子、连接器及电子部件 Metal material for electronic components, using the same connector terminal, the connector and the electronic component |
| 12/24/2014 | CN104245204A 接合方法、接合结构体及其制造方法 Bonding method, the bonding structure and manufacturing method |
| 12/24/2014 | CN104245203A 接合方法、电子装置的制造方法和电子部件 Bonding method, and a method of manufacturing the electronic component of the electronic device |
| 12/17/2014 | CN104221223A 各向异性导电片材以及使用其的电极接合方法 Anisotropically conductive sheet and an electrode using the same bonding method |
| 12/17/2014 | CN104220210A 软钎焊用助焊剂及焊料组合物 Soft soldering flux and solder composition |
| 12/16/2014 | US8910853 Additives for grain fragmentation in Pb-free Sn-based solder |
| 12/10/2014 | CN104205508A 电触头和电气部件用插座 Electrical contacts and electrical component socket |
| 12/10/2014 | CN104204296A 电子部件用金属材料 The metallic material for an electronic component |
| 12/09/2014 | US8907475 Pb-free solder-connected structure |
| 11/27/2014 | US20140348203 Stable nanocrystalline ordering alloy systems and methods of identifying same |
| 11/25/2014 | US8896119 Bonding material for semiconductor devices |
| 11/18/2014 | US8888932 Indium-containing lead-free solder for vehicle-mounted electronic circuits |
| 11/18/2014 | US8887980 Method of soldering portions plated by electroless Ni plating |
| 11/13/2014 | US20140332404 Process for Producing High-Purity Tin |
| 11/11/2014 | US8882934 Solder powder, and solder paste using solder powder |
| 10/16/2014 | US20140308158 Solid metal alloy |
| 10/09/2014 | WO2014163167A1 Lead-free solder alloy and in-vehicle electronic circuit |
| 10/02/2014 | WO2014157178A1 Power module |
| 09/30/2014 | US8845826 Lead-free solder for vehicles and a vehicle-mounted electronic circuit using the solder |
| 09/18/2014 | WO2014142153A1 Solder alloy and joint thereof |
| 09/16/2014 | US8834747 Compositions containing tin nanoparticles and methods for use thereof |
| 08/26/2014 | US8816215 Disk with an electrical connection element |
| 08/26/2014 | US8816214 Disk with an electrical connection element |
| 08/19/2014 | US8810035 Semiconductor bonding structure body and manufacturing method of semiconductor bonding structure body |
| 08/13/2014 | CN101960650B 非水电解质二次电池和电池组 The non-aqueous electrolyte secondary cells and batteries |
| 08/06/2014 | EP2761043A1 White metal babbitt for rolling mill bushing |
| 08/06/2014 | CN102409299B 一种氧化物陶瓷溅射靶的制备方法 Method for preparing a sputtering target of oxide ceramic |
| 07/31/2014 | WO2014114225A1 Pb-FREE SOLDER ALLOY |
| 07/30/2014 | EP2759622A1 Metal material for electronic components and method for producing same |
| 07/30/2014 | CN102912278B 一种无铅喷金料 A lead-free sprayed the material |
| 07/30/2014 | CN102834536B 金属-碳组合物 Metal - carbon composition |
| 07/23/2014 | EP2757168A1 Electroconductive material, and connection method and connection structure using same |
| 07/23/2014 | EP2756913A1 Electroconductive material, and connection method and connection structure using same |
| 07/09/2014 | CN103912584A 滑动构件及使用该滑动构件的轴承装置 The slide member and the bearing means using the sliding member |
| 07/08/2014 | CA2641812C Lead-free solder alloy for high-temperature environments |
| 07/03/2014 | WO2014103955A1 Power module |
| 07/03/2014 | WO2014103934A1 Power module |
| 07/03/2014 | WO2014103916A1 Protective element |
| 07/02/2014 | EP2750173A2 Power semiconductor element bonded to a substrate by a Sn-Sb-Cu solder and manufacturing method therefor |
| 07/02/2014 | EP2749661A1 Slide member and bearing device using the same |
| 07/02/2014 | EP2747933A1 A mn doped sn-base solder alloy and solder joints thereof with superior drop shock reliability |
| 07/02/2014 | CN103907179A 回流膜、焊料凸块形成方法、焊料接合的形成方法以及半导体装置 Reflux film, the solder bump forming method, and a method for forming a solder joint of a semiconductor device |
| 07/02/2014 | CN103906598A 高冲击韧性的焊料合金 High impact toughness of solder alloys |
| 07/02/2014 | CN103906596A 具有优越的降落冲击可靠性的Mn掺杂的Sn基焊料合金及其焊缝 Superior reliability landing impact Mn-doped Sn-based solder alloy and welds |
| 07/02/2014 | CN102437319B 一种用于锂离子电池的负极材料及制备方法 Anode material for lithium-ion battery and preparation method |
| 07/02/2014 | CN102054969B 可再充电锂电池用的负极及其制造方法和可再充电锂电池 The rechargeable lithium battery and method of manufacturing the negative electrode and a rechargeable lithium battery |
| 07/01/2014 | US8765053 Sn based alloys with fine compound inclusions for Nb3Sn superconducting wires |
| 06/26/2014 | WO2014097390A1 Lead-free solder alloy |
| 06/25/2014 | CN102477501B 一种耐大气腐蚀的工业纯锡及其应用 One kind of resistance to atmospheric corrosion of commercially pure tin and its applications |
| 06/18/2014 | CN101988165B High-temperature oxidation resistant lead-free tin-coated alloy |
| 06/12/2014 | US20140158423 Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder |
| 06/11/2014 | EP2739432A1 High impact toughness solder alloy |
| 06/11/2014 | CN103855108A Copper-based composite heat conduction material and manufacturing method thereof |
| 06/05/2014 | WO2014084242A1 Low melting point brazing material |
| 06/05/2014 | WO2014084080A1 Layered solder material for bonding dissimilar electrodes, and method for bonding dissimilar electrodes to electronic components |
| 06/04/2014 | CN103842532A White metal babbitt for rolling mill bushing |
| 06/04/2014 | CN103834827A Method for preparing tin and tin alloy porous materials with controllable through holes |
| 06/04/2014 | CN103831543A Lead-free soldering material and preparing method thereof |
| 06/04/2014 | CN102776401B Preparation method of anaerobic tin based solder alloy |
| 06/04/2014 | CN102196881B Semiconductor device |
| 05/30/2014 | WO2014080895A1 Negative electrode for electrical device and electrical device provided with same |
| 05/30/2014 | WO2014080893A1 Negative electrode for electrical device and electrical device provided with same |
| 05/30/2014 | WO2014080892A1 Negative electrode for electrical device and electrical device provided with same |
| 05/30/2014 | WO2014080887A1 Negative electrode for electrical device, and electrical device using same |
| 05/30/2014 | WO2014080886A1 Negative electrode for electrical device, and electrical device using same |
| 05/30/2014 | WO2014080885A1 Negative electrode for electrical device, and electrical device using same |
| 05/30/2014 | WO2014080883A1 Negative electrode for electrical device, and electrical device using same |
| 05/21/2014 | CN103814158A 电子部件用金属材料及其制备方法 Electronic components with a metal material and method |
| 05/21/2014 | CN103801853A 一种太阳能光伏组件用无铅锡基焊料及其制备方法 A solar photovoltaic modules based solder with lead-free solder and its preparation method |
| 05/21/2014 | CN102066044B 焊锡材料及电子部件接合体 Solder materials and electronic components assembly |
| 05/15/2014 | US20140130698 Ecological ammunition |
| 05/14/2014 | CN103797139A 导电性材料、使用该导电性材料的连接方法和连接结构物 A conductive material, the conductive material using a connection method and connection structure |
| 05/14/2014 | CN103796788A 导电性材料、使用该导电性材料的连接方法和连接结构物 A conductive material, the conductive material using a connection method and connection structure |
| 05/08/2014 | WO2014069357A1 Method for producing low α-emitting bismuth, low α-emitting bismuth, and bismuth alloy |
| 05/08/2014 | WO2014069132A1 Solder ball, agglomeration limiting device, and agglomeration limiting method |
| 05/08/2014 | DE102012220306A1 Werkstoff mit einer Halb-Heusler-Legierung und Verfahren zum Herstellen eines solchen Material with a half-Heusler alloy and method for producing such |
| 05/07/2014 | CN103781930A 生态弹药 Ecological ammunition |