Patents
Patents for B23K 3 - Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (10,880)
08/2002
08/08/2002DE10163324A1 Verfahren und Vorrichtung zur thermischen Analyse, Verfahren und Vorrichtung zur Berechnung thermischer Bedingungen sowie Computerprodukt Method and apparatus for thermal analysis, Method and apparatus for calculating thermal conditions and computer product
08/07/2002CN1362904A Control method for copper content in solder dipping bath
08/07/2002CN1088637C Welding method
08/06/2002US6427903 Solder ball placement apparatus
08/06/2002US6427902 Machine for wave soldering of tinning
08/06/2002US6427898 Solder bump forming method and apparatus
08/06/2002US6427768 Heat exchanger and brazing method
08/01/2002US20020100986 Electronic device
07/2002
07/31/2002CN2502830Y Quick heating electric iron
07/30/2002US6426486 Optical apparatus and method for shrinking heat shrink tubing, fusing wires and solder and unsolder packaged electronic components
07/30/2002US6425518 Method and apparatus for applying solder to an element on a substrate
07/30/2002US6425517 Method for applying a brazing medium to a configuration
07/30/2002US6425516 Semiconductor device and method of production of the same
07/30/2002US6425515 Method and apparatus for micro BGA removal and reattach
07/25/2002US20020096556 Wave solder apparatus and method
07/25/2002DE10102768A1 Soldering arrangement has robot-controled solder burner, wire feeder, voltage source, signaling device that produces information signal if solder wire, workpiece electrically connected
07/24/2002CN2501621Y Electric soldering iron with sucting tin function
07/24/2002CN1360531A Printhead for jetting hot liquid medium and method of producing joint that comprises metallic solder
07/24/2002CN1360530A Print chip for printing head working according to ink printing principle
07/24/2002CN1359768A Device for making honeycomb structure of waste gas exhausting controlling means
07/23/2002US6423950 Reflow soldering apparatus
07/23/2002US6422452 Method and apparatus for lining up micro-balls
07/18/2002US20020092899 Wire processing apparatus, flux applying device, and solder depositing device
07/18/2002US20020092898 Process for connecting the winding wire of a coil with a terminal pin
07/18/2002US20020092897 Automatic dross removal apparatus and method
07/18/2002US20020092894 One-step bumping/bonding method for forming semiconductor packages
07/18/2002US20020092845 Induction heating tool
07/17/2002EP1222988A2 Nozzle for soldering apparatus
07/17/2002EP1222987A1 Induction heating tool
07/17/2002EP1222049A1 Method and device for joining a support matrix of a honeycomb on the end face using bonding technology
07/17/2002EP1051564B1 Process for producing an encased honeycombed body
07/17/2002CN2500420Y High-power temp.-regulating electric iron
07/17/2002CN1359259A Viscous fluid delivering equipment, electronic component installing equipment and method, and semiconductor device
07/11/2002WO2002014010A8 Solder ball delivery and reflow apparatus and method
07/11/2002US20020088843 Solder ball pitcher
07/11/2002US20020088839 Safety switch device for gas jet soldering gun
07/10/2002CN2499163Y Electric iron for sucking tin
07/10/2002CN2499162Y Electric iron with wax spoon function for dentistry
07/10/2002CN1357425A Electric soldering iron protector
07/09/2002US6415972 Closed loop solder wave height control system
07/04/2002US20020084315 Ball bumping substrates, particuarly wafers
07/04/2002US20020084309 Brazing apparatus and brazing method in which the amount of heating is controlled on the basis of temperature of articles to be brazed
07/04/2002US20020084308 Method, apparatus and computer readable medium for evaluating configuration of solder external terminals of a semiconductor device
07/04/2002US20020084307 Heating head for soldering and de-soldering of SMD components
07/04/2002DE10156263A1 Schaltungseinheit und Verfahren zur Herstellung derselben Circuit unit and method of manufacturing the same
07/03/2002EP1219376A1 Hot iron such as soldering iron and method of controlling the iron
07/03/2002EP1218138A1 Pneumatic weld head
07/02/2002US6414271 Contact heating device
07/02/2002US6413850 Method of forming bumps
07/02/2002US6412685 Method and apparatus for release and optional inspection for conductive preforms placement apparatus
07/02/2002US6412682 Wave soldering method and system used for the method
07/02/2002CA2269287C Fixing device
06/2002
06/27/2002WO2002049797A1 Solder foil and semiconductor device and electronic device
06/27/2002US20020079353 Passive and active heat retention device for solder fountain rework
06/27/2002US20020079305 Soldering iron
06/27/2002DE10055178C1 Verfahren zum Kontaktieren eines Wicklungsdrahtes einer Spule mit einem Anschlussstift A method of contacting a winding wire of a coil with a connecting pin
06/26/2002CN1355736A Fluxing agent for dry application
06/25/2002US6410081 Sintering noble metal, aluminum compound, silicon compound, and barium, calcium and/or magnesium compounds; high thermal and mechanical stress resistance
06/25/2002CA2349690C Process and apparatus for the wave soldering of circuit boards
06/20/2002US20020074379 Nozzle apparatus for surface mount device
06/19/2002EP1214168A1 System for monitoring and controlling a welding/brazing operation
06/19/2002EP0874711B1 Soldering iron
06/18/2002US6405918 Mechanical retention system for braze and solder joints
06/13/2002WO2002045897A1 Method and device for connecting minute joint metal, and composite tape for connecting minute joint metal
06/13/2002US20020070460 Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device
06/13/2002US20020070261 Reflow apparatus
06/13/2002US20020069998 Liquid - solid rolling bonding method for different kinds of metals and the apparatus therefor
06/13/2002US20020069526 Apparatus for mounting electronic components
06/13/2002US20020069506 Method and apparatus for the production of locally reinforced sheet-metal mouldings and products made thereby
06/13/2002DE10112355C1 Temperature-sensitive electronic component mounting method uses removable protection device for protecting component during mounting process
06/13/2002DE10052738C1 Brennkammer-Lötkolben Combustor soldering iron
06/12/2002EP1213083A2 Viscous fluid transfer apparatus and method
06/12/2002CN1353483A 焊接设备 Welding Equipment
06/12/2002CN1086161C High-frequency heating and pressurizing technique and equipment for soldering ring and planar parts made of different metals
06/11/2002US6402014 Method of forming bumps
06/11/2002US6402012 Method for forming solder bumps using a solder jetting device
06/11/2002US6402011 Reflow method and reflow device
06/11/2002US6401330 Apparatus for mounting an integrated circuit onto a printed circuit board and then testing the integrated circuit
06/06/2002US20020066766 Automatic soldering apparatus
06/05/2002EP1211720A2 Bump forming method and bump forming apparatus
06/05/2002EP1211011A1 Solder coating material and production method therefor
06/05/2002EP1211010A2 Method of induction brazing transformer strands to base plate
06/05/2002CN2494246Y Multifunctional quick gas welding torch
06/05/2002CN1352585A Method for producing radiator
05/2002
05/30/2002WO2002017380A3 Selective flux deposition
05/30/2002US20020064572 Rapid surface cooling of solder droplets by flash evaporation
05/29/2002EP1207979A2 Cobalt-base composition and method for diffusion braze repair of superalloy articles
05/29/2002CN2493342Y Box type holder for electric soldering iron
05/29/2002CN2493341Y Double-track type soldering machine
05/28/2002US6395334 Using motor
05/28/2002US6395087 Method and apparatus for dispensing viscous material
05/28/2002US6394334 Method and apparatus for forming solder bumps
05/28/2002CA2161770C Process and apparatus for the wave soldering of circuit boards
05/23/2002DE10150401A1 Optoelectronic component has solder connections between metallisation structures of optical component system and optical lens system
05/22/2002EP0849024B1 Soldering apparatus
05/21/2002US6391252 Self-brazing; injection molding; sintering; turbine blades
05/21/2002US6390439 Hybrid molds for molten solder screening process
05/21/2002US6390351 Apparatus and method of transferring conductive balls and apparatus and method of supplying conductive balls
05/21/2002US6389683 Apparatus and method for mounting electronic component
05/16/2002WO2002039802A2 Methods of positioning components using liquid prime movers and related structures
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