| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 08/08/2012 | CN102627930A Epoxy structural adhesive for wind wheel blades and its preparation method |
| 08/08/2012 | CN102627902A Nanometer reinforced aqueous acrylic acid modified epoxy primer-topcoat anticorrosion paint coating and preparation method thereof |
| 08/08/2012 | CN102627753A Epoxy resins comprising a cycloalphatic diamine curing agent |
| 08/08/2012 | CN102627752A Preparation method for waterborne epoxy resin emulsion |
| 08/08/2012 | CN102344569B Preparation method of modified organic silicon resin and paint containing prepared modified organic silicon resin |
| 08/08/2012 | CN102268126B Preparation method of organosilicon latent epoxy resin curing agent |
| 08/08/2012 | CN102229695B Production process of glass fiber reinforced plastic paint |
| 08/08/2012 | CN102153184B Composite organic and inorganic polymeric flocculant and preparation process and application of composite organic and inorganic polymeric flocculant |
| 08/08/2012 | CN102134306B Cardanol epoxy floor curing agent and preparation method thereof |
| 08/08/2012 | CN101880443B Low-viscosity epoxy resin system for resin transfer molding and preparation and using method thereof |
| 08/08/2012 | CN101602864B Curing agent composition and preparation method thereof |
| 08/08/2012 | CN101535366B Heat curable resin composition for light reflection, process for producing the resin composition, and optical semiconductor element mounting substrate and optical semiconductor device using the resin |
| 08/07/2012 | US8236917 Compound having silsesquioxane skeleton and its polymer |
| 08/07/2012 | US8236872 Adhesive composition and optical member |
| 08/07/2012 | US8236195 Fluorine-containing curable composition |
| 08/07/2012 | CA2669213C Epoxy resins comprising a cycloaliphatic diamine curing agent |
| 08/02/2012 | WO2012102693A1 Epoxy-adduct hardening agents |
| 08/02/2012 | WO2012102336A1 Epoxy resin composition for sealing, and electronic component device |
| 08/02/2012 | WO2012102212A1 Resin composition sheet, resin composition sheet with metal foil attached, metal base wiring board material, metal base wiring board, and led light source member |
| 08/02/2012 | WO2012102202A1 Epoxy resin composition for resin transfer molding of fiber-reinforced composite material, fiber-reinforced composite material, and method for producing same |
| 08/02/2012 | WO2012101594A1 Aqueous based epoxy grout |
| 08/02/2012 | WO2012101078A1 Hot-formable and recyclable epoxy anhydride thermosetting resins and thermosetting composites |
| 08/02/2012 | US20120196991 Composition for formation of cured epoxy resin, and cured products thereof |
| 08/01/2012 | EP2480587A1 Curable epoxy resin compositions and composites made therefrom |
| 08/01/2012 | EP2480586A1 Process for preparing episulfide resins |
| 08/01/2012 | EP2480585A1 Aqueous radiation-hardenable epoxy acrylate dispersions |
| 08/01/2012 | EP1557413B1 Novel aromatic sulfonium salt compound, photo-acid generator comprising the same and photopolymerizable composition containing the same, resin composition for optical three-dimensional shaping, and method of optically forming three-dimensional shape |
| 08/01/2012 | EP1524307B1 Thermosetting adhesive for optical use, optical isolator element made with the adhesive, and optical isolator |
| 08/01/2012 | CN1571788B Photoactivable nitrogen bases |
| 08/01/2012 | CN102625815A Amine-epoxy adducts and their use for preparing polyurea and polyurea-polyurethane coatings |
| 08/01/2012 | CN102618200A Organosilicone-epoxy-polyimide adhesive and preparation method thereof |
| 08/01/2012 | CN102618150A Preparation method for tough epoxy acid anhydride impregnating varnish and impregnating varnish |
| 08/01/2012 | CN102618045A Waterborne epoxy resin modified emulsified asphalt and preparation and application thereof |
| 08/01/2012 | CN102617987A Epoxy resin composition and condensate |
| 08/01/2012 | CN102617984A Modified epoxy resin base material and modified epoxy resin matrix composite material |
| 08/01/2012 | CN102617983A Environment-friendly high-performance furfural-free epoxy chemical grouting material, preparation method and application |
| 08/01/2012 | CN102617981A 环氧树脂组合物及半导体器件 Epoxy resin composition and semiconductor device |
| 08/01/2012 | CN102617886A Application of heat conducting filling material in VPI (vacuum pressure impregnation) resin |
| 08/01/2012 | CN102617830A Room temperature curing water-based epoxy hardener and preparation method thereof |
| 08/01/2012 | CN102617829A Phosphorous-containing flame retardant epoxy waterborne self-emulsifying curing agent and application thereof |
| 08/01/2012 | CN102617828A High refractive index polymer, optical element and photoelectric device comprising the same |
| 08/01/2012 | CN102617364A Hydroxymethyl diamine compound and preparation method and application thereof |
| 08/01/2012 | CN102010609B Thermosetting epoxy resin modified emulsified asphalts |
| 08/01/2012 | CN102010607B Thermosetting emulsified epoxy resin modified emulsified asphalt |
| 07/31/2012 | US8232365 Biomass-derived epoxy compound and manufacturing method thereof |
| 07/31/2012 | CA2469989C Epoxide adducts and their salts as dispersants |
| 07/26/2012 | WO2012099713A1 High performance thermoset useful for electrical laminate, high density interconnect and interconnect substrate applications |
| 07/26/2012 | WO2012099134A1 Resin composition, and printed wiring board, laminated sheet, and prepreg using same |
| 07/26/2012 | WO2012099132A1 Resin composition, and printed wiring board, laminated sheet, and prepreg using same |
| 07/26/2012 | WO2012098735A1 Liquid crystal resin composition, heat dissipation material precursor, and heat dissipation material |
| 07/26/2012 | WO2012064724A3 Curable compositions |
| 07/26/2012 | US20120190811 Process for the preparation of an allyl alkyl ether by catalytic allylation |
| 07/25/2012 | EP2479233A1 Light-reflective anisotropic electroconductive adhesive agent and light-emitting device |
| 07/25/2012 | EP2479209A1 Process for production of cured molded article, and cured molded article |
| 07/25/2012 | EP2479200A1 Resin composition for fiber-reinforced composite material, cured object obtained therefrom, fiber-reinforced composite material, fiber-reinforced molded resin, and process for producing same |
| 07/25/2012 | EP2478030A1 Use of a stereoisomer mixture of diaminomethylcyclohexane as a hardener for epoxy resins |
| 07/25/2012 | CN102612743A 半导体装置 Semiconductor device |
| 07/25/2012 | CN102612539A Curable compositions |
| 07/25/2012 | CN102612521A Novel thermal radical generator, method for producing the same, liquid crystal sealing agent, and liquid crystal display cell |
| 07/25/2012 | CN102604512A Epoxy resin, epoxy resin composition, and utilizing the same, prepreg and laminated plate |
| 07/25/2012 | CN102604400A Epoxy asphalt for roads and bridges and preparation method for same |
| 07/25/2012 | CN102604367A Epoxy-polyurethane blending grouting material used for road engineering maintenance |
| 07/25/2012 | CN102604331A Modified epoxy resin and preparation method thereof |
| 07/25/2012 | CN102604327A Solvent-free epoxy resin as plugging material, and preparation method and application of the solvent-free epoxy resin |
| 07/25/2012 | CN102604326A Semiconductor-encapsulating liquid epoxy resin composition and semiconductor device |
| 07/25/2012 | CN102604156A 碱产生剂 Base generator |
| 07/25/2012 | CN102604075A Method for preparing dihydroxy-terminated polyphenylene oxide in aqueous medium and product as well as application thereof |
| 07/25/2012 | CN102604047A Epoxy emulsion cured at room temperature with high aquosity and weather resistance as well as preparation method of epoxy emulsion |
| 07/25/2012 | CN102604046A DMP-30 (dimethyl phthalate-30) closing method and application of DMP-30 in epoxy adhesive |
| 07/25/2012 | CN102604045A Epoxy resin composition and method for preparing glue film, prepreg and composite material by using same |
| 07/25/2012 | CN102604044A Thiourea modified low temperature curing agent and preparation method thereof |
| 07/25/2012 | CN102604043A Double-component imine modified epoxy solvent-free impregnated resin and preparation and use methods |
| 07/25/2012 | CN102604000A Synthetic method and application of epoxy vinyl ester resin with high bromine content |
| 07/25/2012 | CN102600778A Nanometer composite epoxy resin self-repairing microcapsule and preparation method thereof |
| 07/25/2012 | CN102250321B Quick-drying room temperature curing waterborne epoxy resin curing agent and preparation method thereof |
| 07/25/2012 | CN102134305B Solvent lignin-modified epoxy resin curing agent and preparation method thereof |
| 07/25/2012 | CN102050930B Photocurable resin composition containing anthraquinone derivative |
| 07/25/2012 | CN102010575B Environmental-friendly human pipeline casting filler and preparation method thereof |
| 07/25/2012 | CN101945916B Epoxy resin composition, prepreg, abd fiber-reinforced composite material |
| 07/25/2012 | CN101921175B Process for producing an organic compound |
| 07/25/2012 | CN101899163B Method for preparing self-emulsifiable non-ionic water-borne novolac epoxy resin emulsion |
| 07/25/2012 | CN101798441B Vacuum pressure high-temperature impregnating resin suitable for high voltage equipment insulators |
| 07/25/2012 | CN101704711B Method for preparing 1,2-diol compound by using catalytic hydration of epoxide |
| 07/25/2012 | CN101679828B Heat-resistant structural epoxy resins |
| 07/25/2012 | CN101657759B Alkali-developable photosensitive resin composition and beta-diketone |
| 07/24/2012 | US8227084 Thermosetting resin composition for high performance laminates |
| 07/18/2012 | EP2477224A2 Die attach composition for silicon chip placement on a flat substrate having improved thixotropic properties |
| 07/18/2012 | EP2475720A2 Curable formulation |
| 07/18/2012 | EP2475702A1 Epoxy resin curing indicator composition |
| 07/18/2012 | EP2475701A1 Novel thio compounds and preparing method of the same |
| 07/18/2012 | CN1976592B Vendable sandwich and food products |
| 07/18/2012 | CN1962798B Epoxy resin adhesive composition and optical semiconductor adhesive adopting same |
| 07/18/2012 | CN102598236A Adhesive composition |
| 07/18/2012 | CN102597044A Thermopolymerization initiator system and adhesive composition |
| 07/18/2012 | CN102597043A Use of a stereoisomer mixture of diaminomethylcyclohexane as a hardener for epoxy resins |
| 07/18/2012 | CN102597042A Curable resin composition for optical semiconductor encapsulation, and cured product of same |
| 07/18/2012 | CN102585693A Method for preparing epoxy acrylate modified waterborne polyurethane coating |
| 07/18/2012 | CN102585532A Fiber-filled tung-oil-based resin composite material and preparation method thereof |
| 07/18/2012 | CN102585445A Plastic packaging material for preparing green and environment-friendly diode and injection moulding method |
| 07/18/2012 | CN102585442A Underwater resin matrix light high-strength composite material and preparation method thereof |