Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472)
07/2014
07/09/2014CN103911105A 一种改性环氧树脂胶粘剂及其制备方法 A modified epoxy resin adhesive and its preparation method
07/09/2014CN103911089A 一种铜纳米线导电胶及其制备方法 A copper nanowires conductive plastic and its preparation method
07/09/2014CN102775947B 一种基于环氧树脂的路面耐磨层及制备方法 An epoxy pavement wear layer and preparation method based on
07/09/2014CN102516717B 热塑性弹性体增韧环氧树脂、制备及应用 Thermoplastic elastomer toughened epoxy resin, preparation and application
07/09/2014CN102399502B 太阳能电池电极用粘接膜及使用其的太阳能电池模块的制造方法 A solar cell electrode manufacturing method thereof using a solar cell module with an adhesive film
07/09/2014CN102286261B Led用氨基固化体系环氧功能化有机硅导电胶粘剂 Led curing system with amino functional silicone conductive epoxy adhesive
07/03/2014WO2014104741A1 Epoxy resin composition having excellent adhesive properties and resin composite copper foil using same
07/03/2014WO2014104046A1 Thermally-conductive, electrically-conductive adhesive composition
07/03/2014WO2014103637A1 Adhesive agent, adhesive film, and semiconductor device and method for manufacturing same
07/03/2014WO2014103569A1 Conductive adhesive composition and electronic element using same
07/03/2014WO2014103552A1 Liquid epoxy resin composition
07/03/2014WO2014103040A1 Adhesive composition and bonding sheet using same
07/03/2014WO2013124574A3 Biosourced epoxide resins having improved reactivity
07/03/2014US20140187674 Resin composition with enhanced heat-releasing properties, heat-releasing film, insulating film, and prepreg
07/03/2014US20140186607 Adhesive composition for a semiconductor, adhesive film prepared from the composition, and semiconductor device connected by the film
07/02/2014EP2748245A1 Indicator for cure of two-component-epoxy adhesives
07/02/2014EP2748223A1 Toughener and toughened epoxy adhesive
07/02/2014EP2748217A1 Curing agent for moisture-curing compositions
07/02/2014CN103897645A 一种封框胶及其制备方法 A blocked plastic box and its preparation method
07/02/2014CN103897644A 一种有机硅改性环氧树脂封装胶的制备方法 Preparation of a silicone-modified epoxy resin adhesive
07/02/2014CN103897643A 室温固化耐高热环氧胶粘剂 Room temperature curing epoxy adhesive heat-resistant
07/02/2014CN103897642A 一种家庭装修用防水密封材料 A home decoration waterproof sealant
07/02/2014CN103897145A 一种憎水性环氧树脂固化剂及其制备方法 A hydrophobic epoxy curing agent and its preparation method
07/02/2014CN103242791B 一种tgbapopp型耐高温粘合剂及其制备方法 One kind tgbapopp-temperature adhesive and its preparation method
07/02/2014CN103242790B 一种耐高温云母带粘合剂及其制备方法 A high temperature mica binder and its preparation method
07/02/2014CN103224767B 单组份环氧树脂密封胶 Component epoxy sealant
07/02/2014CN103173175B 一种有机硅改性环氧树脂密封胶及其制备方法 One silicone-modified epoxy sealant and preparation method
07/02/2014CN103131373B 一种用于单面薄膜补强少胶云母带的复合胶及其制备方法 A little one-sided film reinforced mica tape adhesive glue method for its preparation
07/02/2014CN103131371B 4,4'-双(2,4-二氨基苯氧基)二苯甲烷型耐高温环氧胶粘剂及其制备方法 4,4'-bis (2,4-aminophenoxy) diphenyl methane-temperature epoxy adhesive and its preparation method
07/02/2014CN103131369B 4,4'-双(2,4-二氨基苯氧基)二苯砜型耐高温环氧胶粘剂及其制备方法 4,4'-bis (2,4-aminophenoxy) diphenyl sulfone-temperature epoxy adhesive and its preparation method
07/02/2014CN103122232B 2,2-双[4-(2,4-二氨基苯氧基)苯基]丙烷型耐高温环氧胶粘剂及其制备方法 2,2-bis [4- (2,4-aminophenoxy) phenyl] propane-temperature epoxy adhesive and its preparation method
07/02/2014CN103122231B 1,4-双(2,4-二氨基苯氧基)苯型耐高温环氧胶粘剂及其制备方法 1,4-bis (2,4-aminophenoxy) benzene-temperature epoxy adhesive and its preparation method
07/02/2014CN102994031B 一种环氧类胶黏剂 An epoxy type adhesive
07/02/2014CN102925100B 一种高导热性能导电银胶及其制备方法 A high-performance thermal conductive silver paste and its preparation method
07/02/2014CN102925090B 一种用于电磁屏蔽的导电银胶的制备方法 A process for producing an electromagnetic shielding conductive silver paste for
07/02/2014CN102863936B 一种加热固化型双组分环氧灌封胶及其制备方法 A curing two-component epoxy potting heating and preparation method
07/02/2014CN102653623B 吸入环氧树脂的聚合物颗粒 Epoxy polymer particles of respirable
06/2014
06/26/2014WO2014100239A2 Non-isocyanate sealant for glass sealing
06/26/2014WO2014095139A1 Use of substituted benzyl alcohols in reactive epoxy systems
06/26/2014WO2013142751A3 Flame retardant structural epoxy resin adhesives and process for bonding metal members
06/26/2014DE102012025434A1 Mounting membrane on solid carrier element comprises providing joining portion of membrane having seam made from yarn, applying adhesive on joining portion and/or on another joining portion of carrier, and producing adhesive bond
06/26/2014DE102012025256A1 Use of new or known methoxy-ethane compound as comonomer in epoxy resin used as hardenable dental filler material, root canal filling material as insulator material, preferably composite adhesive for filling and/or sealing root canals
06/25/2014EP2744867A1 Hot melt composition
06/25/2014EP2744800A1 Energy curable bonding resin
06/25/2014CN103882789A 一种道路或桥梁路面的修复工艺 A road or bridge repair technology road
06/25/2014CN103881642A 具有良好粘结特性的耐热音圈骨架用涂覆胶及其制备方法 Heat-resistant voice coil bobbin having good adhesion properties coated with glue and preparation method
06/25/2014CN103881638A 太阳能电池硅片切割工艺用胶 Solar wafer cutting process with plastic
06/25/2014CN103881637A 一种塑料粘合剂 A plastic binder
06/25/2014CN103881636A 变压器渗漏的现场带油密封材料及使用方法 Transformer leakage field with oil sealing material and method of use
06/25/2014CN103881635A 可在180℃下使用的胶粘剂的制备方法及胶粘剂 Can be prepared for use at 180 ℃ adhesive and adhesive
06/25/2014CN103881629A 封框胶、显示面板及显示装置 Sealed plastic box, the display panel and display device
06/25/2014CN103881611A 一种常温导电胶及其制备方法 One kind of conductive adhesive at room temperature and its preparation method
06/25/2014CN103881610A 一种导电胶及其制备方法 A conductive adhesive and a method for preparing
06/25/2014CN103881609A 导电胶粘剂的制备方法及用该方法获得的导电胶粘剂 Preparation of conductive adhesives and conductive adhesives obtained by this method
06/25/2014CN102977829B 一种无卤阻燃环氧树脂组合物、胶带及其制备方法 Halogen-free flame-retardant epoxy resin composition, tape and its preparation method
06/25/2014CN102558765B 无卤阻燃高导热绝缘树脂组合物及一种散热金属基覆铜板 High thermal insulation flame retardant resin composition and A heat sink metal-based CCL
06/24/2014US8759422 B-stageable and skip-curable wafer back side coating adhesives
06/24/2014US8758549 One component epoxy resin composition
06/19/2014WO2014093414A1 Reactive film adhesive
06/19/2014WO2014092022A1 Siloxane resin remover, siloxane resin removal method using siloxane resin remover, semiconductor substrate product and semiconductor element manufacturing method
06/19/2014US20140171552 Indicator for cure of two-component-epoxy adhesives
06/19/2014US20140171550 Epoxy resin with enhanced viscosity stability and use thereof
06/18/2014DE102012223387A1 Verwendung von substituierten Benzylalkoholen in reaktiven Epoxy-Systemen Use of substituted benzyl alcohols in reactive epoxy systems
06/18/2014CN103874739A Thermally conductive pressure-sensitive adhesive composition, thermally conductive pressure-sensitive adhesive sheet-form molded body, manufacturing method of these, and electronic component
06/18/2014CN103874693A Energy curable bonding resin
06/18/2014CN103866576A Resin-based nano high-strength and high-modulus protective composite material and preparation method thereof
06/18/2014CN103865472A Flame retardant environment-friendly polysulfide sealant and production method of sealant
06/18/2014CN103865470A Light-curing edge sealing adhesive
06/18/2014CN103865463A Adhesive composition for liquid crystal display, preparation method and usage method
06/18/2014CN103865461A Adhesive
06/18/2014CN103865460A Resin composition as well as preparation method and application thereof
06/18/2014CN103865450A Modified adhesive and application of the same in optical glass
06/18/2014CN103865446A Acrylic adhesive composition, polarizing plate, and liquid crystal display
06/18/2014CN103865437A Adhesive for adhering rubber and metal and preparation method thereof
06/18/2014CN103865034A Polymerizable epoxy composition, and sealing material composition comprising the same
06/18/2014CN103339214B Polyurethane adhesive, adhesive for solar cell protective sheet, and backside protective sheet for solar cell
06/18/2014CN103242797B Polyimide adhesive
06/18/2014CN102782074B Resin composition for adhesive agent, adhesive agent comprising the resin composition, adhesive sheet, and printed wiring board involving the adhesive sheet as adhesive layer
06/17/2014CA2523957C Sequestered reactive materials
06/12/2014WO2014089323A1 Pressure sensitive adhesives prepared from maleated vegetable oils and expoxidized vegetable oils
06/12/2014WO2014088095A1 Conductive material, connection structure and method for producing connection structure
06/12/2014US20140162044 Adhesive film for polarizing plate, adhesive composition for the same, polarizing plate comprising the same, and optical display apparatus comprising the same
06/11/2014CN103849374A Fracturing propping agent and preparation method thereof
06/11/2014CN103849370A Fracturing propping agent and its preparation method
06/11/2014CN103849369A Fracturing propping agent and its preparation method
06/11/2014CN103849347A Conducting resin for LED encapsulation
06/11/2014CN103849327A Adhesive material for electric connection, display device using the adhesive material and method of fabricating the display device
06/11/2014CN103849116A Hydrophobic resin composition and preparation method and application thereof
06/11/2014CN103848959A Curing agent composition and its preparation method and application
06/11/2014CN103848958A Hydrophilic resin composition, and preparation method and application thereof
06/11/2014CN103848957A Hydrophobic resin composition and preparation method and application thereof
06/11/2014CN103848956A Hydrophilic resin composite and preparation method and application thereof
06/11/2014CN103848955A Hydrophobic resin composition, and preparation method and application thereof
06/11/2014CN103848953A Synthetic method and application of active diluent
06/11/2014CN102965062B Normal-temperature curing type flame-retardant anti-cracking low-halogen epoxy pouring sealant for automotive ignition coil
06/11/2014CN102660210B Halogen-free high heat-resistant and heat-conducting resin film and manufacturing method thereof
06/11/2014CN102634313B Epoxy conductive resin applicable to binding of LED (light-emitting diode) chips, and preparation method thereof
06/11/2014CN102597044B Thermopolymerization initiator system and adhesive composition
06/11/2014CN102471459B Epoxy resin-based compositions modified for impact resistance
06/10/2014US8747730 Method of forming a woven fiber structure using a tackifier composition
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