Patents
Patents for B23K 3 - Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (10,880)
02/2002
02/26/2002US6350494 Controlling drops of metal, raster scanning and blanking
02/26/2002US6349861 Jet solder feeding device and soldering method
02/21/2002WO2002014010A1 Solder ball delivery and reflow apparatus and method
02/21/2002WO2002014009A1 Container device with adjustable volume for immobilizing solder shperes and method thereof
02/21/2002WO2002014008A1 Soldering method for mounting electric components
02/21/2002US20020022145 Metal foil connection, honeycomb body, metal foil brazing medium particle fraction for metal foils and method for manufacturing a metal foil connection
02/21/2002US20020020058 Method of mounting a BGA
02/21/2002DE10136268A1 Recirculation solder bath for soldering device has solder fed from reservoir to support from which liquid solder flows out
02/20/2002CN2478313Y Low noise electromagnetic pump soft soldered single/double peak generator
02/20/2002CN2477310Y Energy saving electric iron stand
02/20/2002CN2477309Y Temp regulating electric iron
02/20/2002CN1336860A Metal foil connection and solder grain fraction for metal foil connection
02/20/2002CN1079309C Machining process of high-accuracy and great-depth small hole
02/19/2002US6347901 Solder interconnect techniques
02/19/2002US6347734 Methods and apparatus for installing a module on a circuit board using heating and cooling techniques
02/14/2002WO2002011936A1 Solder plating system with plating carrier belt roller with locking sprocket pins
02/14/2002US20020017552 Flux supply device in which liquid flux is supplied through liquid holding portion, and liquid flux supply method
02/14/2002US20020017337 Soldering flux with cationic surfactant
02/07/2002WO2002010477A1 Electric soldering iron tip and electric soldering iron
02/07/2002US20020015780 Screen printing; jetting
02/07/2002US20020014519 Method of applying bonding paste
02/07/2002US20020014513 Soldering apparatus for through holes on surface mount printed circuit boards
02/06/2002EP1177849A1 Brazing apparatus and brazing method in which the amount of heating is controlled on the basis of temperature of articles to be brazed
02/06/2002EP0758282B1 Process for wave-soldering printed circuit boards
02/05/2002US6344237 Spraying gas and metal halide at velocities effective for adhesion to surface without use of binder
02/05/2002US6343732 Passive and active heat retention device for solder fountain rework
01/2002
01/31/2002WO2002007965A1 Stainless steel honeycomb panel and method for manufacturing thereof
01/31/2002US20020013642 Intelligent hydraulic manifold used in an injection molding machine
01/31/2002US20020011511 Apparatus and method for soldering electronic components to printed circuit boards
01/31/2002DE10033522A1 Vorrichtung zum verbesserten Inertisieren beim Schwallöten Apparatus for improved inerting in wave soldering
01/30/2002EP1175276A1 Material inspection
01/30/2002EP1175275A1 Method for producing weld points on a substrate and guide for implementing said method
01/30/2002CN2474259Y Tin containing water pipeline joint welding tongs
01/30/2002CN2474258Y Tin blowing electric soldering iron
01/29/2002US6342442 Kinetically controlled solder bonding
01/24/2002US20020007741 Method and apparatus for dispensing material in a printer
01/24/2002DE10034770C1 Einhand-Lötgerät mit integriertem Lotdepot und dosierbarem Lotangebot One-hand soldering tool with integrated solder deposit and dosable Lotangebot
01/23/2002CN1332052A Device and method for feeding welding fluid by fluid-holding part
01/22/2002US6340110 Method and apparatus for soldering printed circuit boards and cooling mechanism for a soldering apparatus
01/17/2002WO2002005608A1 Method, apparatus and use of applying viscous medium on a substrate
01/17/2002WO2002004161A1 Appliance for improved inertizing during wave soldering
01/17/2002WO2001068193A3 Multilayer golf ball with filled inner layer having dual core, liquid core, or wound core
01/17/2002US20020005429 Apparatus and method for manufacturing solder balls
01/17/2002US20020005376 Method for separating oxide from dross, device for separating oxide from dross, and jet solder tank
01/17/2002US20020005336 Adjusting unit
01/17/2002DE10033387A1 Welding or soldering thin sheets and lightweight metal comprises switching off the electric arc current during the base current intervals over a determined
01/17/2002DE10024676A1 Verfahren zum Bestimmen von Strömungsverhältnissen sowie Festplatine A method for determining flow conditions and hard board
01/16/2002EP1172169A2 Flux supply device and flux supply method
01/16/2002CN2471464Y Solder holding head of electric iron
01/10/2002US20020003137 Contact heating device
01/10/2002DE10130788A1 Wärmetauscher mit mehreren mit Sammelbehältern durch Verlöten verbundenen Röhrchen Heat exchanger with several associated with collecting tubes by soldering
01/09/2002EP1169894A1 Dispensing assembly
01/09/2002CN2470039Y Soldering tin device for electronic parts
01/09/2002CN2470038Y Soldering-tin scaling powder spraing device
01/09/2002CN1329951A Rolling method and apparatus for combining liquid-solid heterometals
01/09/2002CN1077476C Colling system of back-flow solder equipment and method for cooling soldered product
01/08/2002US6336581 Solder ball connection device and capillary tube thereof
01/03/2002WO2002000364A1 A compounding rolling method for two different kinds of metal materials respectively in solid and liquid state, and a device thereof
01/03/2002US20020000460 Method and apparatus for estimating quality of lead-free solder material and process and system for flow soldering
01/03/2002DE10029293A1 Laser beam welding device for diverse sheet material plates has supporting frame and clamping devices with modular set of identical, serially connectable basic and clamping modules
01/02/2002EP1165859A1 A method of depositing flux or flux and metal onto a metal brazing substrate
01/02/2002EP1165250A1 Dispensing assembly
01/02/2002EP1021268A4 Process of using an active solder alloy
01/02/2002CN2468648Y Temp. control type soldering iron
01/01/2002US6335514 Soldering assembly
01/01/2002US6334566 Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
12/2001
12/27/2001WO2001098721A1 Optical apparatus and methods for shrinking electronic components
12/27/2001US20010054641 Machine for wave soldering of tinning
12/27/2001US20010054637 Laser soldering method and apparatus
12/27/2001US20010054496 Heat exchanger having plural tubes connected to header tanks by brazing
12/26/2001CN2467248Y Electric circuit device for adjustable constant temperature electric welding bench
12/25/2001US6333494 Method of induction brazing transformer strands to base plate
12/25/2001US6333253 Pattern-block flux deposition
12/25/2001CA2243412C Soldering iron
12/20/2001WO2001097276A1 Microparticle arrangement film, electrical connection film, electrical connection structure, and microparticle arrangement method
12/19/2001EP1163080A1 Filling device and method for filling balls in the apertures of a ball-receiving element
12/19/2001CN2465852Y Matrix of electronic iron device
12/19/2001CN1327299A AC wave shape converter power source equipment for metal piece connection or reflux welding
12/19/2001CN1076240C Gas injection apparatus and process to form a controlled atmosphere in a confined space
12/19/2001CN1076239C Method for producing soldered metal honeycomb body
12/18/2001US6331076 Solder paste with a time-temperature indicator
12/13/2001WO2001094068A1 Waxed fabric producing method and device therefor
12/13/2001US20010051323 Convection-type brazing method and its apparatus for metal workpieces
12/13/2001DE10125577A1 Heated bonding device for mounting semiconductor chip onto multi-layer substrate comprises ceramic heater and pressing tool with thermal isolation element to hold and protect heater
12/12/2001EP1162021A1 Method and apparatus for estimating quality of lead-free solder material and process and system for flow soldering
12/12/2001EP1162020A2 Single handed soldering tool with integrated solder material reservoir and dosable solder material supply
12/12/2001CN2464494Y Metal fusion welding mould
12/12/2001CN2464493Y Eddy type electric soldering iron
12/12/2001CN2464492Y Low-voltage multi-function electric soldering iron
12/12/2001CN2464126Y Fusion welding machine for ornamental chain
12/11/2001US6329641 Device and method for controlling a soldering iron
12/11/2001US6329631 Solder strip exclusively for semiconductor packaging
12/06/2001US20010048158 Solder balls and columns with stratified underfills on substrate for flip chip joining
12/06/2001US20010048017 Continuous mode solder jet apparatus
12/05/2001CN2463096Y Terminal capable of preventing soldering tin from reversing flow
12/05/2001CN1325332A Solder paste with time/temp. indicator
12/04/2001US6325272 Apparatus and method for filling a ball grid array
12/04/2001US6325271 Continuous mode solder jet apparatus
12/04/2001US6324973 Method and apparatus for dispensing material in a printer
11/2001
11/29/2001WO2001089753A1 Improved apparatus and method for dispensing solder
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