| Patents for B23K 3 - Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (10,880) |
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| 04/19/2005 | US6880744 Method of applying brazing material |
| 04/14/2005 | WO2005033352A2 Deposition and patterning process |
| 04/14/2005 | DE4142436B4 Lötanlage mit einer Schutzgasatmosphäre über dem Lötband Soldering with a protective gas atmosphere above the solder ribbon |
| 04/13/2005 | EP1521660A1 Fluxing apparatus for applying powdered flux |
| 04/13/2005 | CN2691767Y Tin ball arrangement mechanism of ball embedding machine |
| 04/13/2005 | CN2691766Y Tin ball arrangement mechanism of ball embedding machine |
| 04/13/2005 | CN2691765Y Tinball arrangement mechanism of ball embedding machine |
| 04/13/2005 | CN2691764Y High efficiency long service life soldering iron bit |
| 04/13/2005 | CN1606789A Solder ring for production of vacuum tube and method for the production of such a solder ring and of a vacuum tube |
| 04/13/2005 | CN1197138C Method for fixing semiconductor chip, and device therefor |
| 04/12/2005 | US6878396 Micro C-4 semiconductor die and method for depositing connection sites thereon |
| 04/07/2005 | WO2005031847A1 Gripping method and device for removing balls from a bulk container |
| 04/07/2005 | US20050072834 Connection site coating method and solder joints |
| 04/07/2005 | US20050072828 Jet nozzle structure for soldering apparatus |
| 04/06/2005 | CN2690092Y Xiaoxuanfeng dismantling welder handle |
| 04/06/2005 | CN1604724A Solder ball supplying method and supplying device |
| 04/06/2005 | CN1603044A Digital control constant temperature weld/rework system |
| 04/05/2005 | US6875966 Portable induction heating tool for soldering pipes |
| 04/05/2005 | US6874671 Soldering tool |
| 04/05/2005 | US6874498 Gas powered soldering tool |
| 03/31/2005 | US20050067472 Method for connecting connection members to board |
| 03/31/2005 | US20050067470 Solder deposition method |
| 03/31/2005 | US20050067464 Fixture for supporting a printed circuit board in a production line |
| 03/31/2005 | US20050067463 Adjustable frame fixture |
| 03/31/2005 | US20050067462 Wire bonder with a downholder for pressing the fingers of a system carrier onto a heating plate |
| 03/31/2005 | US20050067189 joining electronic terminals plated with lead-free metals; semiconductors; printed circuits |
| 03/31/2005 | DE10132567B4 Verfahren und Vorrichtung zum Aufbringen eines Lötmittels auf ein Substrat Method and apparatus for applying a solder to a substrate |
| 03/30/2005 | CN2688434Y External contra-aperture heater |
| 03/30/2005 | CN1602142A Nozzle structure of local soft soldering appts. |
| 03/30/2005 | CN1601712A Reinforced solder bump structure and method for forming a reinforced solder bump |
| 03/30/2005 | CN1600484A Wire bonder with a downholder |
| 03/30/2005 | CN1600483A Fabricating method for combining head of golf ball rod by flash heat through infrared ray |
| 03/29/2005 | CA2357954C Electrode with brazed separator and method of making same |
| 03/24/2005 | US20050061857 Method for bonding a sputter target to a backing plate and the assembly thereof |
| 03/24/2005 | US20050061851 Auxiliary soldering tool |
| 03/24/2005 | US20050061850 Inclined solder wave methodology for wave soldering double sided pin-in-hole electronic components |
| 03/24/2005 | DE10029293B4 Vorrichtung und Verfahren zum Laserstrahlschweißen von Blechplatinen Apparatus and method for laser welding of sheet metal blanks |
| 03/23/2005 | CN1597219A Preparation method of single layer soldering diamond tool |
| 03/23/2005 | CN1194593C Application method of outer lead pin joining backfold welding heat insulating material |
| 03/23/2005 | CN1193855C Coating device for solder material |
| 03/22/2005 | US6869008 Method of forming bumps |
| 03/16/2005 | CN1593827A Solder ball bonding method and bonding device |
| 03/16/2005 | CN1192844C 焊接装置 Welding equipment |
| 03/16/2005 | CN1192843C Method for brazed joint of metal workpieces |
| 03/15/2005 | US6868305 Intelligent hydraulic manifold used in an injection molding machine |
| 03/15/2005 | US6866881 Dispensing system and method |
| 03/10/2005 | US20050051605 Process of manufacturing a solder-fill for applying to semiconductor package |
| 03/10/2005 | US20050051604 Method and system for forming ball grid array ("BGA") packages |
| 03/10/2005 | US20050051598 Solder preform for low heat stress laser solder attachment |
| 03/10/2005 | US20050051521 Solder ball bonding method and bonding device |
| 03/10/2005 | US20050050866 Filtering apparatus |
| 03/09/2005 | CN2683301Y Multifunctional multi-stage soldering machine |
| 03/09/2005 | CN2683260Y Intelligent atomizing and foaming double-purpose welding flux spraying coater |
| 03/09/2005 | CN1592552A Return device |
| 03/03/2005 | WO2005018861A1 Heater chip for thermocompression bonding |
| 03/03/2005 | US20050045701 Solder ball supplying method and supplying device |
| 03/03/2005 | US20050045698 Solder-fill application for mounting semiconductor chip on PCB |
| 03/01/2005 | US6860417 Low shock work transport system for pressure vessels |
| 02/24/2005 | US20050040528 Method of arranging micro spheres with liquid, micro sphere arranging device, and semiconductor device |
| 02/24/2005 | DE10145420B4 Verfahren zur Herstellung einer Lotverbindung A method for producing a solder joint |
| 02/24/2005 | DE10049660B4 Verfahren zum Herstellen lokal verstärkter Blechumformteile A method for producing the locally enhanced formed sheet metal parts |
| 02/23/2005 | CN2680395Y Tin ball welding device |
| 02/17/2005 | US20050035182 Circuit board transferring apparatus and method and solder ball mounting method |
| 02/17/2005 | US20050034302 Component connecting apparatus and method and component mounting apparatus |
| 02/17/2005 | DE10332760B3 Fluidausgabevorrichtung A fluid dispensing apparatus |
| 02/17/2005 | DE102004003521B3 Repair soldering head for component replacement with circulation of heat transfer medium used for melting solder for releasing component to be replaced |
| 02/16/2005 | CN1582210A Cordless soldering iron |
| 02/16/2005 | CN1189648C Decice for making honeycomb structure of waste gas exhausting controlling means |
| 02/15/2005 | US6854671 Nozzle for ejecting molten metal |
| 02/15/2005 | CA2235991C Method and apparatus for dispensing small amounts of liquid material |
| 02/10/2005 | US20050031776 Method and device for applying material to a workpiece |
| 02/09/2005 | CN1578600A Parts coupling device and method and parts assembling device |
| 02/09/2005 | CN1578599A Regenerating method for welding tool |
| 02/09/2005 | CN1575901A Solder heating tool and tip part thereof |
| 02/09/2005 | CN1575900A Solder heating tool |
| 02/09/2005 | CN1575899A temperture regulator for iron |
| 02/08/2005 | US6852572 Method of manufacturing semiconductor device |
| 02/03/2005 | WO2005009626A1 Fluid discharging device |
| 02/03/2005 | US20050023681 Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device |
| 02/03/2005 | US20050023326 Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device |
| 02/02/2005 | CN1575124A Substrate holder |
| 02/02/2005 | CN1574273A Substrate alignment method and apparatus |
| 02/02/2005 | CN1187161C Control method for copper content in solder dipping bath |
| 02/01/2005 | US6848610 Approaches for fluxless soldering |
| 02/01/2005 | US6848171 Method of fabricating temperature control device |
| 01/27/2005 | US20050017052 Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device |
| 01/26/2005 | CN2673549Y Welding device for series lamp |
| 01/26/2005 | CN1569376A Method for transplanting solder on electric terminal |
| 01/26/2005 | CN1186159C Heating tool such as searing-iron |
| 01/26/2005 | CN1186137C Rolling method and apparatus for combining liquid-solid heterometals |
| 01/25/2005 | US6845901 Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece |
| 01/20/2005 | US20050011934 Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus |
| 01/20/2005 | US20050011876 Soldering iron with replaceable tip cap |
| 01/20/2005 | DE10327462A1 Device for introducing wire-like additional material during laser welding or soldering has core running within guiding tube and surrounding additional material provided with insert |
| 01/19/2005 | CN2671735Y Energy saving electric iron |
| 01/19/2005 | CN2671734Y Direct heat transfer type electric iron |
| 01/19/2005 | CN2671733Y Heat control electric iron |
| 01/18/2005 | US6844216 Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux |
| 01/13/2005 | US20050006435 Soldering nozzle for wave soldering printed circuit boards |
| 01/12/2005 | EP1332654B1 Methods of positioning components using liquid prime movers and related structures |