Patents
Sitemap › C08 - Organic macromolecular compounds; Their preparation or chemical working-up; Compositions based thereon › C08L - Compositions of macromolecular compounds › C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
05/2012
05/16/2012CN102453226A Resin composition, and prepreg and printed circuit board made from same
05/16/2012CN102453225A Thermosetting resin composition and its application in prepreg film or laminated plate
05/16/2012CN102453218A Preparation method of composite silane coupling agent modified silicon micropowder
05/16/2012CN101914270B Special Anti-yellowing PBT (Polybutylene Terephthalate) plastic shell material of energy-saving lamp with lampshade and production method thereof
05/16/2012CN101885860B Expansible composite flame retardant and flame retardant material containing same
05/16/2012CN101528781B Paste composition for light guide and light guide utilizing the same
05/15/2012US8178599 Composition of epoxy resin, spherical alumina, ultrafine silica polyorganosiloxane and phenolic resin
05/15/2012US8178598 Polyoxyalkylene polyamide-glycidyl ether adduct epoxy resin curing agent
05/10/2012WO2012059558A1 Epoxy-thiol compositions with improved stability
05/10/2012US20120115990 Adduct thermosetting surfacing film and method of forming the same
05/10/2012US20120115989 Method of forming nanodielectrics
05/10/2012US20120115988 Catalysis of epoxy resin formulations having sparingly soluble catalysts
05/10/2012US20120115987 Radiation curable compositions
05/10/2012US20120115972 Curing resin composition
05/10/2012US20120115388 Compatible carrier for secondary toughening
05/10/2012US20120111621 Resin composition, resin sheet, prepreg, metal-clad laminate, printed wiring board and semiconductor device
05/10/2012US20120111618 Flame retardant resin composition for multilayer wiring board and multilayer wiring board including the same
05/09/2012EP2448990A1 Polymer compositions and methods of making and using same
05/09/2012CN1962754B Thermosetting resin composition and method of producing the same
05/09/2012CN102449020A Resin composition for semiconductor encapsulation, and semiconductor device
05/09/2012CN102449019A Polymeric glycidyl ethers reactive diluents
05/09/2012CN102449018A Epoxy resin composition, prepreg and fiber-reinforced composite material
05/09/2012CN102449010A Diblock copolymer modified nanoparticle-polymer nanocomposites for electrical insulation
05/09/2012CN102448251A Multilayer single-face aluminum-based circuit board and manufacturing method thereof
05/09/2012CN102443274A CNT (carbon nano tube)/macromolecule composite film and preparation method thereof
05/09/2012CN102443273A Emulsified asphalt containing epoxy resin and preparation method thereof
05/09/2012CN102443272A Room-temperature asphalt containing epoxy resin and preparation method thereof
05/09/2012CN102443255A Fiber reinforced plastic
05/09/2012CN102443249A Self emulsifying epoxy resin and preparation method thereof
05/09/2012CN102443248A Photo-cured halogen-free encapsulating material
05/09/2012CN102443247A Preparation method of graphene oxide grafted POSS (polyhedral oligomeric silsesquioxane) modified epoxy resin
05/09/2012CN102443246A Silicon-containing resin packaging composition
05/09/2012CN102443245A Earthquake physical model and preparation method and application thereof
05/09/2012CN102443138A Epoxy resin composition as well as prepreg and copper-foil-clad laminated board prepared by using same
05/09/2012CN102443136A Photosensitive resin, curable resin composition containing the same, dry film thereof, and printed circuit board using them
05/09/2012CN102146196B Preparation method of high damping epoxy resin composite
05/09/2012CN101935438B Resin composite for filling through hole and preparation method thereof
05/09/2012CN101838440B Non-halogen, non-phosphorous and non-silicone epoxy resin compositions and flexible copper clad laminate prepared thereby
05/09/2012CN101747533B Modification clay and clay-high polymer composite
05/09/2012CN101418205B Halogen-free flameproof adhesive and application thereof in prepreg and multiple layer printed plate
05/09/2012CN101402839B Adhesion agent for aluminum cellular composite board and method of producing the same
05/09/2012CN101289569B Method for preparing multi-wall carbon nano-tube/epoxide resin wave- absorbing and camouflage composite material
05/08/2012US8173745 Compositions useful for preparing composites and composites produced therewith
05/08/2012US8173726 Polymerization of a reactive diluent in the presence of an epoxy-amine material, and coating compositions prepared thereby
05/03/2012WO2012057171A1 Resin composition, and prepreg and laminate using same
05/03/2012WO2012057144A1 Cyanate ester compound, curable resin composition containing cyanate ester compound, and cured product thereof
05/03/2012WO2011140402A3 Potting for electronic components
05/03/2012WO2011032120A3 Underfill for high density interconnect flip chips
05/03/2012US20120108703 Surface protective agent
05/03/2012US20120108702 Process for the preparation of radiation curable compositions
05/03/2012US20120108701 Composition of a blend of polyamide and polyester resins
05/03/2012US20120108700 Air-drying polyester (meth)acrylate resin composition, structure, and method for applying the resin composition
05/03/2012US20120108132 Composite Compositions
05/02/2012EP2445949A1 Hardener composition for epoxy resins
05/02/2012CN102439089A 固化性树脂组合物 The curable resin composition of the
05/02/2012CN102439088A Benzoxazine resin composition
05/02/2012CN102433002A Thermosetting-resin-based carbon nano tube composite material and preparation method thereof
05/02/2012CN102433001A Halogen-free flame-retarding material composition and application thereof in bonding sheets, copper clad laminates and laminates
05/02/2012CN102432999A Composition for preparing thermosetting resin, cured product of the composition, prepreg and prepreg laminate having the cured product, and metal clad laminate and printed circuit board having the prepreg or the prepreg laminate
05/02/2012CN102432995A Crosslinking plasticized resin liquid and production method of glue-free type paper-print composite film
05/02/2012CN102432981A Solvent-based insulating glue, round net fetal membrane using the same and preparation method thereof
05/02/2012CN102432980A Epoxy resin composition for semiconductor packaging and preparation method thereof
05/02/2012CN102432979A Preparation method of epoxy resin-attapulgite nanocomposite material
05/02/2012CN102432896A Application and preparation method for high viscosity epoxy resin
05/02/2012CN102432873A Synthesis of inorganic/organic hybrid and modification of epoxy resin by using same
05/02/2012CN102432838A Epoxy systems for composites
05/02/2012CN102432836A Halogen-free thermosetting resin composition and prepreg and laminated board manufactured by same
05/02/2012CN102432788A High-efficiency furfural-acetone activator for grouting material, preparation method and application thereof
05/02/2012CN102432787A Modified hydrocarbylphenol-aldehyde resins for use as tackifiers and rubber compositions containing them
05/02/2012CN102432729A Modified epoxy resin by in-situ polymerization of double-bond unsaturated monomer
05/02/2012CN101914196B Curing composition for epoxy resin and preparation method and application thereof
05/02/2012CN101845167B Conductive pre-impregnated material and preparation method thereof
05/02/2012CN101735564B Vacuum infusion resin for wind turbine blades and preparation method thereof
05/02/2012CN101343412B Prepreg and laminate
05/01/2012US8168731 Curable resin composition, cured product thereof, printed wiring board, epoxy resin, and process for producing the same
05/01/2012US8168700 Electrodepositable coating compositions and related methods
05/01/2012US8168296 Benzylated polyalkylene polyamines and uses thereof
05/01/2012CA2681184C Polythioether amine resins and compositions comprising same
04/2012
04/26/2012WO2012053522A1 Sealing resin composition and electronic component device
04/26/2012US20120101191 Thermosetting resin composition for sealing packing of semiconductor, and semiconductor device
04/26/2012US20120100367 Cellulose microfibrils as air release agent
04/26/2012US20120097437 Resin Composition, and Prepreg and Printed Circuit Board Prepared Using the Same
04/25/2012EP2444437A1 Resin composition and organic-electrolyte battery
04/25/2012EP2443196A1 Self healing polymer materials
04/25/2012CN102428130A Anisotropic composite
04/25/2012CN102428124A 可固化环氧树脂组合物 The curable epoxy resin composition
04/25/2012CN102428091A Dopo衍生的阻燃剂及环氧树脂组合物 Dopo derived flame retardant epoxy resin composition, and
04/25/2012CN102427087A Photovoltaic module nonmetal easy-installation element and preparation method thereof
04/25/2012CN101722589B 利用半导电橡胶对真空浇注及apg工艺中嵌件进行表面处理的方法 Semi-conductive rubber, and the vacuum casting process apg insert surface treatment method
04/25/2012CN101608053B 热固化性树脂组合物 Heat-curable resin composition
04/25/2012CN101581146B 一种防水渗蜡环保木地板及其生产方法 A waterproof environmentally friendly wood floor wax infiltration and production method
04/25/2012CN101503558B 挠曲性、低介电损失组合物及其制造方法 Flexibility, low dielectric loss of the composition and the manufacturing method
04/25/2012CN101356643B 半导体器件 Semiconductor devices
04/25/2012CN101068846B 环氧树脂组合物及半导体器件 Epoxy resin composition and semiconductor device
04/24/2012US8163835 Anisotropic conductive adhesive composition, anisotropic conductive film comprising the same, and associated methods
04/24/2012US8163819 Adhesive compositions, micro-fluid ejection devices and methods for attaching micro-fluid ejection heads
04/24/2012CA2533481C Biodegradable polyester mixture
04/19/2012WO2012051045A2 Improving solvent resistance of epoxy resins toughened with polyethersulfone
04/19/2012WO2012050756A2 Solvent resistant thermoplastic toughened epoxy
04/19/2012WO2012050688A2 Epoxy resin adducts and thermosets thereof
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