Patents
Patents for B23K 3 - Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (10,880)
08/2001
08/14/2001US6273317 Flow soldering apparatus having resilient substrate clamping mechanism and solder oxide film removing mechanism
08/09/2001US20010011828 Spherical particle transport apparatus
08/09/2001US20010011506 Method and apparatus for dispensing material in a printer
08/08/2001EP1121218A1 Method and apparatus for placing solder balls on a substrate
08/08/2001CN1307508A Method for brazing by solder reflow electronic components and brazing device therefor
08/07/2001US6271507 Apparatus and method for bonding conductors
08/07/2001US6271110 Bump-forming method using two plates and electronic device
08/07/2001US6270898 Tool tip and bonding tool comprising the tool tip and control method for the bonding tool
08/07/2001US6270002 Ball arrangement method and ball arrangement apparatus
08/07/2001US6269868 Heat exchanger with variable compression side support
08/02/2001US20010010324 Solder bump forming method and apparatus
08/02/2001US20010010310 Ceramic heater
08/01/2001CN2440616Y Electromagnetic flexible pipe style tin sucker
08/01/2001CN2440615Y Automatic tin solder
07/2001
07/31/2001US6267288 Pallet for combined surface mount and wave solder manufacture of printed ciruits
07/26/2001WO2001053031A1 System for monitoring and controlling a welding/brazing operation
07/26/2001US20010009261 Method and apparatus for lining up micro-balls
07/25/2001EP1118416A2 AC waveform inverter power supply apparatus for metallic member joining or reflow soldering
07/25/2001EP1118414A2 Soldering method and soldering apparatus
07/25/2001EP0885084B1 Reflow soldering apparatus with a rotative configuration
07/25/2001CN1305398A Device and method for jetting droplets
07/25/2001CN1304814A Solder spouting device and soldering method
07/24/2001US6265017 Method and control system for applying solder flux to a printed circuit
07/24/2001US6264090 High speed jet soldering system
07/24/2001US6264089 Connecting apparatus
07/19/2001US20010008487 AC waveform inverter power supply apparatus for metallic member joining or reflow soldering
07/19/2001US20010008250 Method of forming a solder ball
07/19/2001US20010008249 Method and apparatus for release and optional inspection for conductive preforms placement apparatus
07/19/2001US20010008160 Method of producing electronic part with bumps and method of producing electronic part
07/18/2001EP1117273A2 Ceramic heater
07/18/2001EP1115528A1 Heat shield for soldering device
07/18/2001CN1304170A Method for making electronic element with lugs and method for making said electronic element
07/18/2001CN1068539C Header jig
07/17/2001US6260741 Method and apparatus for forming droplets
07/17/2001US6260259 Solder ball mounting device
07/12/2001US20010007330 Ball mount apparatus
07/12/2001US20010007282 Heat exchanger and brazing method
07/11/2001CN2438541Y Honeycomb heat resistant body for improved solder installation
07/10/2001US6257482 Jet solder feeding device and soldering method
07/10/2001US6257480 Jet soldering method and apparatus
07/10/2001US6257478 Soldering/unsoldering arrangement
07/04/2001CN2437444Y Environment protection electric iron
07/03/2001US6253992 Solder ball placement fixtures and methods
07/03/2001US6253985 Unit for supplying solder balls
07/03/2001US6253957 Method and apparatus for dispensing small amounts of liquid material
07/03/2001US6253675 Solder paste stenciling apparatus and method of use for rework
06/2001
06/28/2001US20010004982 Reflow soldering apparatus
06/27/2001EP1110655A2 Reflow soldering apparatus
06/26/2001US6250537 Self-cleaning soldering thimble assembly
06/20/2001CN2435178Y Multi-functional hot air tin attracting welding gun
06/19/2001US6247635 High density connector having a ball type of contact surface
06/19/2001US6247632 Molded selective solder pallet
06/19/2001US6247631 Electric soldering iron
06/13/2001EP1106947A1 Heating device
06/12/2001US6244853 Gas burner and a gas powered heating device
06/12/2001US6244788 Apparatus for supplying solder balls
06/07/2001WO2001039922A1 Soldering flux
06/07/2001DE19831103A1 Soldering equipment has tin-lead solder in solder device and transported towards soldering piston by lever mechanism to be melted on copper part with outlet channel for molten solder
06/06/2001CN2433040Y Welder with waste gas retrieving device
06/05/2001US6241141 Reflow soldering self-aligning fixture
05/2001
05/31/2001US20010001990 Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy
05/31/2001DE10042661A1 Mounting method for semiconductor chip, involves deflecting gripper relative to bonding head so as to lower chip at soldering portion of substrate and then raising it by preset distance before being let go by gripper
05/30/2001EP1102655A1 Movable selective debridging apparatus and method of debridging soldered joints on printed circuit boards using same
05/30/2001CN1066373C Method for dry fluxing of metallic surface before soldering or tinning
05/29/2001US6237906 Battery jig for facilitating the electrical connection of a line of dry cell batteries
05/29/2001US6237832 Wave soldering fixture
05/29/2001US6237831 Solder collecting capsule and solder extracting desoldering tool using same
05/24/2001US20010001464 Apparatus and method for bonding conductors using induction heating
05/23/2001EP1101559A2 MAG soldering method and use of a protective gas
05/23/2001EP1100644A1 Method for brazing by solder reflow electronic components and brazing device therefor
05/23/2001DE19953654A1 Verfahren und Vorrichtung zur Herstellung einer Lotverbindung Method and apparatus for producing a solder joint
05/23/2001DE10026067A1 Düsen-Lotzufuhrgerät und Lötverfahren Nozzle Lotzufuhrgerät and soldering
05/22/2001US6235208 Mixing with separation agent; removal floating solder oxide on melt
05/22/2001US6234382 Method and device for bonding solder balls to a substrate
05/22/2001US6234379 No-flow flux and underfill dispensing methods
05/22/2001US6234377 Brazing composition for aluminum material, aluminum material for brazing, and method of brazing aluminum material
05/22/2001US6234373 Electrically conductive elevation shaping tool
05/22/2001US6234358 Floating head liquid dispenser with quick release auger cartridge
05/17/2001WO2001034334A1 Method and device for producing a soldered joint
05/17/2001DE10036114A1 Ball mount apparatus has ball inspection apparatus which performs inspection of ball adsorbed by mount head, arranged perpendicular to elongated direction of workpiece
05/15/2001US6231333 Apparatus and method for vacuum injection molding
05/15/2001US6230963 Method and apparatus using colored foils for placing conductive preforms
05/10/2001WO2001033923A2 Soldering unit and use of a solder conveyor pump comprising a conveyor worm in a soldering unit
05/10/2001US20010000906 Paste providing method, soldering method and apparatus and system therefor
05/10/2001US20010000905 Method and apparatus for soldering ball grid array modules to substrates
05/10/2001US20010000900 Soldering assembly
05/10/2001DE19953316A1 Lötanlage und Verwendung einer Lotförderpumpe mit Förderschnecke in einer Lötanlage Soldering and using a Lotförderpumpe with screw conveyor in a soldering
05/10/2001DE10054100A1 Soldering machine has solder spraying openings in several rows in relation to the direction in which the substrate is transported
05/09/2001EP1097020A1 Solder ball placement apparatus
05/09/2001CN2429290Y Electromagnet pump style single-double spike generator for liquid metal brazing
05/08/2001US6227437 Solder ball delivery and reflow apparatus and method of using the same
05/03/2001WO2001030531A1 Fluxing agent for dry application
05/03/2001WO2001030527A1 Chain/ring making brazing furnace
05/03/2001DE19952043A1 Process for metal-protective gas soldering of metallic workpieces uses solder material and an electric arc with melting or non-melting electrodes in the presence of a protective gas having an inert component and an active component
05/02/2001CN2428253Y Carbon-resistance soldering machine
05/01/2001US6224180 High speed jet soldering system
05/01/2001US6223969 Method and machine for wave soldering or tinning
05/01/2001CA2239963C Soldering method and apparatus
04/2001
04/25/2001CN2427289Y Safety device for preventing high temp. injury caused by outlet of hot blast gun
04/24/2001US6220501 Metallic substrates are coated with an undercoat alloy of tin and zinc and contacted with each other through a mixture containing zinc and tin and flux, heating substrate to melt the solder, solidififying to join metallic member
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