Patents
Sitemap › B23 - Machine tools; Metal-working not otherwise provided for › B23K - Soldering or unsoldering; Welding; Cladding or plating by soldering or welding; Cutting by applying heat locally, e.g. flame cutting; Working by laser beam › B23K 3 - Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
Patents for B23K 3 - Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (10,880)
12/2003
12/31/2003WO2004001940A1 High-current power supply using storage battery
12/31/2003WO2004001177A2 Dockable direct mechanical actuator for downhole tools and method
12/31/2003WO2004000500A1 Method and apparatus for supporting a substrate
12/31/2003WO2004000497A1 Fluxing apparatus for applying powdered flux
12/31/2003CN1133353C Heater-sensor complex
12/31/2003CN1132717C Braze welding process of composite polycrystal-diamond bit
12/25/2003US20030234272 Fluxing apparatus for applying powdered flux
12/25/2003US20030234110 Dockable direct mechanical actuator for downhole tools and method
12/25/2003US20030233750 Method and apparatus for supporting a substrate
12/24/2003WO2003079743A3 Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method
12/24/2003CN2593945Y Automatic solder wire feeder
12/24/2003CN1132242C Automated stacking and soldering appts. for three dimensional stack package devices and mfg. method thereof
12/23/2003US6666370 Solder-dross mixture separation method and apparatus
12/17/2003EP1370387A2 Device for applying solder globules
12/17/2003EP1370386A2 System and process for the treatment of gaseous emissions
12/17/2003CN2592323Y Rapid, energy-saving, long-life, constant-temperature integrated electric iron
12/16/2003US6663509 Multilayer golf ball with filled inner layer having dual core, liquid core, or wound core
12/16/2003CA2260342C Solder placement apparatus and method
12/11/2003US20030226877 Thermal solder writing eutectic bonding process and apparatus
12/11/2003US20030226253 Method and apparatus for thermally coupling a heat dissipation device to a microelectronic device
12/10/2003EP1369004A1 Method and protective device for mounting a temperature-sensitive electronic component
12/10/2003EP1165859B1 A method of depositing flux or flux and metal onto a metal brazing substrate
12/10/2003CN2590712Y Integrated block fast-disassambling soldering iron
12/09/2003US6659335 Soldering method and soldering apparatus
12/09/2003US6659333 Forming exhaust systems by joining thin flat films to corrugated sheets using microstructure powders
12/09/2003US6659329 Soldering alloy
12/09/2003US6659328 Method and apparatus for deposition of solder paste for surface mount components on a printed wiring board
12/09/2003US6659004 Screen printing paste, screen printing method, and baked thick film body
12/04/2003US20030222120 Devices for and methods of casting and bonding a molten material onto one or more surfaces of a moving substrate
12/04/2003US20030222119 Waste energy recovery system for a controlled atmosphere system
12/04/2003US20030221853 Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device
12/03/2003CN2589140Y Circuit board welding machine
12/02/2003US6655574 Apparatus for selective soldering
11/2003
11/27/2003WO2003098982A1 Reflow soldering device
11/27/2003WO2003097288A1 Heater tip for thermocompession bonding
11/27/2003US20030219927 Solder balls and conductive wires for a semiconductor package, and an improved manufacturing method, and evaporation method therefor
11/26/2003EP1363758A2 Automatic dross removal apparatus and method
11/26/2003EP1051279B1 Method for introducing solder into a system
11/26/2003CN2587568Y Low energy comsumption electric soldering iron
11/25/2003US6653600 Heating trowel such as soldering iron
11/25/2003US6651869 Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering
11/20/2003US20030213832 Solder ball attaching system and method
11/19/2003CN1456412A Environmental protection electric soldering iron
11/19/2003CN1128468C Chip packaging device
11/18/2003US6649878 Heating device
11/18/2003US6648214 Method for partially or completely coating the surfaces of components produced from aluminum or its alloys with solders, fluxing agents or binders for brazing
11/13/2003WO2003092947A1 Method and apparatus for dispensing solder
11/13/2003US20030209585 Conductive powder applying device immersing substrate into conductive powder by rotating tank including conductive powder and substrate at opposing positions
11/12/2003EP1073527B1 Method and apparatus for dispensing small amounts of liquid material
11/11/2003US6646228 Cordless soldering iron
11/06/2003US20030205628 Nozzle for ejecting molten metal
11/06/2003US20030205037 Filtering apparatus
11/05/2003EP1358034A1 Method for soldering work pieces
11/05/2003CN2584336Y Preheat area reflector for wave tin soldering brazier
11/05/2003CN2584335Y Blow-suction tin electric iron
11/05/2003CN1127138C Vacuum package shell and packaging method for full-metal low-temp micro-electromechanical system
11/05/2003CN1126630C Silver soldering method for red copper crucible
11/05/2003CN1126629C Jet soldering trough
11/04/2003US6642485 System and method for mounting electronic components onto flexible substrates
11/04/2003US6641030 Method and apparatus for placing solder balls on a substrate
10/2003
10/30/2003WO2003090507A1 Filtration of flux contaminants
10/30/2003US20030203137 Aluminum-extruded multi-cavity flat tube having excellent brazing characteristics for use in automotive heat exchanger and manufacturing method therefor
10/29/2003CN2582807Y Molten tin bath structure with rotational spray nozzle
10/29/2003CN2582806Y Adjustable tin furnace spout
10/29/2003CN2582805Y Energy-savnig electric iron
10/28/2003US6639193 Method and apparatus for the end-surface connection of a carrier matrix of a honeycomb body by a joining technique
10/28/2003US6638785 Adsorbing device, sucker and mounting device for conductive member, adsorbing method and mounting method for conductive member, and semiconductor device and method of making
10/28/2003US6637639 Wire processing apparatus, flux applying device, and solder depositing device
10/28/2003US6637637 Reflow apparatus
10/23/2003WO2003022504A3 Soldering method for metallic fastening elements
10/23/2003WO2002064300A8 Method for soldering work pieces
10/23/2003US20030196551 Filtration of flux contaminants
10/22/2003EP1354657A2 Soldering heater cartridge with replaceable tips and soldering iron for use therewith
10/21/2003US6635101 Atomizing to form spray of molten balls; generating mist; resistors, capacitors, inductors, transistors, integrated circuits, and chip carriers
10/21/2003US6634545 Solder ball delivery and reflow method
10/21/2003US6634542 Method for applying a brazing medium to a configuration
10/16/2003WO2003085697A2 Solder-bearing articles and method of retaining a solder mass thereon
10/15/2003CN2579587Y Electric iron
10/14/2003US6633021 Soldering iron with heated gas flow
10/09/2003US20030189081 Soldering heater cartridge with replaceable tips and soldering iron for use therewith
10/08/2003CN1447638A Welding method and welded parts
10/08/2003CN1447407A Mfg. appts. of electronic device, mfg. method of electronic device and mfg. program of electronic device
10/07/2003US6629631 Solder iron pressure monitor and method of using same in manufacturing a cathode ray tube
10/05/2003CA2420964A1 Soldering heater cartridge with replaceable tips and soldering iron for use therewith
10/02/2003WO2003080286A1 Paste-like composition for brazing and brazing method using the same
10/02/2003US20030186485 Micro C-4 semiconductor die and method for depositing connection sites thereon
10/02/2003US20030185539 Soldering apparatus and method for a collimator
10/02/2003US20030183677 Micro C-4 semiconductor die and method for depositing connection site thereon
10/01/2003CN1123066C Apparatus and method for manufacturing electronic components with project electrodes
10/01/2003CN1122583C Assembly for dispensing resisting medium drop and its connecting device and changing method
09/2003
09/30/2003US6627991 High performance multi-chip flip package
09/30/2003US6626097 Apparatus for dispensing material in a printer
09/25/2003WO2003079743A2 Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method
09/25/2003DE20307993U1 Soldering system has solder pumped through a nozzle to coat connection pins of a component
09/24/2003CN1444273A 电子装置 Electronic devices
09/24/2003CN1443622A Method and device for distributing welding flux on base
09/23/2003US6624387 Process for MSG-soldering and use of a shielding gas
09/23/2003US6622902 Nozzle apparatus for surface mount device
09/23/2003CA2260155C Device for dispensing small amounts of material
09/18/2003WO2003030246A3 Device for soldering contacts on semiconductor chips
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