Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
04/2012
04/03/2012US8148831 Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device
04/03/2012US8147964 Benzylated polyalkylene polyamines and uses thereof
03/2012
03/29/2012WO2012040094A2 Chemical vapor resistant epoxy composition
03/29/2012WO2012039456A1 Epoxy resin composition for fiber-reinforced composite material, prepreg, and fiber-reinforced composite material
03/29/2012WO2012039324A1 Heat-conductive resin composition, resin sheet, resin-clad metal foil, cured resin sheet, and heat-dissipating member
03/29/2012US20120077943 Low Temperature Curable Epoxy Compositions
03/29/2012US20120077905 Biodegradable Polymer Composition
03/29/2012US20120077904 Epoxy Resin Composition
03/29/2012US20120077893 Premixes Suitable for the Production of Membrane Materials
03/29/2012US20120077401 Resin composition for production of clad layer, resin film for production of clad layer utilizing the resin composition, and optical waveguide and optical module each utilizing the resin composition or the resin film
03/29/2012US20120074430 Radiating substrate and method for manufacturing the radiating substrate, and luminous element package with the radiating substrate
03/29/2012US20120074353 Use of molecules having associative groups as hardeners for thermosetting resins
03/29/2012US20120074265 Nano-reinforced radius filler for an aircraft structure and a method of producing an aircraft structure comprising such filler
03/29/2012DE102011009873A1 Reaktivharze und damit hergestellte Formkörper und flächige oder textile Materialien mit teilchenförmigen Polysilazanen als neuen Flammfestmachern Reactive resins and produced thereby molding and surface or textile materials with particulate Polysilazanes as new flame mooring
03/29/2012DE102010041594A1 Füllstoff zur Steuerung von elektrischen Potentialen in Transformatoren, Generatoren oder dergleichen Filler for the control of electric potentials in transformers, generators or the like
03/29/2012CA2810710A1 Epoxy resin composition for fiber-reinforced composite material, prepreg, and fiber-reinforced composite material
03/29/2012CA2806243A1 Chemical vapor resistant epoxy composition
03/28/2012EP2433985A2 Improved epoxy systems for composites
03/28/2012EP2432790A1 Dopo-derived flame retardant and epoxy resin composition
03/28/2012EP1651432B1 A metal-polyamide/polyethylene-metal laminate
03/28/2012CN102395614A Photosensitive polyester composition for use in forming thermally cured film
03/28/2012CN102395555A Olefin resin, epoxy resin, curable resin composition, and material resulting from curing same
03/28/2012CN102391620A Epoxy resin matrix nano-zinc oxide composite material and preparation method thereof
03/28/2012CN102391619A Preparation method of permeation resistant addition agent with functions of reinforcing stiffness and wet-strength
03/28/2012CN102391618A Preparation method of alignment carbon nano tube/polymer composite membrane
03/28/2012CN102391617A Human body canal cast filler and preparation method thereof
03/28/2012CN102391547A Glass fiber product and glass fiber reinforced plastic
03/28/2012CN102391545A Nitrogen and phosphorus containing flame retardant agent and preparation method thereof as well as application thereof
03/28/2012CN102391543A Method for recovering carbon-fiber enhanced epoxy resin composite material
03/28/2012CN102391501A High-strength super-toughness casting nylon piling machine cushion and preparation method thereof
03/28/2012CN102391474A Resin joint sealing material for deck pavement and repair of steel bridge
03/28/2012CN102391473A Preparation method for anhydride cured epoxy resin/palygorskite nanocomposite material
03/28/2012CN102390145A Environment-friendly copper clad laminate and preparation method thereof
03/28/2012CN101935436B Preparation method and application of cured nano-structured epoxy resin
03/28/2012CN101885922B Polymer material with two-photon amplitude limiting characteristic and preparation method and usage thereof
03/28/2012CN101781443B Thermosetting solder masking film composite
03/28/2012CN101768330B Ingredient for preparing transparent flame-retardant epoxy resin
03/28/2012CN101585956B Epoxy resin system for casting process of wind electricity generation vanes
03/28/2012CN101553910B Sealing material and mounting method using the sealing material
03/27/2012US8143357 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
03/27/2012US8143331 Alkylated polyalkyleneamines and uses thereof
03/22/2012WO2012036696A1 Hydrogenated bisphenol-a-based polymers as substitutes for bisphenol-a-based polymers
03/22/2012WO2012035828A1 Manufacturing method for thermoplastic resin composition
03/22/2012WO2011136568A3 Environmentally friendly water-based epoxy resin composition and a use therefor
03/22/2012US20120071586 Nanoparticle pultrusion processing aide
03/22/2012US20120071585 Epoxy resin composition, prepreg and fiber-reinforced composite material
03/22/2012US20120068115 High molecular weight, random, bisphenol based copoly(phosphonate carbonate)s
03/21/2012EP2431414A1 Paste composition and printed circuit board
03/21/2012EP2430091A2 Composite of a polymer and surface modified hexagonal boron nitride particles
03/21/2012EP2430083A2 A film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles
03/21/2012CN1944026B Epoxy resin for prepreg, prepreg, fiber-reinforced composite material, and processes for producing these
03/21/2012CN102388100A Liquid sealing resin composition, semiconductor device using liquid sealing resin composition, and method for producing same
03/21/2012CN102388096A Direct overmolding
03/21/2012CN102388079A One-pack type cyanate-epoxy composite resin composition
03/21/2012CN102387661A Circuit board substrate and manufacture method thereof
03/21/2012CN102386111A Method for manufacturing electronic parts device and resin composition for electronic parts encapsulation
03/21/2012CN102383305A Method for modifying surface of carbon fiber
03/21/2012CN102382625A Modified dicyclopentadiene dioxide epoxy resin potting material and preparation method thereof
03/21/2012CN102382422A Epoxy resin composition with hydrated alumina
03/21/2012CN102382421A Liquid epoxy resin packaging material and preparation method thereof
03/21/2012CN102382420A High CTI (Comparative Tracking Index) epoxy resin composition for printed circuit copper-clad plate
03/21/2012CN102382385A Method for preparing thermal neutron scintillator conversion screen by tablet press
03/21/2012CN102382320A Method for preparing carbon nanotube grafted glass fiber multiscale reinforcement reinforced epoxy resin composite
03/21/2012CN102382314A Preparation method and application of modified organic silicon resin
03/21/2012CN102382282A Flexible curing agent applicable to electronic packaging material and synthesis method thereof
03/21/2012CN102382281A Resin composition, resin-based composite material and preparation method of the resin-based composite material
03/21/2012CN102040744B Mixed salt flame retardant of phosphoric acid, gluconic acid and melamine and preparation method thereof
03/21/2012CN101831145B Aqueous epoxy resin and preparation method thereof
03/20/2012US8138278 Polymer compositions and methods of making and using same
03/20/2012US8138276 Silicone containing encapsulant
03/15/2012WO2012033164A1 Curable resin composition
03/15/2012WO2012031537A1 Epoxy resin composition and copper clad laminate manufactured by using same
03/15/2012US20120065299 Reactive graphtic carbon nanofiber reinforced polymeric composites
03/15/2012US20120065297 Flame retardant halogenated phenyl ethers
03/15/2012US20120065295 Curable System
03/15/2012US20120064788 Low Density And High Strength Fiber Glass For Reinforcement Applications
03/15/2012US20120061861 Resin composition for encapsulating semiconductor and semiconductor device
03/15/2012US20120061125 Resin material and high voltage equipment using the resin material
03/15/2012US20120060678 Low Density And High Strength Fiber Glass For Ballistic Applications
03/15/2012DE102010040762A1 Inorganic-organic polymer hybrid network, useful for preparing shape memory polymer, comprises hydroxyl group-containing thermoplastically processable polymer, nanoscale metal compounds, and reactive compounds
03/14/2012EP2428539A1 Polyamideimide-based film coating composition
03/14/2012EP2427517A1 Curable system
03/14/2012CN202164743U 缓粘结预应力钢筋 Slow bonded prestressing steel
03/14/2012CN102378790A Epoxy resin composite
03/14/2012CN102378561A Covering membrance with electromagnetic shielding function and manufacturing method of covering membrance
03/14/2012CN102378482A Circuit board substrate and manufacturing method thereof
03/14/2012CN102378480A Substrate of circuit board and manufacturing method thereof
03/14/2012CN102376616A Film for semiconductor back surface, dicing tape-integrated film for semiconductor back surface, method for producing semiconductor device, and flip chip type semiconductor device
03/14/2012CN102376615A Film for semiconductor back surface,dicing tape-integrated film for semiconductor back surface, method for producing semiconductor device, and flip chip type semiconductor device
03/14/2012CN102374340A High-strength composite material cable holder
03/14/2012CN102372912A Resin ingredient for producing glass reinforced plastic anchor stock, preparation method and preparation device thereof
03/14/2012CN102372903A Halogen-free phosphorus-free thermosetting resin composition
03/14/2012CN102372902A Epoxy resin enhanced high-temperature resistant polyethylene cable material and preparation method thereof
03/14/2012CN102372901A Hydantoin epoxy resin composite for encapsulating semiconductor devices
03/14/2012CN102372900A Epoxy resin composition, and prepreg material and printed circuit board prepared from the same
03/14/2012CN102372899A Flame-retarding green epoxy molding compound
03/14/2012CN102372836A Method for manufacturing cured product of thermosetting resin composition and cured product obtained thereby
03/14/2012CN102372734A Synthesis of novel nano hybrid reinforcing agent containing POSS
03/14/2012CN101432363B Polyamide resin composition
03/14/2012CN101319041B Polyalkyleneamine adducts as curing agents for thick layer water-based epoxy systems
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