| Patents for C22C 13 - Alloys based on tin (1,972) |
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| 02/07/2002 | US20020015659 Pb-free soldering alloy |
| 01/24/2002 | US20020009384 Solder material |
| 01/23/2002 | EP0933010B1 Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards |
| 01/09/2002 | CN1329964A Leadless soldering tin alloy |
| 01/02/2002 | EP1166938A2 PB-free soldering alloy |
| 01/02/2002 | CN1076998C Soft solder and electronic component using the same |
| 12/27/2001 | US20010055697 Electrically conductive metal tape and plug connector made of it |
| 12/12/2001 | EP1162282A2 Titanium alloy |
| 12/05/2001 | CN1325156A Conductive metal band and plug-in connector made therefrom |
| 12/05/2001 | CN1325155A Conductive metal band and plug-in connector |
| 11/28/2001 | EP1158618A2 Metal strip with high electric conductibility and connector made from it |
| 11/28/2001 | EP1157820A1 Metal strip with high electric conductibility and connector made from it |
| 11/22/2001 | DE10025107A1 Elektrisch leifähiges Metallband und Steckverbinder Electric leifähiges metal band and Connectors |
| 11/22/2001 | DE10025106A1 Elektrisch leitfähiges Metallband und Steckverbinder hieraus Electrically conductive metal tape and connectors thereof |
| 11/20/2001 | US6319461 Lead-free solder alloy |
| 11/14/2001 | CN1321784A High density rod grid array connection and method thereof |
| 11/14/2001 | CN1074701C 钎料合金 Solder alloy |
| 11/13/2001 | US6316061 Half bearing and method for the production thereof |
| 11/07/2001 | EP1151145A1 Plain bearing |
| 11/01/2001 | US20010036420 Tensile strength, elongation |
| 10/31/2001 | EP1149179A1 A metal alloy for electrical connections with nul contact tension |
| 10/30/2001 | US6309760 Bearing material |
| 10/18/2001 | WO2001077403A1 Metal or metal alloy based sputter target and method for the production thereof |
| 10/11/2001 | DE10017414A1 Sputtertarget auf der Basis eines Metalls oder einer Metalllegierung und Verfahren zu dessen Herstellung Sputtering target on the basis of a metal or a metal alloy and process for its preparation |
| 10/04/2001 | US20010025875 Solder, solder paste and soldering method |
| 10/02/2001 | US6296722 Lead-free solder alloy |
| 09/19/2001 | CN1313993A Electronic component, and electronic apparatus in which the electronic component is mounted and its manufacturing method |
| 09/19/2001 | CN1313802A Lead-free solder |
| 09/17/2001 | WO2001070448A1 Lead-free solder alloy |
| 08/30/2001 | US20010018030 A solder comprising 2.0 to 3.5 wt % of silver, 5 to 18 wt % of bismuth and rest is tin; used for soldering an electronic part to a circuit board |
| 08/23/2001 | US20010016267 Composite multilayer material for plain bearings |
| 08/22/2001 | EP1125480A1 Method for assembling electronic components on a support and resulting device |
| 08/02/2001 | WO2001054851A2 Microfluid device and ultrasonic bonding process |
| 07/31/2001 | US6267823 Solder, solder paste and soldering method |
| 07/18/2001 | CN1304344A Leadless solder |
| 07/04/2001 | EP1113180A2 Laminated structure for sliding bearing |
| 06/28/2001 | WO2001047014A1 Organic flip chip packages with an array of through hole pins |
| 06/13/2001 | EP1106301A1 Lead-free solder |
| 06/13/2001 | EP0977900A4 Lead-free solder |
| 06/07/2001 | US20010002982 High strength; for microelectronic applications |
| 05/30/2001 | EP1103995A1 Electronic component, and electronic apparatus in which the electronic component is mounted and its manufacturing method |
| 05/30/2001 | EP1103337A1 Tin-bismuth-based lead-free solder |
| 05/23/2001 | DE19953670A1 Lotlegierung Solder alloy |
| 05/17/2001 | WO2001034860A1 Soldering alloy |
| 05/08/2001 | US6229248 Tin, antimony, silver, and copper; electronics |
| 05/08/2001 | US6228322 Acid digestion of potliner containing compounds af cyanide,iron,calcium,and magnesium,alumina,carbon,silica and sodium sulfate and recovering calcium,iron and magnesium chlorides |
| 05/03/2001 | WO2001031074A1 A metal alloy for electrical connections with nul contact tension |
| 05/01/2001 | US6224690 Copper-free layer of nickel, cobalt, iron or alloys thereof; solder balls of tin and bismuth, silver, and/or antimony; avoids alpha-particle emission and soft logic errors |
| 04/25/2001 | CN1292316A Rare earth contained tin base lead-less solder and its preparation method |
| 04/24/2001 | US6220501 Metallic substrates are coated with an undercoat alloy of tin and zinc and contacted with each other through a mixture containing zinc and tin and flux, heating substrate to melt the solder, solidififying to join metallic member |
| 04/19/2001 | US20010000321 Solder alloy composition |
| 04/04/2001 | EP1088615A2 Sn-Ag-Cu solder and surface treatment and parts mounting methods using the same |
| 03/27/2001 | US6207298 Connector surface-treated with a Sn-Ni alloy |
| 03/21/2001 | EP1084281A1 Tin alloy wheel balancing weights |
| 03/14/2001 | EP1083246A1 Conversion coating of tin with cobalt and bismuth for aluminum sliding surfaces |
| 03/14/2001 | EP1083020A2 Tin-silver-based soldering alloy |
| 03/14/2001 | CN1287694A Electrode material for negative pole for lithium secondary cell, electrode structure using said electrode material, lithium secondary cell using said electrode structure |
| 03/07/2001 | EP1080824A1 Leadless solder |
| 03/06/2001 | US6197253 Lead-free and cadmium-free white metal casting alloy |
| 02/22/2001 | WO2001013687A1 Method for assembling electronic components on a support and resulting device |
| 02/20/2001 | US6190606 Solid amalgamating compositions for the preparation of dental amalgams, amalgam forming compositions containing them, methods for producing dental amalgams with them and dental amalgams produced thereby |
| 02/13/2001 | US6187114 Solder material and electronic part using the same |
| 02/07/2001 | EP1073539A1 Lead-free solder alloy powder paste use in pcb production |
| 01/31/2001 | CN1282286A Pb-free solder-connected structure and electronic device |
| 01/30/2001 | US6180264 Soldered article |
| 01/30/2001 | US6180253 Brazing or soldering material and production method thereof |
| 01/30/2001 | US6180055 Copper, nickel, tin alloy |
| 01/25/2001 | DE19963385C1 Composite material layer for sliding bearings has a sliding layer made of a tin matrix in which tin-copper particles are embedded |
| 01/23/2001 | US6176947 Lead-free solders |
| 01/18/2001 | WO2001003878A1 Solder alloy |
| 01/18/2001 | WO2001003873A1 Method for plugging a hole and a cooling element manufactured by said method |
| 12/21/2000 | WO2000076717A1 Lead-free solder |
| 12/21/2000 | CA2340393A1 Lead-free solder |
| 12/14/2000 | WO2000075940A1 Electronic component, and electronic apparatus in which the electronic component is mounted and its manufacturing method |
| 12/12/2000 | US6160224 Solder material containing from 0.01 to 4.99% by weight of iron, 0.01 to 4.99% by weight of nickel, 0.1 to 8.0% by weight of at least one of silver and indium; 0 to 70% by weight of lead, balance containing tin; heat fatigue resistance |
| 11/02/2000 | EP1048392A1 Pb-FREE SOLDER-CONNECTED STRUCTURE AND ELECTRONIC DEVICE |
| 10/31/2000 | US6139979 Lead-free solder and soldered article |
| 10/31/2000 | US6139191 Half bearing |
| 10/11/2000 | EP1043112A1 Lead-free solder |
| 10/10/2000 | US6129996 Conversion coatings of tin with cobalt and bismuth for aluminum sliding surfaces |
| 09/27/2000 | EP1039568A1 Electrode material for negative pole of lithium secondary cell, electrode structure using said electrode material, lithium secondary cell using said electrode structure, and method for manufacturing said electrode structure and said lithium secondary cell |
| 09/26/2000 | US6123248 Soldering method and soldering apparatus |
| 09/21/2000 | WO2000054927A1 Leadless solder |
| 09/21/2000 | CA2332587A1 Leadless solder |
| 09/12/2000 | CA2095258C Lead-free alloy containing tin, silver and indium |
| 08/31/2000 | DE19905213A1 Gleitlager Plain bearings |
| 08/29/2000 | US6110608 The first and second plated layers are made of a sn substance and a sn alloy; lead-free |
| 08/24/2000 | WO2000048784A1 Lead-free solder alloy powder paste use in pcb production |
| 08/17/2000 | WO2000047788A1 Plain bearing |
| 08/15/2000 | US6103967 Thermoelectric module and method of manufacturing the same |
| 08/10/2000 | DE19916618A1 Bleifreies Lötmittel und gelöteter Gegenstand Lead-free solder and soldered object |
| 08/09/2000 | CN1262638A Leadless solder |
| 08/09/2000 | CN1262159A Leadless solder and welding product |
| 07/11/2000 | US6086687 Lead-free tin alloy |
| 06/28/2000 | EP1012354A1 Lead-free tin alloy |
| 05/31/2000 | EP1004683A1 Bearing material |
| 05/10/2000 | CN1252842A Lead-free solder |
| 05/04/2000 | WO2000024544A1 Lead-free solder |
| 04/18/2000 | US6050480 Solder paste for chip components |
| 03/30/2000 | WO2000017948A1 Electrode material for negative pole of lithium secondary cell, electrode structure using said electrode material, lithium secondary cell using said electrode structure, and method for manufacturing said electrode structure and said lithium secondary cell |