Patents
Patents for B23K 3 - Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (10,880)
04/2001
04/24/2001CA2064879C Soldering tool
04/12/2001WO2000071764A3 Cobalt-base composition and method for diffusion braze repair of superalloy articles
04/11/2001EP1090706A1 Apparatus and method for bonding conductors
04/10/2001US6215104 Soldering iron
04/10/2001US6214218 Soldering apparatus and agent for separating solder and solder oxides
04/10/2001US6214117 Dispensing system and method
04/10/2001US6213386 Method of forming bumps
04/10/2001US6213374 Feeder of wire solder
04/10/2001US6213356 Bump forming apparatus and bump forming method
04/08/2001CA2322270A1 Apparatus and method for bonding conductors
04/04/2001EP1089347A2 Method and apparatus for automatically soldering a lead wire to a solar battery
04/04/2001CN1289659A Low-temp MEMS vacuum sealing technique for metals
04/03/2001US6209859 Universal reflow fixture
03/2001
03/29/2001WO2001022785A1 Solder-bearing wafer for use in soldering operations
03/28/2001EP1086772A2 Electric soldering iron
03/28/2001EP1086771A2 Apparatus and method for teaching an automatic soldering apparatus
03/28/2001CN1289389A Process for producing an encased honeycombed body
03/28/2001CN1289278A Process for indroducing solder into a system
03/28/2001CN1289277A Method for introducing solder into a system
03/27/2001US6206265 Temperature control method of solder bumps in reflow furnace, and reflow furnace
03/22/2001WO2001020957A1 Laminated reflow soldering
03/22/2001WO2001019561A1 Method and device for joining a support matrix of a honeycomb on the end face using bonding technology
03/21/2001EP1083998A1 Device and method for jetting droplets
03/21/2001CN1288259A Method for fixing semiconductor chip, and device therefor
03/20/2001US6202918 Method and apparatus for placing conductive preforms
03/20/2001US6202734 Apparatus for jet application of molten metal droplets for manufacture of metal parts
03/15/2001DE19943976A1 Verfahren und Vorrichtung zur stirnseitigen fügetechnischen Verbindung einer Trägermatrix eines Wabenkörpers Method and apparatus for end-face connection of a support matrix technical joining a honeycomb body
03/15/2001DE19942069A1 Soldering device esp. for selective soldering, includes soldering nozzle for providing overflow soldering face and flow-wise connected to pressure chamber and to pre-chamber
03/14/2001CN2423054Y Pulse brush plating and welding inverter
03/13/2001US6199749 Method for manufacturing a brazed metallic honeycomb body
03/08/2001WO2001015848A1 Pneumatic weld head
03/07/2001EP1080817A2 Brazing jig
03/06/2001US6196444 Method and apparatus for soldering ball grid array modules to substrates
03/06/2001US6196442 Method for brazing aluminum tube assemblies
03/06/2001US6196439 Method and apparatus for μBGA removal and reattach
03/01/2001WO2001014093A1 Solder ball delivery and reflow apparatus and method of using the same
02/2001
02/28/2001CN1285628A Electric connector and method of making same
02/27/2001US6193144 Paste providing method, soldering method and apparatus and system therefor
02/27/2001US6193132 Method for bonding semiconductor chip and device therefor
02/20/2001US6191022 Fine pitch solder sphere placement
02/20/2001US6189772 Method of forming a solder ball
02/14/2001CN2418991Y Electric iron with support
02/13/2001US6186392 Method and system for forming contacts on a semiconductor component by aligning and attaching ferromagnetic balls
02/13/2001US6186389 Apparatus and process for mounting conductor balls on terminal pads of semiconductor devices
02/13/2001US6186388 Soldering
02/13/2001US6186387 Solder collecting capsule and solder extracting desoldering tool using same
02/13/2001US6186192 Jet soldering system and method
02/07/2001EP1073527A1 Method and apparatus for dispensing small amounts of liquid material
02/06/2001US6184475 Lead-free solder composition with Bi, In and Sn
02/06/2001US6182883 Method and apparatus for precisely registering solder paste in a printed circuit board repair operation
02/06/2001US6182819 Article carrier with adjustable support elements and a reflow soldering system provided with such an article carrier
02/06/2001US6182356 Apparatus for solder ball mold loading
02/01/2001WO2001007192A1 Method and apparatus for dispensing viscous material
01/2001
01/31/2001EP1073111A2 Method and apparatus for forming a solder bump
01/30/2001US6179200 Method for forming solder bumps of improved height and devices formed
01/30/2001US6179196 Apparatus for manufacturing circuit boards
01/25/2001WO2001005592A1 Improvements relating to screen printing
01/25/2001DE19931110A1 Druckkopf zum Ausspritzen eines heißen flüssigen Mediums und Verfahren zur Herstellung einer metallisches Lot umfassenden Verbindungsstelle Printhead for jetting a hot liquid medium and method for producing a metallic solder joint comprising
01/25/2001CA2379904A1 Improvements relating to screen printing
01/24/2001EP0861136B1 Method and apparatus for dispensing small amounts of liquid material
01/24/2001CN2415869Y Switch type soldering iron support
01/23/2001US6176008 Jig for mounting fine metal balls
01/18/2001DE10025619A1 Fluidmesser Fluid knife
01/16/2001US6173883 Method and apparatus for increasing heat transfer that is restricted in thermally isolated pockets of a medium
01/11/2001WO2001002123A1 Printhead for jetting a hot liquid medium and method of producing a joint that comprises a metallic solder
01/11/2001WO2001002122A1 Print chip for a printing head working according to the ink printing principle
01/11/2001WO2001002120A1 Heat exchanger and method of brazing the heat exchanger
01/11/2001DE19930741A1 Schweiß-Löt-Zusatzwerkstoff Welding brazing filler metal
01/10/2001EP1066911A2 Welding-brazing material
01/10/2001CN2413834Y Electric soldering iron for quick deassembling integrated block
01/10/2001CN2413833Y Multi-function safety electric soldering iron
01/09/2001US6170737 Solder ball placement method
01/09/2001US6170733 Breakaway mounting device for use with printed circuit board flow solder machines
01/04/2001WO2001001739A1 Solder paste stenciling apparatus and method of use for rework
01/04/2001DE19915928A1 Werkzeug zur Übertragung von Wärme von einer Wärmequelle auf ein zu bearbeitendes Werkstück und Verfahren zu seiner Herstellung Tool for transferring heat from a heat source to a workpiece to be machined and a process for its preparation
01/03/2001EP1065464A1 Heat exchanger with variable compression side support
01/03/2001CN2412691Y Temp.-lowering soldering iron
01/03/2001CN1278467A Braze welding process of composite polycrystal-diamond bit
01/03/2001CN1060104C Apapratus for making multi-layered metallic welded tubes
01/02/2001US6168068 Method for preventing a gold plate connector on a PCB from being contaminated
01/02/2001US6168065 Movable selective debridging apparatus for debridging soldered joints on printed circuit boards
01/02/2001US6168064 Method and apparatus for controlling a time/temperature profile of a reflow oven
12/2000
12/27/2000EP1063736A1 Electrical connector and method of soldering cable to such a connector
12/27/2000CN1277899A Soldering flux jetting device and soldering method therewith
12/26/2000US6166334 Plating process for fine pitch die in wafer form
12/26/2000US6164904 Assembly for brazing a stator component of a gas turbine engine and method brazing articles such as an abradable material to a stator of a gas turbine engine
12/26/2000US6164515 Movable selective debridging apparatus and method of debridging soldered joints on printed circuit boards using same
12/20/2000CN1277083A Welding flux collecting hold and welding flux extraction sealing off tool using with the same welding flux collecting hold
12/19/2000US6162661 Spacer plate solder ball placement fixture and methods therefor
12/19/2000US6161749 Method and apparatus for holding a printed circuit board during assembly
12/14/2000DE10025899A1 Jet solder delivery device has protruding sections around each jet opening in corrugated plate
12/13/2000CN2410069Y Welding point structure of copper or aluminium pipe
12/12/2000US6158650 Process for fine and coarse pitch solder deposits on printed circuit boards
12/12/2000US6158649 Solder ball mounting apparatus and method
12/07/2000WO2000073180A1 Apparatus and method for supplying solder balls
12/07/2000WO2000073009A1 Closed loop solder wave height control system
12/06/2000CN1275881A Method for producing circuit board
12/06/2000CN1275459A Soldering tin blow flow device and tin-soldering method thereof
11/2000
11/30/2000WO2000071764A2 Cobalt-base composition and method for diffusion braze repair of superalloy articles
11/30/2000CA2372911A1 Cobalt-base composition and method for diffusion braze repair of superalloy articles
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