| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 04/25/2012 | CN202200163U 轴承套圈精研机 Bearing Ring Lapping Machines |
| 04/25/2012 | CN202200162U 一种研磨装置 A polishing apparatus |
| 04/25/2012 | CN202200161U 十字万向联轴器轴承座研磨机 Cross universal joint bearing grinding machine |
| 04/25/2012 | CN202200160U 一种夹头总成箱 One kind of chuck assembly box |
| 04/25/2012 | CN102423872A 硅片的抛光方法 Wafer polishing method |
| 04/25/2012 | CN102423871A 一种抛光液的循环再利用方法 A polishing liquid is recycled by the method of |
| 04/25/2012 | CN102423870A 微量研磨厚度测量装置 Trace grinding thickness measuring device |
| 04/25/2012 | CN102092002B 单晶硅片液体抛光方法 Monocrystalline liquid polishing method |
| 04/25/2012 | CN101172332B Polishing pads useful for endpoint detection in chemical mechanical polishing |
| 04/24/2012 | US8165710 Polishing method, polishing apparatus, and program for controlling polishing apparatus |
| 04/24/2012 | US8163836 Adhesive composition and adhesive film |
| 04/24/2012 | US8163650 Adjuvant for controlling polishing selectivity and chemical mechanical polishing slurry comprising the same |
| 04/24/2012 | US8162725 Abrasive, method of polishing target member and process for producing semiconductor device |
| 04/24/2012 | US8162724 Surface treating method and apparatus |
| 04/24/2012 | US8162723 Method of polishing a tungsten carbide surface |
| 04/19/2012 | WO2012051197A1 Polishing pad with multi-modal distribution of pore diameters |
| 04/19/2012 | WO2012051002A2 Abrasive articles |
| 04/19/2012 | WO2012050044A1 Polishing composition |
| 04/19/2012 | US20120094586 Polishing pad with multi-modal distribution of pore diameters |
| 04/19/2012 | US20120094584 Sheet for mounting a workpiece and method for making the same |
| 04/18/2012 | EP2441550A1 Aqueous cutting fluid and aqueous cutting agent |
| 04/18/2012 | EP2440371A1 Grinding and/or polishing tool, and production method |
| 04/18/2012 | EP2440370A1 Method for machining flat workpieces |
| 04/18/2012 | CN202192538U 研磨机加速器 Grinder Accelerator |
| 04/18/2012 | CN202192537U 用于srp系统研磨机的研磨夹具 Srp system for polishing jig grinder |
| 04/18/2012 | CN202192536U 自动控制去胶机 Automatic control to the melter |
| 04/18/2012 | CN202192535U 油封式旋塞阀配研机 Seal plug valves with research machine |
| 04/18/2012 | CN102416599A 一种全自动微钻钻头研磨检测机中转机构 A fully automatic detection of micro drill grinding machine transit agencies |
| 04/18/2012 | CN102416598A 基板的研磨方法及其装置 Method and apparatus for polishing a substrate |
| 04/18/2012 | CN102416597A 基板的研磨装置及基板的研磨方法 Apparatus and substrate polishing method for polishing a substrate |
| 04/18/2012 | CN102416596A 一种用于改善晶圆表面被固定磨料抛光垫刮伤的装置 A method of improving the wafer surface is a fixed abrasive polishing pad scratching means for |
| 04/18/2012 | CN102416595A 一种实现化学机械研磨过程中抛光液温度控制的系统 An implementation system of chemical mechanical polishing process, the polishing liquid for temperature control |
| 04/18/2012 | CN102416594A 环状体的制造方法 The method of manufacturing an annular body |
| 04/18/2012 | CN101412201B Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers |
| 04/17/2012 | US8157621 Wafer back side grinding process |
| 04/17/2012 | US8157616 Polishing end point detection method |
| 04/12/2012 | WO2012048120A1 Nonwoven composite abrasive comprising diamond abrasive particles |
| 04/12/2012 | WO2012012052A3 Endpoint control during chemical mechanical polishing by detecting interface between different layers through selectivity change |
| 04/12/2012 | CA2813086A1 Nonwoven composite abrasive comprising diamond abrasive particles |
| 04/11/2012 | EP2439768A1 Fixed-abrasive-grain machining apparatus, fixed-abrasive-grain machining method, and semiconductor-wafer manufacturing method |
| 04/11/2012 | EP2439767A1 Surface treatment composition, surface treatment method, and method for manufacturing semiconductor device |
| 04/11/2012 | EP1807865B1 Polishing apparatus |
| 04/11/2012 | CN202185825U 自动送料机构 Automatic feed mechanism |
| 04/11/2012 | CN202185824U 冲子研磨加长治具 Punch grinding tools plus Changzhi |
| 04/11/2012 | CN202185823U 一种提升上盘平稳度的硅片研磨设备 A way to improve on the plate flatness of the wafer grinding equipment |
| 04/11/2012 | CN202185822U 单晶硅棒端面研磨设备 Silicon rods end face grinding equipment |
| 04/11/2012 | CN202185821U 一种减少调压次数的硅片研磨设备 A method of reducing the number of wafer polishing equipment Surge |
| 04/11/2012 | CN202185820U 一种抗腐蚀硅片研磨设备 An anti-corrosion wafer grinding apparatus |
| 04/11/2012 | CN202185819U 一种可偏心旋转的等压研磨装置 A polishing apparatus isostatic eccentrically rotatable |
| 04/11/2012 | CN202185818U 一种研磨装置 A polishing apparatus |
| 04/11/2012 | CN102410306A 线性滑块及其制造方法 Linear slide and its manufacturing method |
| 04/11/2012 | CN102408843A Double-faced adhesive tape and polishing member |
| 04/11/2012 | CN102407484A 一种电磁卡盘 An electromagnetic chuck |
| 04/11/2012 | CN102407483A 一种半导体晶圆高效纳米精度减薄方法 A semiconductor wafer thinning and efficient method for nanometer precision |
| 04/11/2012 | CN102407482A Method for adjusting metal grinding speed and overcoming defects in grinding process |
| 04/10/2012 | US8153526 High planarizing method for use in a gate last process |
| 04/10/2012 | US8153525 Polishing method, polishing apparatus, and method for manufacturing semiconductor device |
| 04/10/2012 | US8152594 Polishing apparatus |
| 04/05/2012 | WO2012044683A2 Polishing pad for eddy current end-point detection |
| 04/05/2012 | WO2012043964A1 Preparation method of cmp pad conditioner using amorphous metal |
| 04/05/2012 | WO2012043253A1 Manufacturing method of glass substrate for information recording medium and information recording medium |
| 04/05/2012 | WO2012043220A1 Polishing agent |
| 04/05/2012 | WO2012043214A1 Manufacturing method for glass substrate for information recording medium, and information recording medium |
| 04/05/2012 | WO2012042960A1 Cerium-based abrasive |
| 04/05/2012 | WO2012042769A1 Method for producing glass substrates for hard disks |
| 04/05/2012 | WO2012042735A1 Manufacturing method for glass substrate for information recording medium |
| 04/05/2012 | WO2011162893A3 Finishing technique |
| 04/05/2012 | US20120083187 Polyurethane, composition for formation of polishing layers that contains same, pad for chemical mechanical polishing, and chemical mechanical polishing method using same |
| 04/05/2012 | US20120080775 Method of polishing silicon wafer as well as silicon wafer |
| 04/04/2012 | CN202180405U 一种双端面研磨机的进料定位装置 Feed a double-end positioning device grinder |
| 04/04/2012 | CN202180404U 陶瓷粉料颗粒优化机 Ceramic powder particles to optimize machine |
| 04/04/2012 | CN102398213A 蓝宝石led衬底抛光超薄型不锈钢载体盘及设备 Polished sapphire substrate led ultrathin stainless steel carrier plate and Equipment |
| 04/04/2012 | CN102398212A 一种化学机械研磨设备 A chemical mechanical polishing apparatus |
| 04/04/2012 | CN102398211A 一种闸板阀闸板研磨装置 One kind of gate valve gate grinding apparatus |
| 04/04/2012 | CN102398210A 研磨装置 Grinding device |
| 04/04/2012 | CN102398209A 被研磨物的研磨方法及研磨垫 Be polishing method and a polishing pad of the polishing composition |
| 04/04/2012 | CN102398208A Semiconductor process processing system and method |
| 04/04/2012 | CN102398207A 研磨机 Grinder |
| 04/04/2012 | CN102398206A 研磨机 Grinder |
| 04/04/2012 | CN102009382B 研磨机 Grinder |
| 04/04/2012 | CN101930909B 生产半导体晶片的方法 Method for producing a semiconductor wafer |
| 04/03/2012 | US8148441 Chain extension and curing of an isocyanate-terminated prepolymer with an aromatic diamine to produce a polyurethane foam with uniform, fine cells; improved dressability with maintained planarization characteristics and polishing speed; halogen-free |
| 04/03/2012 | US8148301 Method for polishing tape-shaped substrate for oxide superconductor, oxide superconductor, and base material for oxide superconductor |
| 04/03/2012 | US8148266 Method and apparatus for conformable polishing |
| 04/03/2012 | US8147711 Adjuvant for controlling polishing selectivity and chemical mechanical polishing slurry |
| 04/03/2012 | US8147295 Method of polishing silicon wafer |
| 04/03/2012 | US8147294 Capillary, capillary polishing method, and capillary polishing apparatus |
| 03/29/2012 | WO2012040374A2 Superabrasive tools having substantially leveled particle tips and associated methods |
| 03/29/2012 | WO2012039428A1 Process for producing polishing liquid composition |
| 03/29/2012 | WO2012039390A1 Composition for polishing and composition for rinsing |
| 03/29/2012 | WO2012039364A1 Semiconductor device production process and semiconductor device production system |
| 03/29/2012 | DE102011115152A1 Polierkissen zum chemisch-mechanischen Polieren mit Licht-stabilem, polymeren Endpunkt-Nachweis-Fenster und Verfahren zum Polieren damit. A polishing pad for chemical mechanical polishing with light-stable polymeric endpoint detection window and method of polishing it. |
| 03/29/2012 | DE102010046551A1 Verfahren zur Herstellung eines Kolbenrings A process for producing a piston ring |
| 03/29/2012 | DE102010005032B4 Vorrichtung und Verfahren zur Bestimmung der Position einer Arbeitsfläche einer Arbeitsscheibe Method and apparatus for determining the position of a working surface of a working disk |
| 03/28/2012 | EP2432612A1 Automated bore finishing process |
| 03/28/2012 | EP1739729B1 Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer |
| 03/28/2012 | CN202174490U 研磨装置 Grinding device |
| 03/28/2012 | CN202174489U 晶圆清洗装置以及化学机械研磨设备 Wafer cleaning apparatus, and a chemical mechanical polishing apparatus |
| 03/28/2012 | CN202174488U 一种卧式双端面研磨机 One kind of horizontal double-end mill |
| 03/28/2012 | CN202174487U 具有砂箱摇臂的珠磨机 Rocker has a sand box bead mill |