Patents
Sitemap › B23 - Machine tools; Metal-working not otherwise provided for › B23K - Soldering or unsoldering; Welding; Cladding or plating by soldering or welding; Cutting by applying heat locally, e.g. flame cutting; Working by laser beam › B23K 3 - Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
Patents for B23K 3 - Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (10,880)
11/2000
11/29/2000CN2407870Y Intelligent digit display constant temperature electric iron
11/29/2000CN2407869Y Electric iron head with positioning hole
11/28/2000US6153505 Plastic solder array using injection molded solder
11/28/2000US6152353 Printed circuit board header attachment station
11/28/2000US6152348 Device for the application of joint material deposit
11/23/2000WO2000052228B1 A method of depositing flux or flux and metal onto a metal brazing substrate
11/22/2000CN2406764Y Constant temp. fast electric iron
11/22/2000CN1273896A Electric iron
11/22/2000CN1058679C Spool for cords or wires
11/21/2000US6149048 Apparatus and method for use in manufacturing semiconductor devices
11/16/2000DE19920252A1 Device for thermally treating substrates, e.g. for re-melting solder bumps onto micro-chips, has heating and cooling device containing re-melting reservoir filled with fluid
11/15/2000EP1051564A1 Process for producing an encased honeycombed body
11/15/2000EP1051279A1 Method for introducing solder into a system
11/15/2000EP1051278A1 Method for introducing solder into a system
11/14/2000US6147326 Soldering device with a plurality of spaced soldering tips and method of use
11/14/2000US6147325 Fixing device
11/14/2000US6145823 Solder clamp
11/14/2000US6145734 Reflow method and reflow device
11/14/2000US6145729 Non-connected drainage channels for selective wave solder pallets
11/14/2000US6145191 Method for mounting and testing integrated circuits on printed circuit boards
11/09/2000WO2000067005A1 A method and apparatus for inspecting solder paste deposits on substrates
11/09/2000WO2000066312A1 Method for producing weld points on a substrate and guide for implementing said method
11/08/2000CN2405328Y 电连接器 The electrical connector
11/07/2000US6142357 Molded selective solder pallet
11/02/2000EP1047524A1 Paste for welding ceramics to metals and method for producing a welded joint
10/2000
10/31/2000US6139972 Integrated circuit packaging.
10/31/2000US6139336 High density connector having a ball type of contact surface
10/31/2000US6139079 Universal transport apparatus
10/31/2000US6138893 Method for producing a reliable BGA solder joint interconnection
10/26/2000WO2000062969A2 Soldering alloy
10/26/2000WO2000062967A1 Hot iron such as soldering iron and method of controlling the iron
10/26/2000DE19918672A1 Verfahren zum Verschweißen von Oberflächen von Materialien A method of welding surfaces of materials
10/26/2000CA2370770A1 Soldering alloy
10/25/2000EP1046620A2 Method for welding material surfaces
10/24/2000US6136380 Method of coating brazing material and apparatus therefor
10/19/2000WO2000062587A1 Dispensing assembly
10/19/2000WO2000061297A1 Dispensing assembly
10/18/2000EP1044751A1 Solder collecting capsule and solder extracting desoldering tool using the same
10/18/2000CN2401305Y Wire-carried electric soldering iron
10/17/2000US6133634 High performance flip chip package
10/17/2000US6131795 Thermal compression bonding method of electronic part with solder bump
10/17/2000US6131793 Reflow soldering apparatus
10/17/2000US6131791 Soldering and desoldering device with improved pickup device
10/12/2000WO2000059671A1 Material inspection
10/12/2000WO2000059670A1 Soldering frame
10/11/2000EP1043105A2 Heat transfer tool used for transferring heat from a heat source onto a workpiece to be machined and method therefore
10/11/2000CN2400213Y Soldering device
10/10/2000US6129257 High temperature brazing fixture
10/10/2000US6128818 Method for testing integrated circuits which are on printed circuit boards
10/03/2000US6127657 Clamping soldering device
10/03/2000US6126456 Solder column tip compliancy modification for use in a BGA socket connector
10/03/2000US6126063 Integrated circuit packaging apparatus and method
10/03/2000US6126060 Soldering device
10/03/2000US6126059 Captured-cell solder printing and reflow methods and apparatuses
09/2000
09/27/2000CN2398045Y Electronic iron
09/26/2000US6123771 Device for applying adhesive spots on a substrate
09/26/2000US6123251 Apparatus and method for soldering
09/26/2000US6123248 Soldering method and soldering apparatus
09/26/2000US6123247 Electronic unit soldering apparatus
09/26/2000US6123246 Dual intermittent microflame system for discrete point soldering
09/21/2000WO2000054921A1 Filling device and method for filling balls in the apertures of a ball-receiving element
09/21/2000WO2000022667A9 Apparatus and method for filling a ball grid array
09/21/2000DE19910173A1 Waste solder material removal method for circuit boards
09/20/2000EP1035940A1 Method and apparatus for dispensing materials on a substrate
09/19/2000US6120848 Method of making a braze sheet
09/19/2000US6119927 Method and apparatus for placing and attaching solder balls to substrates
09/19/2000US6119925 Method for soldering an electrical element to a motherboard
09/19/2000US6119919 Method and device for repairing defective soldered joints
09/19/2000US6119915 Alignment fixture for solder-wave machines
09/19/2000US6119341 Method of manufacturing flat tubes for heat exchanger
09/13/2000EP1034061A1 Method and device for assembling two structures with a weld bead
09/12/2000US6116491 Gas flow controlling device and soldering apparatus using same
09/08/2000WO2000052228A1 A method of depositing flux or flux and metal onto a metal brazing substrate
09/08/2000CA2366945A1 A method of depositing flux or flux and metal onto a metal brazing substrate
09/06/2000EP1033197A2 Method and apparatus for soldering printed circuit boards and cooling mechanism for a soldering apparatus
09/06/2000CN2394747Y Electric iron
09/05/2000US6113216 Wide array thermal ink-jet print head
08/2000
08/31/2000WO2000050196A1 Apparatus and method for solder stenciling
08/30/2000CN2393677Y Energy saving quick heating solder iron
08/29/2000US6111222 Soldering apparatus with safety device
08/29/2000US6109509 Method of securely mounting conductive balls
08/23/2000EP1029626A2 Method and apparatus for dispensing small amounts of liquid material
08/22/2000US6105851 Method of casting I/O columns on an electronic component with a high yield
08/22/2000US6105850 Aluminum brazing method which avoids waste water
08/22/2000CA2204308C Ultrasonic vibration soldering apparatus and resonator used therein
08/15/2000US6102273 Die bonding apparatus
08/08/2000US6099681 Mounting apparatus for mounting small balls and mounting method thereof
08/03/2000WO2000044522A1 Metal foil connection and solder grain fraction for metal foil connection
08/03/2000DE19903184A1 Metallfolienverbindung und Metallfolien-Lotkornfraktion für Metallfolien Metal foil compound and metal foil Lotkornfraktion for metal films
08/02/2000EP1024206A1 Apparatus and method for recovering metal from dross
08/02/2000CN1261567A 焊接装置 Welding equipment
08/01/2000US6096999 Reflow soldering apparatus with a rotative configuration
08/01/2000US6095398 Solder ball arrangement device
07/2000
07/27/2000WO2000043156A1 Method and apparatus for dispensing material in a printer
07/27/2000CA2359953A1 Method and apparatus for dispensing material in a printer
07/26/2000EP1021268A1 Process of using an active solder alloy
07/26/2000CN2389033Y Energy-saving quick electric soldering iron
07/25/2000US6093915 Magnet and reed switch/lock
07/25/2000US6092713 Automated stacking and soldering apparatus for three dimensional stack package devices and manufacturing method thereof
07/18/2000US6089445 Method and device for dry fluxing of metallic surfaces before soldering or tinning
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