| Patents for B23K 3 - Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (10,880) |
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| 02/26/2003 | CN2537505Y Improved structure for tin sucking device |
| 02/26/2003 | CN2537504Y Cooler of heating system |
| 02/26/2003 | CN2537503Y Anti-scald electric iron with vacuum heat insulation sleeve |
| 02/26/2003 | CN2537502Y Life prolonging protector for electric iron |
| 02/25/2003 | US6524398 Low-residue, low-solder-ball flux |
| 02/20/2003 | WO2003013774A2 Spark erosion |
| 02/18/2003 | US6521176 Tin, bismuth, silver |
| 02/13/2003 | US20030029908 Bumps made with adhesive film instead of gold plating |
| 02/13/2003 | US20030029782 Solder dross removal apparatus and method |
| 02/12/2003 | EP1283086A2 Solder dross removal apparatus and method |
| 02/12/2003 | CN1396803A Dip soldering method and dip soldering device |
| 02/12/2003 | CN1101307C Intelligent type hydraulic valve oil distrivbutor used for injection molding machine and method |
| 02/06/2003 | US20030024968 Method and apparatus for applying solder to an element on a substrate |
| 02/05/2003 | CN2533974Y Multifunctional electric soldering machine |
| 02/04/2003 | US6513702 Automatic wave soldering apparatus and method |
| 02/04/2003 | US6513697 Tip heater cartridge and soldering iron for use therewith |
| 02/04/2003 | CA2224772C Gas knife cooling system |
| 01/29/2003 | CN1394112A Soldering paste printing method and equipment for printing soldering paste on wiring pattern board |
| 01/28/2003 | US6512294 Adsorbing device, sucker and mounting device for conductive member, adsorbing method and mounting method for conductive member, and semiconductor device and method of making the same |
| 01/28/2003 | US6510978 Solder jet machine and soldering method |
| 01/28/2003 | US6510977 Method and apparatus using laminated foils for placing conductive preforms |
| 01/28/2003 | US6510724 Method and system for selective soldering process characterization |
| 01/23/2003 | WO2003006197A1 Method and device for applying a solder to a substrate |
| 01/23/2003 | US20030015512 Heating trowel such as soldering iron |
| 01/23/2003 | US20030015090 Controlled atmosphere zones and exhaust stacks with nozzles to accelerate the exhaust flow, measuring the flow and at a predetermined level |
| 01/22/2003 | EP0988129B1 Method and device for repairing defective soldered joints |
| 01/22/2003 | CN2531908Y Quick-heating energy-saving electric Soldering gun |
| 01/22/2003 | CN2531907Y Continuous gas shielded soldering furnace for stainless steel products |
| 01/22/2003 | CN1392816A Coating method and device for solder material |
| 01/22/2003 | CN1392760A Electronic element assembling method without producing unnecessary welding balls |
| 01/22/2003 | CN1099337C 固定装置 Fixtures |
| 01/21/2003 | US6508196 Device for applying drops of a fluid on a surface |
| 01/16/2003 | WO2003004208A1 Soldering nozzle for wave soldering printed circuit boards |
| 01/16/2003 | WO2002076664A3 System and process for the treatment of gaseous emissions |
| 01/16/2003 | US20030010813 Brazing method and device, relay coil and method for the coil by the brazing method and device |
| 01/15/2003 | EP1275461A1 Brazing method and device, relay coil and method for the coil by the brazing method and device |
| 01/14/2003 | US6505553 Screen printing method and screen printing apparatus |
| 01/09/2003 | US20030006268 Method and device for making a metal bump with an increased height |
| 01/09/2003 | US20030006021 Apparatus for casting solder on a moving strip |
| 01/08/2003 | EP0932473B1 Fixing device for a soldering device |
| 01/08/2003 | CN2529726Y High efficiency safety long service energy saving device of electric iron |
| 01/08/2003 | CN1390437A Solder-bearing wafer for use in soldering operations |
| 01/07/2003 | US6502740 Solder a lead wire of an electronic device to a wiring pattern formed on a printed circuit board, the electronic device is first placed on a first face of the printed circuit board such that the lead wire thereof are protruded from a second face |
| 01/03/2003 | WO2002083350A3 Device for applying solder globules |
| 01/02/2003 | US20030001001 Apparatus and method for preventing soldering material migration |
| 01/02/2003 | US20030000462 Dispensing system and method |
| 01/02/2003 | EP1270131A1 Wave soldering apparatus for printed circuits |
| 12/31/2002 | US6501044 Method for welding the surfaces of materials |
| 12/31/2002 | US6499650 Solder dross removal apparatus and method |
| 12/31/2002 | US6499648 Method and device for making a metal bump with an increased height |
| 12/31/2002 | US6499645 Automatic soldering apparatus |
| 12/26/2002 | US20020198427 Providing silicoaluminophosphate molecular sieve having catalytic sites; providing a shield to protect the catalytic sites from contact with water molecules; removing the shield; contacting with oxygenate feedstock to produce olefin product |
| 12/25/2002 | CN2527387Y Combustion type soldering iron |
| 12/25/2002 | CN1387468A Method and device for producing soldered joint |
| 12/24/2002 | US6497039 Method of producing an encased honeycomb body |
| 12/19/2002 | WO2002100589A1 Integrated solder bump deposition apparatus and method |
| 12/19/2002 | US20020190097 Method and arrangement for a martensite-free brazing process |
| 12/12/2002 | US20020185523 Integrated solder bump deposition apparatus and method |
| 12/12/2002 | DE10221613A1 Verfahren und Vorrichtung zum martensitfreien Löten Method and apparatus for soldering martensitfreien |
| 12/11/2002 | EP1265469A2 Solder paste printing method and apparatus for printing solder paste on a board on which wiring patterns are formed |
| 12/11/2002 | EP1264654A1 Method and apparatus for applying solder |
| 12/11/2002 | EP0954402B1 Device for assembling several individual parts to form a spectacle frame |
| 12/11/2002 | EP0858856B1 Brazing apparatus |
| 12/11/2002 | CN2524877Y Medium and high frequency fast electric iron |
| 12/11/2002 | CN1383956A Welding flux and welding slag separator |
| 12/10/2002 | US6491969 Disposable print head for ejecting controlled amounts of liquid (e.g. solder) at a high rate onto the suface (e.g. an integrated circuit); heating a metal hydride layer to generate hydrogen gas, the pressure from which ejects solder |
| 12/05/2002 | WO2002096589A1 Electric soldering iron |
| 12/05/2002 | US20020182842 Method and apparatus of manufacturing electronic circuit module, and method and apparatus of manufacturing semiconductor module |
| 12/05/2002 | US20020179696 Solder-ball bonding device and method |
| 12/05/2002 | US20020179695 Solder paste printing method and apparatus for printing solder paste on a board on which wiring patterns are formed |
| 12/05/2002 | US20020179693 Method and device for flow soldering |
| 12/05/2002 | US20020179691 Device and method for clamping and wire-bonding the leads of a lead frame one set at a time |
| 12/05/2002 | US20020179686 Method and device for making a metal bump with an increased height |
| 12/05/2002 | US20020179680 Desktop soldering dispenser with automatic metering and feeding of soldering wire |
| 12/05/2002 | US20020179677 Solder iron pressure monitor and method of using same in manufacturing a cathode ray tube |
| 12/05/2002 | US20020179675 Device and method for clamping and wire-bonding the leads of a lead frame one set at a time |
| 12/05/2002 | US20020179322 Method of packaging electronic components without creating unnecessary solder balls |
| 12/05/2002 | US20020178705 Filtering apparatus |
| 12/05/2002 | DE10148460A1 Verfahren und Vorrichtung zur Herstellung eines metallischen Bondhügels mit vergrößerter Höhe Method and apparatus for manufacturing a metallic bump with increased height |
| 12/05/2002 | DE10125552A1 Lötvorrichtung zum Löten von Flachbaugruppen Soldering apparatus for soldering of printed circuit boards |
| 12/04/2002 | EP1263270A2 A method of packaging electronic components without creating unnecessary solder balls |
| 12/04/2002 | EP1115528B1 Heat shield for soldering device |
| 12/04/2002 | CN1382556A Tube-like solder iron with detachable handle |
| 12/03/2002 | US6489678 High performance multi-chip flip chip package |
| 11/28/2002 | WO2002094492A1 Soldering device for soldering flat modules |
| 11/28/2002 | WO2001022785A9 Solder-bearing wafer for use in soldering operations |
| 11/27/2002 | EP0921887B1 Method and apparatus for forming termination stripes |
| 11/27/2002 | CN1381331A Stroke and pressure regulator for weld job for soldering-tin press injector |
| 11/27/2002 | CN1095316C Method and device for wave soldering |
| 11/26/2002 | US6484923 Hand held flux and solder feeding tool |
| 11/21/2002 | US20020171157 Electronic device |
| 11/21/2002 | US20020170946 Soldering method and soldering apparatus |
| 11/21/2002 | US20020170945 Solder ball attachment system |
| 11/20/2002 | EP1259101A1 Method and device for flow soldering |
| 11/20/2002 | CN2520984Y Small size tin soldering furnace with welding and repairing function |
| 11/20/2002 | CN2520983Y Automatic constant temperature soldering machine |
| 11/20/2002 | CN2520982Y Soldering iron |
| 11/15/2002 | CA2347602A1 Desktop soldering dispenser with automatic metering and feeding of soldering wire |
| 11/14/2002 | US20020166886 Method of forming bumps |
| 11/13/2002 | EP1256409A2 Method and systen for rapid heat-sink soldering |