| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 05/30/2012 | CN101955678B Flame retardant thermosetting resin composition and copper-clad plate |
| 05/30/2012 | CN101955631B Preparation method of polyaniline modified multi-wall carbon canotube/epoxy resin composite material |
| 05/30/2012 | CN101942180B Epoxy resin composition and copper clad laminate manufactured by using same |
| 05/30/2012 | CN101802105B Liquid resin composition and cured product using the liquid resin composition |
| 05/30/2012 | CN101783387B Giant magnetoresistance composite material |
| 05/30/2012 | CN101772526B Insulating resin composition for multilayer printed wiring board, insulating resin sheet with base material, multilayer printed wiring board, and semiconductor device |
| 05/30/2012 | CN101735573B Modified epoxy resin film for RFI molding process and preparation method thereof |
| 05/30/2012 | CN101679579B Crash durable epoxy adhesives with very low sensitivity to temperature variations |
| 05/30/2012 | CN101633771B Corrosion resistant films based on ethylenically unsaturated monomer modified epoxy emulsions |
| 05/30/2012 | CN101595180B A cathodic electrodeposition coating compositions having improved appearance, anti-corrosion resistance and flexibility |
| 05/30/2012 | CN101575439B Porefilling heat curing resin composition |
| 05/30/2012 | CN101544807B Epoxy anti-fouling material and preparation method and use of same |
| 05/30/2012 | CN101516993B Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| 05/30/2012 | CN101463179B Aqueous self-emulsifying epoxy resin emulsion and preparation thereof |
| 05/30/2012 | CN101445644B White hardening resin composition |
| 05/30/2012 | CN101434134B Broadband multi-layer structured wave absorbing composite material and preparation thereof |
| 05/30/2012 | CN101433134B Solder resist material, wiring board using the solder resist material, and semiconductor package |
| 05/30/2012 | CN101381506B Halogen and phosphor-free flame-proof epoxy resin composition and bonding sheet and copper clad laminate prepared thereby |
| 05/30/2012 | CN101291990B Thermosetting resin composition and use thereof |
| 05/30/2012 | CN101193959B Unsaturated polyester resin or vinyl ester resin composition |
| 05/30/2012 | CN101166789B Composition containing fluorine-containing aromatic polymer and laminated body containing fluorine-containing aromatic polymer |
| 05/30/2012 | CN101090944B Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| 05/29/2012 | US8188165 Fire-retardant low-density epoxy composition |
| 05/29/2012 | US8187703 Fiber-reinforced polymer composites containing functionalized carbon nanotubes |
| 05/24/2012 | WO2012068414A2 Structural adhesive compositions |
| 05/24/2012 | WO2012067489A1 Composition of solvent casting solution comprising polypyrrole powder for use as a transducer in biochemical sensor applications |
| 05/24/2012 | WO2012066987A1 Inorganic filler-reinforced polybutylene terephthalate resin composition and molded article of same |
| 05/24/2012 | WO2012066957A1 Conductive composition, conductive film, and method for forming conductive film |
| 05/24/2012 | WO2012015857A3 Crosslinked epoxy vinyl ester particles and methods for making and using the same |
| 05/24/2012 | WO2012011710A3 Thermosetting resin composition having good coatability and re-coatability |
| 05/24/2012 | US20120129979 Epoxy-rubber composition for cured materials |
| 05/24/2012 | US20120129978 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
| 05/24/2012 | US20120129414 Thermosetting resin composition and prepreg or laminate using the same |
| 05/24/2012 | US20120128987 Epoxy resin-based composition modified for impact resistance |
| 05/24/2012 | US20120125672 Photocurable resin composition |
| 05/24/2012 | CA2818172A1 Structural adhesive compositions |
| 05/23/2012 | EP2253666B1 Curable resin composition and cured resin |
| 05/23/2012 | CN102471561A 用于电工用层压板组合物的核/壳橡胶 For electrical laminates composition for core / shell rubber |
| 05/23/2012 | CN102471560A Energy ray-curable epoxy resin composition having excellent curing properties in deep portions |
| 05/23/2012 | CN102471534A 羟基苯基氧化膦混合物和它们作为用于环氧树脂的阻燃剂的应用 Hydroxyphenyl phosphine oxide mixture as a flame retardant for epoxy resins and their applications in |
| 05/23/2012 | CN102471495A Aluminum chelate-based latent curing agent |
| 05/23/2012 | CN102471464A Liquid resin composition and semiconductor device formed using same |
| 05/23/2012 | CN102471462A Aluminum chelate-based latent curing agents and process for preparation thereof |
| 05/23/2012 | CN102471461A Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these |
| 05/23/2012 | CN102471459A 抗冲击性改进的基于环氧树脂的组合物 Improved impact resistance of the compositions based on epoxy resins |
| 05/23/2012 | CN102471456A 快速固化性优异的能量射线固化型环氧树脂组合物 Rapid curability energy-ray-curable epoxy resin composition |
| 05/23/2012 | CN102471064A Nanocomposite material containing polymer binders |
| 05/23/2012 | CN102468634A 一种输电线路用间隔棒框架 One kind of spacer frame transmission line |
| 05/23/2012 | CN102464890A Aqueous asphalt-based epoxy resin waterproof material composition and preparation process thereof |
| 05/23/2012 | CN102464863A Color pavement cementing material and application thereof |
| 05/23/2012 | CN102464862A Thermosetting composition |
| 05/23/2012 | CN102464861A 一种修复管道碳纤维复合材料体系及应用 A carbon fiber composite pipeline system and application fixes |
| 05/23/2012 | CN102464860A 剑杆带固化剂及其制造方法 Rapier band and its manufacturing method of the curing agent |
| 05/23/2012 | CN102464838A 一种防水阻燃复合板材及其制备方法 A waterproof fire-retardant composite board and its preparation method |
| 05/23/2012 | CN102464833A 一种防水阻燃复合卷材及其制备方法 A waterproof fire-retardant composite membrane and its preparation method |
| 05/23/2012 | CN102463680A 输电线路用间隔棒框架的制备方法 Preparation for Transmission Line spacer frame |
| 05/23/2012 | CN102463679A 一种输电线路用间隔棒框架的制备方法 A transmission line with a spacer frame production method |
| 05/23/2012 | CN102081992B Carbon fiber cable core |
| 05/23/2012 | CN101982480B Solvent-containing high-temperature corrosion-resistant flame-resistant anti-fouling thermoplastic resin |
| 05/23/2012 | CN101955675B Modified epoxy resin thermosetting epoxy asphalt bulking agent and preparation method thereof |
| 05/23/2012 | CN101935428B Method for preparing epoxy resin cross-linked high-elasticity flexible polyvinyl chloride material |
| 05/23/2012 | CN101921458B Unleaded epoxy resin composite for printed circuit copper clad laminate |
| 05/23/2012 | CN101921423B Ultrahigh-molecular-weight polyethylene/epoxy resin composite membrane and preparation method thereof |
| 05/23/2012 | CN101914194B Self-emulsified nonionic terpenyl epoxy resin polyalcohol emulsion and preparation method and application |
| 05/23/2012 | CN101906237B Formula of magnetic slot wedge |
| 05/23/2012 | CN101891902B Method for recycling waste epoxy resin |
| 05/23/2012 | CN101851396B Waterborne epoxy ester resin composition and preparation method thereof and water-based paint prepared from same |
| 05/23/2012 | CN101851390B Black halogen-free epoxy resin composition and covering film prepared from same |
| 05/23/2012 | CN101831012B Preparation method of polyamide-amine dendrimer modified waste rubber micropowder |
| 05/23/2012 | CN101805494B Natural fiber resin composite and preparation method thereof |
| 05/23/2012 | CN101798443B Method for preparing nano ceric oxide/epoxy resin composite material |
| 05/23/2012 | CN101775194B Carbon nano tube/epoxide resin composite material and preparation method thereof |
| 05/23/2012 | CN101772546B Amphiphilic block copolymers and inorganic nanofillers to enhance performance of thermosetting polymers |
| 05/23/2012 | CN101613518B Amphiphilic block copolymer-toughened thermoset resins |
| 05/23/2012 | CN101423668B Resin composition, prepreg and laminate using the same |
| 05/23/2012 | CN101397495B UV curing luminous plate and its preparing process |
| 05/23/2012 | CN101258198B Resin composition and hybrid integrated circuit board making use of the same |
| 05/23/2012 | CN101081909B Sealing material, application and production process |
| 05/23/2012 | CN101072807B Thermosetting epoxy resin composition and use thereof |
| 05/23/2012 | CN101056936B Amphiphilic block copolymer-toughened epoxy resins and powder coatings made therefrom |
| 05/18/2012 | WO2012064703A1 Dopo-derived flame retardant and synthetic hydrogarnets for epoxy resin compositions |
| 05/17/2012 | US20120123039 Thermosetting composition |
| 05/17/2012 | US20120123025 Mixed Phosphonate Flame-Retardants |
| 05/17/2012 | US20120123020 Mechanical properties of epoxy filled with functionalized carbon nanotubes |
| 05/17/2012 | US20120121812 Process for continuous preparation of a prepolymer based on phenolic resins, oxazolines and epoxides |
| 05/17/2012 | US20120119172 Amino terminated phosphonamide oligomers and flame retardant compositions therefrom |
| 05/17/2012 | US20120119168 Voltage switchable dielectric materials with low band gap polymer binder or composite |
| 05/17/2012 | US20120119156 Aluminum chelate latent curing agent |
| 05/17/2012 | US20120119153 Conductive paste composition and electrode prepared using the same |
| 05/16/2012 | EP2452978A1 Method for producing epoxy resin moulded substances filled with carbon fillers |
| 05/16/2012 | EP2452964A1 Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these |
| 05/16/2012 | EP2451872A1 Core/shell rubbers for use in electrical laminate compositions |
| 05/16/2012 | EP2206745B1 Radiation curable composition and method for producing the same |
| 05/16/2012 | EP2144953B1 Cross-linked silicone particles and method of manufacturing thereof |
| 05/16/2012 | CN102459397A Resin composition for sealing semiconductors, and semiconductor device |
| 05/16/2012 | CN102453464A Glue for rapid leak repairing and its preparation method |
| 05/16/2012 | CN102453463A Seal material for bathtub |
| 05/16/2012 | CN102453340A Thermosetting resin composition for sealing packing of semiconductor, and semiconductor device |
| 05/16/2012 | CN102453308A Epoxy resin composition for electronic product encapsulation and manufacturing method thereof |
| 05/16/2012 | CN102453295A Nano fiber reinforced composite resin with high light transmittance |