Patents
Patents for B23K 3 - Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (10,880)
10/2005
10/05/2005EP1549825A4 Dockable direct mechanical actuator for downhole tools and method
10/05/2005EP1165250B1 Dispensing assembly
10/05/2005CN2730536Y Simple iron smelting frame
10/05/2005CN2730535Y High-cycle welding machine
10/05/2005CN1677631A Wire bonding apparatus and method thereof
10/05/2005CN1676261A External counter incision heater
10/05/2005CN1222202C Local welding method for printed substrate and apparatus thereof
10/04/2005US6951299 Tooling frame able to adhere to tin
09/2005
09/29/2005US20050211749 Bumpless die and heat spreader lid module bonded to bumped die carrier
09/28/2005EP1579942A1 Method of manufacturing a heat exchanger
09/28/2005EP1309420B1 Soldering method for mounting electric components
09/28/2005CN2728695Y Fin slag deflecting structure of tin melt furnace
09/28/2005CN1675018A Dispensing system and method
09/27/2005US6948650 Dross removal and solder reclamation improvements
09/22/2005WO2005087422A1 Process and device for soldering with a vacuum in the vapour phase
09/22/2005WO2004105989A3 Dross removal and solder reclamation improvements
09/22/2005US20050208751 Solder bump structure and method for forming a solder bump
09/22/2005US20050205643 Desoldering sheath
09/22/2005DE19838532B4 Verfahren und Vorrichtung zum Plazieren und Umschmelzen von Lotmaterialformstücken A method and apparatus for placing and remelting formed solder material
09/21/2005EP1577046A2 Method and device for fixing a functional member to a surface
09/21/2005CN2727563Y Spray nozzle of gas hot blast tool
09/21/2005CN2727562Y 瓦斯燃料吹风机 Gas fuel hairdryer
09/21/2005CN2727561Y Improved gas hot blast gun
09/21/2005CN2727560Y Gas tool with a heat-conducting piece
09/21/2005CN2727559Y Gas tool with a heat-conducting piece
09/21/2005CN2726781Y Section type welding head
09/21/2005CN1671536A Method and device for forming a body having a three-dimensional structure
09/21/2005CN1669716A Thermostatic electric iron with a lighting unit
09/21/2005CN1669715A Soldering tin forming device, method and continuous plating device
09/21/2005CN1669713A Method for butting wires with small diameters
09/21/2005CN1219914C Electric soldering iron tip and electric soldering iron
09/20/2005US6945447 Thermal solder writing eutectic bonding process and apparatus
09/20/2005US6945445 Supporting tray for wave soldering
09/15/2005WO2005084865A1 Cordless electric solder heating tool and holding stand therefor
09/15/2005US20050199615 Induction coil design for portable induction heating tool
09/14/2005CN1669373A Jetting device and method at a jetting device
09/14/2005CN1668418A Method and apparatus for supporting a substrate
09/14/2005CN1668168A Electric connector and solder-bearing wafer and method for firmly mounting a device
09/14/2005CN1666839A Chip and carrier self-contrapositioning soft soldering method under gas protection
09/13/2005US6942791 Apparatus and method for recycling of dross in a soldering apparatus
09/13/2005US6942138 Fuel-based appliance with vocal function
09/09/2005WO2005083402A1 Systems and methods for detecting defects in printed solder paste
09/08/2005US20050195527 Mounting method of magnetic head component, magnetic head device and manufacturing method of magnetic head device
09/08/2005DE202005009576U1 Test device for soldering processes in soldering oven, comprises plate-shaped base which has holding fixtures for oxygen-sensitive sensors at various positions, also having a memory for measured data of oxygen concentration
09/01/2005US20050189402 Area array and leaded SMT component stenciling apparatus and area array reballing method
09/01/2005DE10356981B3 Mounting semiconductor chip on substrate, especially circuit board, involves arranging solder filling with solder bead, underfill materials on chip, applying to chip with adhesive band, mounting on substrate, melting by heat treatment
08/2005
08/31/2005EP1569503A1 Method for supplying solder
08/31/2005CN2722551Y Heater and soldering iron therewith
08/31/2005CN2721297Y Branching device of solder iron
08/30/2005US6935549 Brazing fixtures and methods for fabricating brazing fixtures used for making feed-through assemblies
08/25/2005WO2005077583A1 Soldering method
08/25/2005WO2005077582A2 Plant for metal brazing comprizing a device for applying fluxant as well as the device for applying fluxant where this device is a fluidized bed
08/24/2005EP1237677B1 Soldering flux
08/24/2005CN2719469Y Soldering iron tin wire recovery cleaning device
08/24/2005CN1657210A Soldering machine for composite copper aluminium radiator
08/24/2005CN1657209A Ceramic resonator welding machine
08/24/2005CN1216161C Method and apparatus for separating oxide of solder produced by jet solder groove
08/18/2005US20050178814 Reflow soldering device
08/18/2005DE102005002349A1 Hartlöteinheit Hartlöteinheit
08/17/2005CN2717603Y Tin furnace spray nozzle structure
08/17/2005CN1215744C Hydrogen and scaling-powder-free welding conducted through electronic adsorption
08/16/2005US6929170 Solder deposition method
08/11/2005US20050173405 Brazing unit
08/11/2005DE10215963B4 Vorrichtung für selektives Löten Apparatus for selective soldering
08/10/2005EP1560674A2 Arrangement for the soldering of a metal block by the jointing of a number of segment sheets
08/10/2005EP1189721B1 Closed loop solder wave height control system
08/10/2005CN2715905Y Welding agent coating mechanism for wafer ball mounter
08/10/2005CN1653872A Reflow soldering device
08/04/2005WO2005070606A1 Solder heater and soldering iron tip member used for the heater
08/04/2005WO2005070605A1 Solder heating tool and soldering iron bit member used therefor
08/04/2005WO2005070604A1 Solder heating device
08/04/2005WO2005070603A1 Repair soldering head having a supply channel for a heat transfer medium and a return channel for said heat transfer medium, and the use thereof
08/04/2005WO2005070601A1 Component joining
08/04/2005US20050169514 Systems and methods for detecting defects in printed solder paste
08/04/2005US20050167519 Jetting device and method at a jetting device
08/04/2005DE10248110B4 Verfahren und Vorrichtung zur Herstellung reproduzierbarer Lötstellen Method and apparatus for production of reproducible solder joints
08/04/2005CA2551617A1 Brazed joining with electrical deposition
08/03/2005CN2714225Y Tin ball forming structure for terminal base
08/03/2005CN2714224Y 多功能电烙铁 Multifunction electric iron
08/03/2005CN1650476A Solder-bearing articles and method of retaining a solder mass thereon
08/02/2005CA2105365C Method of hot brazing aluminum articles
07/2005
07/28/2005WO2005069370A1 Method and apparatus for providing a solder area on a leadframe
07/28/2005US20050164528 Molded parts winding manufacture
07/28/2005US20050161252 Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method
07/28/2005DE10160710B4 Verfahren und Vorrichtung zum Löten A method and apparatus for soldering
07/27/2005EP1556183A2 Welding tip
07/27/2005CN2712525Y Electric iron
07/27/2005CN1647601A Filtration of flux contaminants
07/21/2005WO2005065877A1 Reflow furnace
07/21/2005WO2005065876A1 Reflow furnace and hot-air blowing-type heater
07/21/2005US20050156327 Colored conductive wires for a semiconductor package
07/20/2005EP1554076A1 A method and a means for the fixation of objects
07/20/2005CN2710816Y Miniature tin smelting furnace with sectional separation type shell
07/20/2005CN2710815Y Electric soldering iron with power source indication lamp
07/20/2005CN2710814Y Electric soldering iron with illumination
07/20/2005CN1643999A Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method
07/20/2005CN1642392A Methods of forming solder areas on electronic components and electronic components having solder areas
07/20/2005CN1640601A Method and apparatus for conductive ball bonding of components
07/19/2005US6918531 Metal foil connection, honeycomb body, metal foil brazing medium particle fraction for metal foils and method for manufacturing a metal foil connection
07/14/2005WO2005033352A3 Deposition and patterning process
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