Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
05/2000
05/02/2000US6057402 Blend of cycloaliphatic epoxy resins, cyanate esters, lewis acid catalyst and flexibility modifier
05/02/2000US6057389 Curable compositions
05/02/2000US6057382 Epoxy/thermoplastic photocurable adhesive composition
05/02/2000US6057380 Photogeneration of amines from α-aminoacetophenones
05/02/2000US6057033 Release composition contains cellulose microfibers of given thickness and length, and a polyorganosiloxane of given formula having (meth)acryloxy groups; non-brittle
05/02/2000CA2082599C Modified polyalkoxy epoxy resins, a process for preparing them, and their use
04/2000
04/27/2000WO2000023494A1 Flame-retardant epoxy resin composition and semiconductor device made using the same
04/27/2000DE19848329A1 Härter für Epoxidverbindungen, Verfahren zu ihrer Herstellung und Verwendung Hardeners for epoxy compounds, processes for their preparation and use
04/26/2000EP0995767A2 Curing agent for aqueous dispersions of epoxy resin
04/26/2000EP0995766A2 Hardener for epoxy resins, method for the production thereof and use thereof
04/26/2000EP0995765A1 Process for producing epoxy ester resins and photosensitive resin compositions containing them
04/26/2000EP0843894A4 Encapsulant with fluxing properties and method of use
04/26/2000EP0742804B1 Substrate coated or impregnated with flexible epoxy composition
04/26/2000EP0664817B1 Plastics preparation auxiliary agent, process for producing the same and process for preparing reduced monomer emission polyester resin
04/26/2000CN1251598A Epoxy resin composing and moldings
04/26/2000CN1251597A Epoxy resin composition to FRP, prepreg and tubular molding produced therefrom
04/25/2000US6054537 Blend of fluoropolymer and polyphenylene sulfide
04/25/2000US6054536 Epoxy resin compositions
04/25/2000US6054509 Adhesive of epoxy resin, nitrile rubbers and curing agent
04/25/2000US6054501 Curability; glossiness; can be blended with inks, paints
04/25/2000US6054221 Curable epoxy resin compositions, on release liners with 9,9-bis4-aminophenyl) fluorenes as curatives
04/25/2000CA2007638C Araliphatic sulfonium salts and their use
04/20/2000WO2000022030A1 Highly branched oligomers, process for their preparation and applications thereof
04/20/2000WO2000022025A1 Curable coating compositions
04/20/2000WO2000022024A2 High strength epoxy adhesive and uses thereof
04/20/2000WO2000004075A3 Heat curable epoxy compositions
04/20/2000DE19848113A1 Härtungsmittel für wäßrige Epoxidharzdispersionen Curing agent for epoxy resin aqueous
04/20/2000DE19845607A1 Schlagfeste Epoxidharz-Zusammensetzungen Resistant epoxy resin compositions
04/20/2000CA2347200A1 Highly branched oligomers, process for their preparation and applications thereof
04/19/2000EP0994142A1 Hardener for epoxy resin
04/19/2000EP0994141A2 Corrosion- and chip-resistant coatings for high tensile steel
04/19/2000CN1251117A Acid functional and epoxy functional polyester resins
04/18/2000US6051632 Free-flowing compression molding compositions and processes for their production and use
04/15/2000CA2250511A1 Composition for forming high thermal conductivity polybenzoxazine-based material and method
04/13/2000WO2000020538A1 Preservation / lubricant / primer-composition for metallic surfaces
04/13/2000WO2000020484A1 Hydroxy-functionalized poly(amino ether) salts
04/13/2000WO2000020483A2 Impact-resistant epoxide resin compositions
04/13/2000WO2000019967A1 Dental composition based on silicone crosslinkable by cation process
04/13/2000WO2000019966A1 Dental composition based on silicone crosslinkable by cationic process
04/13/2000DE19948059A1 Composition for preparing insulating materials used as raw materials for build-up print circuit boards, includes epoxy resin, curing agent and poly(ether sulfone)
04/13/2000CA2346634A1 Impact-resistant epoxide resin compositions
04/12/2000EP0992569A1 Preservation/lubricant/primercomposition for metallic surfaces
04/12/2000EP0992521A2 Thermosetting resin composition
04/12/2000EP0991711A1 A flame retardant epoxy resin composition
04/12/2000EP0991688A1 Two-component coating agent on an epoxy resin base for cement-bound backgrounds
04/12/2000EP0991682A1 A curable, water-borne one-component coating system using thermally labile hydrophilic groups
04/12/2000CN1250060A (Co) polymer containing sulphur, (thio-) ether and its use
04/12/2000CN1051326C 环氧树脂组合物 The epoxy resin composition
04/12/2000CN1051325C Phosphorus-modified epoxy resins, process for producing them and their use
04/12/2000CN1051294C Method for applying colour substrate irradiation solidified polymer composition and colour-container
04/11/2000US6048956 Diglycidyl ethers of diols
04/11/2000US6048946 Polysiloxanes, cycloaliphatic epoxy resins, polyethers and cyclic polysiloxanes
04/11/2000US6048944 Aliphatic epoxide-amine adducts with substantial side-chain branching, process for their preparation, and their use
04/06/2000WO2000018818A1 Curing agents for epoxy resins
04/06/2000WO2000018751A1 Novel primary epoxides
04/06/2000WO1999062894A3 Process for epoxidation of aryl allyl ethers
04/05/2000EP0990671A1 Gas barrier composition and molded resin
04/05/2000CN1249772A Latent catalysts for epoxy curing systems
04/05/2000CN1249764A Amine-base curing agent, curable resin composition contg. said agent, and corrosionproofing coating composition contg. said agent
04/04/2000US6046284 Epoxy resin composition which is solid at room temperature, obtained by epoxidation of a phenolic hydroxyl-containing resin having a low free difunctional phenol content by epihalohydrin; use in powder coating, can paints
04/04/2000US6046282 Polyamidoamine epoxy curing agent reduced in viscosity by the addition of a reactive diluent which is the amide and/or imidazoline reaction product of polyalkylene amines and monocarboxylic acids
04/04/2000US6045898 Comprising an epoxy resin, a curing agent and an additive that changes viscoelasticity of the resin composition, said resin composition having a modulus of storage rigidity g' of 5 to 200 pa in a temperature range of 70 degrees c to 100 degrees c
04/04/2000US6045873 One-pack epoxy resin composition, one-pack corrosion resistant paint composition, and coating method using said compositions
04/04/2000US6045857 Curable, water-borne one-component coating system using thermally labile hydrophillic groups
04/04/2000CA2129975C Polyalkyleneimine or polyallylamine coated material
04/04/2000CA2104702C Urea-modified copolymer as dispersants for pigments in coating compositions
03/2000
03/30/2000WO2000017252A1 Aqueous solution of water-soluble epoxy resin, solid obtained therefrom, and processes for producing these
03/30/2000WO2000017243A1 Phenol-novolacs with improved optical properties
03/30/2000WO2000016912A1 Scratch-resistant sol-gel coating for clear powder-slurry lacquer
03/30/2000DE19843581A1 Kratzfester Sol-Gel-Überzug für Pulverslurry-Klarlacke Scratch resistant sol-gel coating for powder slurry clearcoats
03/30/2000CA2309579A1 Phenol-novolacs with improved optical properties
03/29/2000EP0989788A2 Prepreg, multilayer printed wiring board and process for production of said multilayer printed wiring board
03/29/2000EP0989173A1 Thermosetting pressure-sensitive adhesive
03/29/2000EP0954547A4 Epoxy-polysiloxane polymer composition
03/28/2000US6043333 Modified epoxy resin, epoxy resin composition and cured product thereof
03/28/2000US6043295 Photopolymerizable composition comprising blend of epoxy resins, photoinitiator system comprising iodonium salt, visible light sensitizer, electron donor
03/23/2000WO2000015725A1 Powder clear varnish and aqueous powder clear varnish slurry
03/23/2000WO2000015708A1 Polymer compound with improved gloss properties
03/23/2000WO2000015687A1 Accelerators for hardenable systems
03/23/2000WO2000015683A1 Curable compositions
03/23/2000DE19841408A1 Powder clear lacquer or slurry used for making clear lacquer, e.g. for car on aqueous base coat, contains polyol in addition to epoxide, tris(alkoxycarbonylamino)triazine and polycarboxylic acid
03/23/2000CA2344037A1 Curable compositions
03/22/2000EP0987567A1 A sulfur-containing (thio)ether (co)polymer and a use thereof
03/22/2000EP0986597A1 Epoxidized polyester-based powder coating compositions
03/22/2000EP0813576B1 Epoxy-cyanate ester compositions
03/22/2000CN1050618C Solidifiable epoxy resin composition
03/22/2000CN1050617C Epoxy resin composition with solidifying inhibitor
03/21/2000US6040398 Epoxy curing agent and one-component (type) epoxy resin composition
03/21/2000US6040397 Anhydride-cured blend of a polymeric epoxy resin a cycloaliphatic diepoxide, an aromatic poly epoxide, a chain extended epoxide resin and an epoxide resin
03/21/2000US6040396 Nucleophilic addition adduct of an imidazole and an unsaturated compound, which contains more than one imidazole moiety per molecule
03/21/2000US6040391 Process for thickening thermoset resin molding compound compositions
03/21/2000US6040350 Methacrylate powder; curing agent, decomposable foaming agent; mixture of an inorganic salt with a shape of a predetermined aspect ratio and a granular inorganic salt
03/16/2000WO2000014124A1 Preparation of water-soluble cross-linked cationic polymers
03/16/2000WO2000013818A1 Foundry binder of epoxy resin, acrylated polyisocyanate and acrylic monomer and/or polymer; and cold-box process
03/16/2000CA2342791A1 Foundry binder of epoxy resin, acrylated polyisocyanate and acrylic monomer and/or polymer; and cold-box process
03/15/2000EP0598131B1 Cross-linking agent and curable composition
03/15/2000CN1247547A Epoxy-polysiloxane polymer composition
03/15/2000CN1247448A 印刷线路板 Printed circuit boards
03/14/2000US6037438 As laminates in the electric and electronic fields in which low-dielectric property is desired and also applicable to uses of sealing and molding
03/14/2000US6037435 Composition consisting of mixture of liquid hydrophobic epoxy resin and self-emulsifiable liquid epoxy resin, ketimine curing agent