Patents
Patents for B23K 3 - Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (10,880)
07/2005
07/14/2005US20050150936 Bumping electronic components using transfer substrates
07/13/2005EP1552731A1 Jetting device and method at a jetting device
07/13/2005EP1551588A1 Cleaning gas device cleaning the process gas of a reflow soldering system
07/13/2005CN2709075Y Large cyclone sealing off apparatus handle
07/13/2005CN1636664A Soldering tin connecting device
07/13/2005CN1636663A Jet type welding apparatus
07/12/2005US6915941 Method for local application of solder to preselected areas on a printed circuit board
07/12/2005US6915940 Device for applying solder globules
07/06/2005EP1549825A2 Dockable direct mechanical actuator for downhole tools and method
07/06/2005EP1549452A2 Selective gas knife for wave soldering
07/06/2005CN1209220C Method for producing radiator
07/05/2005US6913183 Selective gas knife for wave soldering
07/05/2005US6913182 Method and apparatus for controlled application of flux
06/2005
06/30/2005WO2005059823A2 Systems and methods for detecting defects in printed solder paste
06/30/2005US20050139643 Method and system for applying solder
06/30/2005US20050139638 Automated packaging apparatus and method of optical elements
06/30/2005US20050138800 Method and apparatus for thermally coupling a heat dissipation device to a microelectronic device
06/30/2005DE10392640T5 Aufschmelzlötvorrichtung Reflow
06/30/2005DE10251896B4 Verbindungsvorrichtung Connecting device
06/29/2005CN1631597A Method and device for argon arc ferrochrome iron braze welding
06/29/2005CN1631596A Argon arc ferrochrome ion braze welding torch
06/28/2005US6911618 Cutting wires, then melting in plasma arcs and cooling to form unifrom spheres, used for bonding electronics; balling; shaping
06/28/2005US6911387 Bump forming method and apparatus for heating and compressing bump materials inserted in positioning holes
06/28/2005US6910614 Vacuum compression brazing furnace and method of using same
06/23/2005WO2005056227A1 Soldering iron with replaceable tip cap
06/23/2005WO2005056200A1 Stencil and method for depositing a viscous product about solder balls therewith
06/23/2005US20050133573 Solder contact reworking using a flux plate and sequeegee
06/23/2005US20050133572 Methods of forming solder areas on electronic components and electronic components having solder areas
06/23/2005US20050133570 Method and apparatus for conductive ball bonding of components
06/22/2005EP1544984A1 Manufacturing of a winding of an electric machine using conductor elements
06/16/2005DE202005003277U1 Device for convective heating of conductor plates includes repellent members to keep liquid solder away from endangered installations
06/16/2005DE10349957A1 Method of soldering components onto a printed circuit board involves applying fluid solder by machine to a locally defined area of the circuit board
06/15/2005EP1456862B1 Solder ring for production of vacuum tube and method for the production of such a solder ring and of a vacuum tube
06/15/2005EP1233841B1 Method and device for producing a soldered joint
06/15/2005CN1626304A Temperature control method for solder handling devices and apparatus for temperature control for those devices
06/15/2005CN1206899C Electronic element welder and method, circuit board and electronic element mounting device
06/14/2005US6905062 Automated soldering system with multiple feed lines
06/14/2005US6905059 Solder ball attachment system
06/09/2005US20050121499 Methods and device for controlling pressure in reactive multilayer joining and resulting product
06/09/2005US20050121496 Apparatus for immobilizing a solid solder element to a contact surface of interest
06/09/2005US20050121495 Temperature control system for solder handling devices and method for temperature control for those devices
06/09/2005US20050121420 Electric welder, electrode and method of use thereof for spot-weld tacking eutectic solder to thin film depositions on non-conductive substrates
06/09/2005DE202004001817U1 Cleaning device for solder spikes has stripping element angled above a solder residues collector at less than ninety degrees to the horizontal
06/09/2005DE102004054924A1 Soldering with reaction solder, e.g. for use when mounting electronic components, involves separately melting two or more different solder materials and mixing them so that new alloy is formed directly at solder point
06/09/2005DE102004047499A1 Wire Bonder mit einer Haltevorrichtung zum Anpressen der Anschlussfinger eines Systemträgers an eine Heizplatte Wire bonder having a holding device for pressing the connector fingers of a lead frame on a hot plate
06/09/2005DE102004043639A1 Substrat zur Herstellung einer Lötverbindung The substrate for forming a solder joint
06/08/2005CN2703600Y Electric iron support
06/08/2005CN2703599Y Electric iron head
06/07/2005US6902102 Soldering method and solder joint member
06/02/2005US20050116208 Paste composition for brazing and brazing method using the same
06/02/2005DE102004030588A1 Verbindungsmaterialschablone und Verfahren zur Verwendung Connecting material mask and method of using
06/01/2005CN1621188A Intermedium pipe welding technology of steel column type radiator
05/2005
05/31/2005US6899261 Method and arrangement for a martensite-free brazing process
05/26/2005WO2005046923A1 Temperature self-regulating soldering iron with removable tip
05/26/2005WO2005046921A1 Methods and device for controlling pressure through a compliant element in reactive multilayer joining and resulting product joined according to this method
05/26/2005US20050109823 Feed devices and methods for injection molded solder systems
05/26/2005US20050109756 Temperature self-regulating soldering iron with removable tip
05/26/2005CA2544180A1 Methods and devices for controlling pressure through a compliant element in reactive multilayer joining and product joined according to this method
05/25/2005DE10392557T5 Filtration von Flussmittelverunreinigungen Filtration flux impurities
05/25/2005CN1620352A Method for soldering work pieces
05/25/2005CN1203733C Solder-bearing wafer for usein soldering operations
05/19/2005US20050106329 Selective deposition of solder particles over metal interconnect features on electronic device substrate, such as a silicon wafer substrate, to provide electrical interconnection between substrate interconnect features and devices to be attached to substrate, using electrokinetic or electrostatic means
05/19/2005US20050103820 Solder ring for production of vacuum tube and method for the production of such a solder ring and of a vacuum tube
05/18/2005CN2700039Y Electric iron for feeding tin easily
05/18/2005CN2700038Y Welding head
05/18/2005CN1617295A Circuit board transferring apparatus and method and solder ball mounting method
05/12/2005US20050098611 Substrate for producing a soldering connection
05/12/2005US20050098606 Ball mounting apparatus and method
05/12/2005US20050097990 Rapid surface cooling of solder droplets by flash evaporation
05/12/2005DE10392500T5 Lottragende Artikel und Verfahren zum Zurückhalten einer Lotmasse darauf Solder-bearing articles and methods for retaining a solder mass on it,
05/11/2005EP1163080B1 Filling device and method for filling balls in the apertures of a ball-receiving element
05/11/2005CN1615542A Method of arranging micro spheres with liquid, micro sphere arranging device, and semiconductor device
05/11/2005CN1615201A Soldering method and solder alloy for additional supply
05/10/2005US6891967 Systems and methods for detecting defects in printed solder paste
05/10/2005US6890430 Solder dross removal apparatus and method
05/05/2005US20050092810 Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece
05/05/2005US20050092729 Cartridge-type soldering iron
05/04/2005CN2696760Y Pipe end welding part heaing device
05/04/2005CN1200596C Dispensing assembly
05/04/2005CN1200595C Gas shielded welding device
05/03/2005US6888242 Color contacts for a semiconductor package
05/03/2005US6886734 Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
05/03/2005US6886733 Conductive powder applying device immersing substrate into conductive powder by rotating tank including conductive powder and substrate at opposing positions
04/2005
04/28/2005US20050087587 Method for direct application of flux to a brazing surface
04/27/2005EP1525085A2 Method and device for forming a body having a three-dimensional structure
04/27/2005EP1358034B1 Method for soldering work pieces
04/27/2005CN2695160Y Temperature adjustuble direct current electric welding device
04/27/2005CN1608780A Solder drawing device for manual flat cable soldering
04/27/2005CN1199535C Soldering apparatus, and separating agent and method for separating solder and solder oxides
04/26/2005US6883698 Planting device for planting solder balls onto a chip
04/21/2005WO2005035176A1 Jet solder vessel
04/21/2005US20050085007 Joining material stencil and method of use
04/21/2005US20050082686 Circuitized substrate for fixing solder beads on pads
04/20/2005EP1524060A2 Methods of positioning components using liquid prime movers and related structures
04/20/2005CN2693397Y All direction soldering structure of automatic soldering machine
04/20/2005CN2693396Y Control tool structure for transformer tin soldering
04/20/2005CN2693395Y Tin ball welding apparatus
04/20/2005CN1607058A Noise free highly effective electromagnetic pump soft soldered single/double peak generator
04/20/2005CN1197678C Braze-welding apparatus of controlling heating degree according to temp. of structural member being braze-welded
04/19/2005US6882902 Method of and apparatus for thermal analysis, method of and apparatus for calculating thermal conditions, computer product
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