Patents
Patents for B23K 3 - Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (10,880)
09/2003
09/17/2003CN1443112A Stainless sheet honeycomb panel and method for mfg. thereof
09/17/2003CN1442268A Aluminium base composite material liquid phase rotating welding material back filling welding method
09/16/2003US6619531 Temperature control method of solder bumps in reflow furnace, and reflow furnace
09/16/2003US6619472 Adjusting unit
09/16/2003US6619198 Method and apparatus for dispensing material in a printer
09/11/2003US20030168499 Soldering method and solder joint member
09/11/2003US20030168498 Method and apparatus for dispensing solder on a substrate
09/11/2003US20030168493 Soldering tool
09/10/2003EP1342525A1 Method and apparatus for applying solder to a substrate
09/04/2003US20030164395 Solder ball attaching process
09/03/2003CN2569963Y Automatic controlled soldering equipment
09/03/2003CN2569962Y Electric soldering iron equipment having tin suction and tin feeding function
09/03/2003CN1439732A Oxide separators
09/03/2003CN1439731A Oxide separators
08/2003
08/28/2003US20030160088 Vacuum compression brazing furnace and method of using same
08/27/2003CN1438089A 准直仪焊接装置及其方法 Collimator welding apparatus and method
08/26/2003US6609675 Desoldering wick dispenser
08/26/2003US6609652 Ball bumping substrates, particuarly wafers
08/20/2003EP1207979A4 Cobalt-base composition and method for diffusion braze repair of superalloy articles
08/20/2003CN1436627A Manufacture of copper core of automobile radiator
08/20/2003CN1118886C Electric connector and producing method thereof
08/19/2003US6607118 Apparatus and method for ball release
08/19/2003US6607117 Solder ball attaching system and method
08/19/2003US6607116 Method and apparatus for estimating quality of lead-free solder material and process and system for flow soldering
08/14/2003WO2003066265A2 Vacuum compression brazing furnace and method of using same
08/13/2003EP1334648A1 Method of jetting viscous medium
08/13/2003CN2565575Y Internal heating electric iron
08/13/2003CN2565574Y Temp-regulating electromagnetic induction heating iron
08/12/2003US6604723 Monitor and keyboard mount for automated solder paste inspection system
08/12/2003US6604673 Filling device and method for filling balls in the apertures of a ball-receiving element
08/12/2003US6604255 Soldering iron cleaning apparatus
08/07/2003US20030146264 Soldering iron with heat pipe
08/06/2003EP1332654A2 Methods of positioning components using liquid prime movers and related structures
08/06/2003CN1434980A Microparticle arrangement film, electrical connection film, electrical connection stracture and microparticle arrangement method
08/06/2003CN1117212C Process for producing encased honeycombed body
07/2003
07/31/2003WO2003061893A1 Solder-dross mixture separation method and apparatus
07/31/2003US20030141350 Method of applying brazing material
07/30/2003EP1330328A1 Method and device for applying material to a workpiece
07/30/2003CN1432446A Heater for soldering machine
07/29/2003US6599372 Water insoluble resin dispersed in water, activating agent is organic acid or halogen compound; resin is pentaerythritol ester of hydrogenated rosin; printed circuit board
07/29/2003US6598782 Metal foil connection, honeycomb body, metal foil brazing medium particle fraction for metal foils and method for manufacturing a metal foil connection
07/24/2003WO2003060987A1 Method of arranging micro spheres with liquid, micro sphere arranging device, and semiconductor device
07/24/2003WO2003059564A1 Soldering method and solder alloy for additional supply
07/24/2003US20030136817 Method and apparatus for controlled application of flux
07/24/2003US20030136816 Solder-dross mixture separation method and apparatus
07/23/2003EP1329276A2 Soldering station with built-in self-calibration function
07/22/2003US6595408 Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement
07/22/2003US6595404 Method of producing electronic part with bumps and method of producing electronic part
07/16/2003EP1326730A1 Device for positioning a tool in relation to a workpiece
07/16/2003EP1326729A1 Method and device for applying pieces of material to a workpiece
07/16/2003CN2560468Y Constant-teperature electric iron
07/16/2003CN1430542A Improved apparatus and method for dispensing solder
07/15/2003US6592017 Automatic dross removal apparatus and method
07/10/2003WO2003056592A1 Solder ring for production of vacuum tube and method for the production of such a solder ring and of a vacuum tube
07/10/2003WO2003055639A1 Slotting device for resin flux cored solder
07/10/2003US20030127501 Apparatus and method of placing solder balls onto a substrate
07/10/2003US20030127500 Method for forming solder connections on a circuitized substrate
07/10/2003US20030127498 Gas injection type soldering method and apparatus
07/09/2003EP1324852A1 A gas powered soldering tool
07/09/2003EP1324851A1 Polymer collar for solder bumps
07/09/2003CN1429143A Soldering flux with cationic surfactant
07/08/2003US6588645 Continuous mode solder jet apparatus
07/03/2003US20030122247 High performance multi-chip flip chip package
07/03/2003US20030121957 Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux
07/03/2003US20030121950 Trough device in a soldering furnace
07/02/2003CN1427667A Application method of outer lead pin joining backfold welding heat insulating material
07/02/2003CN1427666A Local welding method for printed substrate and apparatus thereof
06/2003
06/26/2003WO2003051568A1 Cordless soldering iron
06/26/2003US20030116610 Metal foil connection, honeycomb body, metal foil brazing medium particle fraction for metal foils and method for manufacturing a metal foil connection
06/26/2003US20030116607 Adjustable nozzle of stannic furnace
06/26/2003US20030116606 Solder bath with rotatable nozzle
06/26/2003US20030116352 Wave soldering method using lead-free solder, apparatus therefor, and wave-soldered assembly
06/25/2003EP1321215A2 Method and apparatus for local application of solder to preselected conductor areas on a printed circuit board
06/25/2003CN2557276Y Thermo-insulating cap for electric soldering iron
06/25/2003CN1425526A Double bottom braze welding method
06/25/2003CN1112273C Soldering flux jetting device and soldering method
06/24/2003US6581818 Trough device in a soldering furnace
06/24/2003US6581282 Apparatus for mounting electronic components
06/19/2003US20030111518 Method and apparatus for deposition of solder paste for surface mount components on a printed wiring board
06/19/2003US20030111517 Method and apparatus for local application of solder to preselected conductor areas on a printed circuit board
06/19/2003US20030111508 Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux
06/19/2003US20030111459 Convection type brazing apparatus for metal workpieces
06/17/2003US6580050 Soldering station with built-in self-calibration function
06/17/2003US6578773 An assembly for jetting droplets of a viscous medium, said assembly being releasably mountable in a machine using the assembly for providing a substrate with deposits
06/17/2003US6578755 Polymer collar for solder bumps
06/17/2003US6578752 Method and apparatus for separating dross floating on solder
06/12/2003US20030109330 Multilayer golf ball with filled inner layer having dual core, liquid core, or wound core
06/12/2003US20030107126 High performance multi-chip flip chip package
06/10/2003US6576030 Filtering apparatus
06/10/2003US6575352 Apparatus and method for soldering electronic components to printed circuit boards
06/10/2003US6575351 Work/head positioning apparatus for ball mount apparatus
06/05/2003US20030102352 Soldering machine
06/05/2003US20030102297 System and method for mounting electronic components onto flexible substrates
06/04/2003EP1007262B1 Soldering iron tip and method of making the same
06/03/2003US6572010 Coaters comprising electrolytic cells, fluid flow enclosures, etching, cleaning, conveyor lithography and substrate handling stations used for electrodeposition of metals and/or alloys on semiconductor substrates
06/03/2003US6572009 Passive and active heat retention device for solder fountain rework
06/03/2003US6571701 Stirring mechanism for viscous-material printer and method of printing
05/2003
05/29/2003US20030098342 Method for connecting conductive members
05/29/2003US20030097941 Method and apparatus for dispensing material in a printer
05/28/2003EP1314342A1 Method, apparatus and use of applying viscous medium on a substrate
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