Patents
Patents for B23K 3 - Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (10,880)
07/2000
07/12/2000CN1259427A Intelligent type hydraulic valve oil distributor used for injection molding machine, and method therefor
07/11/2000US6087631 Soldering iron with temperature control cycles related to rectified voltage cycles
07/11/2000US6085968 Solder retention ring for improved solder bump formation
07/11/2000US6085960 Apparatus for measuring the height of a solder wave
07/06/2000WO2000038874A1 Method for partially or completely coating the surfaces of components produced from aluminum or its alloys with solders, fluxing agents or binders for brazing
07/06/2000DE19859735A1 Verfahren zur partiellen oder vollständigen Beschichtung der Oberflächen von Bauteilen aus Aluminium und seinen Legierungen mit Lot, Fluß- und Bindemittel zur Hartverlötung Method for partial or complete coating of the surfaces of components made of aluminum and its alloys with solder, flux and binding agent for brazing
07/06/2000DE19859734A1 Process for partially or completely coating the surfaces of aluminum (alloy) components comprises applying a solder, flux and binder in powdered form and fusing
07/05/2000EP1015159A1 Solder ball placement apparatus
07/05/2000CN2385832Y Electric soldering iron with automatic tin feeding
07/05/2000CN2385831Y Cordless electrid soldering iron
07/04/2000US6082607 Soldering method and apparatus
07/04/2000US6082606 Method and machine for wave soldering or tinning
07/04/2000US6082605 Continuous mode solder jet apparatus
06/2000
06/27/2000US6080956 Fiber optic light beam heating apparatus with adjustable lens position
06/27/2000CA2137980C Metal surface dry fluxing method and device for use before brazing or tinning
06/22/2000WO2000008684A9 High performance flip chip package
06/21/2000EP1011132A2 Ultrasonic bumping of electronic components
06/21/2000EP1009578A1 Pneumatic weld head with automatically adjusted pressure
06/21/2000CN2383610Y Multifunctional soldering iron supporter
06/21/2000CN2383609Y Electronic temp-controlled non-inductance soldering iron
06/20/2000US6077380 Method of forming an adhesive connection
06/20/2000US6076723 Metal jet deposition system
06/14/2000EP1007262A2 Soldering iron tip and method of making the same
06/13/2000US6073832 Soldering method and apparatus
06/07/2000CN2381427Y Clamps for special iron for surface-mounted elements
06/06/2000US6070783 Conductive ball attaching apparatus and method
06/06/2000US6070779 Liquid dosing device
06/02/2000WO2000020154A9 Method and apparatus for placing solder balls on a substrate
05/2000
05/31/2000EP1004390A1 Method of making a braze sheet
05/31/2000EP1004386A1 Brazed assembly and method of making same
05/30/2000US6068175 System for replacing a first area array component connected to an interconnect board
05/30/2000US6068174 Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
05/24/2000EP1002612A1 Kinetically controlled solder bonding
05/24/2000CN2379239Y Automatic solder feeding device for soldering machine
05/23/2000US6065666 Device for soldering a series of connectors and a method of use
05/23/2000US6065201 Method of transferring conductive balls onto work piece
05/18/2000WO2000027570A1 Method for making self-brazing components using powder metallurgy
05/18/2000DE19854036A1 Applying pasty media e.g. adhesive, solder paste, conductive glue etc. to circuit board by transmitting vibration from squeegee to pasty medium
05/17/2000EP1001667A2 Method for maintaining the printability of a solder paste
05/16/2000US6063329 Mini welding/soldering torch
05/11/2000WO2000025972A1 Solder paste with a time-temperature indicator
05/11/2000CA2348968A1 Solder paste with a time-temperature indicator
05/10/2000EP0894036B1 A solder dispensing apparatus
05/10/2000CN1252331A Machining process of high-accuracy and great-depth small hole
05/09/2000US6059176 Device and a method for applying a plurality of solder globules to a substrate
05/04/2000WO2000025358A1 Device for providing balls or preforms for making flip-chip connections
05/04/2000DE19950843A1 Flow soldering apparatus for printed circuit board, has gripping mechanism moved over solder tank
05/04/2000CA2348724A1 Device for providing balls or preforms for making flip-chip connections
05/02/2000US6057527 Portable electric desoldering tool
05/02/2000US6056191 Method and apparatus for forming solder bumps
05/02/2000US6056190 Solder ball placement apparatus
04/2000
04/26/2000EP0995578A2 Controlling a hydraulic actuator in an injection moulding machine
04/26/2000CN2375404Y Electronic soldering iron
04/25/2000US6054678 Heater-sensor complex
04/25/2000US6053398 Solder bump forming method, solder bump forming apparatus, head unit for use therein and soldering method using the head unit
04/20/2000WO2000022667A1 Apparatus and method for filling a ball grid array
04/19/2000EP0994641A1 Apparatus and method for mounting electronic component
04/19/2000CN2374298Y Multisensing heads rotary heating welder and its water gas rotary distributor
04/18/2000US6051273 Method for forming features upon a substrate
04/18/2000US6050481 Method of making a high melting point solder ball coated with a low melting point solder
04/18/2000US6050473 Brazing apparatus
04/13/2000WO2000020154A1 Method and apparatus for placing solder balls on a substrate
04/12/2000EP0991492A1 Compact high performance electric soldering iron
04/12/2000CN2373214Y Internally heated safety high-efficient electric iron
04/12/2000CN1051434C Jig for detecting warp of printed circuit board
04/11/2000US6047876 Process of using an active solder alloy
04/11/2000US6047875 Reflow soldering self-aligning fixture
04/06/2000WO2000018534A1 Device for treating printed circuit boards
03/2000
03/30/2000WO2000016941A1 Heat shield for soldering device
03/30/2000DE19842276A1 Paste zum Verschweißen von Keramiken mit Metallen und Verfahren zur Herstellung einer Schweißverbindung Paste for welding ceramic materials with metals and methods for producing a welded joint
03/29/2000EP0988129A1 Method and device for repairing defective soldered joints
03/29/2000CN1248932A 固定装置 Fixtures
03/28/2000US6043876 Method and apparatus for detecting a solder bridge in a ball grid array
03/28/2000US6042648 Vertical circuit board soldering apparatus
03/28/2000US6041573 Apparatus and method for charging canisters with a high pressure gas
03/23/2000WO2000015384A1 Paste for welding ceramics to metals and method for producing a welded joint
03/22/2000CN2369809Y Super low safety voltage low power consumption high efficiency electric iron
03/22/2000CN2369808Y 钎焊机 Brazing machine
03/21/2000US6040562 Structure for uniform heating in a heating device
03/21/2000US6039805 Transfer fluxing method and apparatus for component placement on substrate
03/21/2000US6039237 Heating tip and method of manufacturing the same
03/16/2000DE19841817A1 Apparatus for feeding soldering wire in soldering machines comprises feed wheels mounted on parallel, counter-rotating shafts so that the wire is held between their interacting rim elements
03/15/2000EP0985991A2 Apparatus and method for automatically correcting soldering
03/15/2000EP0910490B1 Molten solder dispensing system
03/15/2000CN2368639Y Tools for arc and gas welding
03/08/2000CN1246819A Soldering iron tip and method of making the same
03/02/2000WO2000011921A1 Method and device for placing and remelting shaped pieces consisting of solder material
03/02/2000WO2000010763A1 Method and device for distributing solder balls
02/2000
02/29/2000US6029882 Plastic solder array using injection molded solder
02/22/2000US6028673 Inspection of solder bumps of bump-attached circuit board
02/22/2000US6027068 Dispenser for solder and other ductile strand materials
02/22/2000US6027006 Method and apparatus for applying solder and forming solder balls on a substrate
02/17/2000WO2000008684A1 High performance flip chip package
02/16/2000EP0781185B1 Method for manufacturing metallic structures
02/16/2000CN2363822Y Internal heat-external heat transducer for electric iron
02/15/2000US6025258 Method for fabricating solder bumps by forming solder balls with a solder ball forming member
02/10/2000WO2000006333A1 Method for brazing by solder reflow electronic components and brazing device therefor
02/10/2000DE19822536A1 Soldering of electronic components to circuit boards involves withdrawal of surplus solder after the components to be joined have been wetted by solder
02/10/2000CA2338157A1 Method for brazing by solder reflow electronic components and brazing device therefor
02/09/2000EP0978342A2 Method and assembly for brazing a stator component of a gas turbine engine
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