| Patents for B23K 3 - Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (10,880) |
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| 07/28/2004 | CN2628200Y Heating core for electric iron |
| 07/28/2004 | CN1516631A System and process for treatment of gaseous emission |
| 07/28/2004 | CN1515401A Injection-moulding machine and device for controlling hydraulic actuator |
| 07/28/2004 | CN1515400A Method for controlling hydraulic actuator and its microcontroller |
| 07/28/2004 | CN1515399A Control device of hydraulic actuator in injection-moulding machine |
| 07/27/2004 | US6766938 Apparatus and method of placing solder balls onto a substrate |
| 07/22/2004 | US20040140371 Nozzle end configuration |
| 07/22/2004 | DE10360242A1 Metallurgisches Bonden von integriertem flexiblem Substrat Metallurgical bonding of integrated flexible substrate |
| 07/22/2004 | DE10309502A1 Lothügelstruktur und Verfahren zur Herstellung derselben Lothügelstruktur and methods for making the same |
| 07/22/2004 | DE10258801A1 Applying paste material to electronic components, involves positioning component relative to material ejection unit, and controlling unit so paste material in nozzle is ejected and transferred to component |
| 07/21/2004 | EP1439020A2 Method and apparatus for soldering printed circuit boards and cooling mechanism for a soldering apparatus |
| 07/21/2004 | CN1513634A Welding flux setting up method |
| 07/21/2004 | CN1158155C Method and apparatus for dispensing material in printer |
| 07/15/2004 | WO2003098982A8 Reflow soldering device |
| 07/15/2004 | US20040135251 Composite metal column for mounting semiconductor device |
| 07/15/2004 | US20040134974 Solder bump structure and method for forming a solder bump |
| 07/14/2004 | EP1437192A2 Method and apparatus for dispensing small amounts of liquid material |
| 07/14/2004 | EP1436827A2 Device for soldering contacts on semiconductor chips |
| 07/14/2004 | CN1157269C Method and apparatus for welding metallic electrode sheet to ceramic sheet |
| 07/13/2004 | US6761304 Heating head for soldering and de-soldering of SMD components |
| 07/08/2004 | US20040129756 Device for positioning a tool in relation to a workpiece |
| 07/06/2004 | US6759687 Aligning an optical device system with an optical lens system |
| 07/06/2004 | US6758108 Solderability testing apparatus and solderability testing method |
| 07/01/2004 | WO2004032584A3 Selective wave solder system |
| 07/01/2004 | WO2004011177A3 Building a three-dimensional structure by manipulating individual particles |
| 07/01/2004 | US20040124233 Method and protection apparatus for installation of a temperature-sensitive electronic component |
| 07/01/2004 | US20040124225 Apparatus for aligning and dispensing solder columns in an array |
| 07/01/2004 | DE202004005219U1 Schweissdrahtspendevorrichtung Welding wire dispenser |
| 06/30/2004 | EP1432543A1 Soldering device for soldering flat modules |
| 06/29/2004 | US6755339 Fluxing apparatus for applying powdered flux |
| 06/24/2004 | WO2004054339A1 Method for supplying solder |
| 06/24/2004 | US20040118935 Method of jetting viscous medium |
| 06/24/2004 | DE20302566U1 Soldering tip has heat conductive body with non-wettable layer and outer tinned layer with adhesive layer between |
| 06/24/2004 | DE10257173A1 Verfahren zum Aufbringen von Lotmaterial, Verwendung einer Anlage zur laserunterstützten direkten Metallabscheidung hierfür und Kontaktflächen mit Lotdepots A method of applying solder material, using an installation for laser-assisted direct metal deposition and contact surfaces thereof with the solder deposits |
| 06/23/2004 | EP1432020A1 Apparatus for aligning and dispensing solder columns in an array |
| 06/23/2004 | EP1175276B1 Material inspection |
| 06/22/2004 | US6752710 Controlled atmosphere zones and exhaust stacks with nozzles to accelerate the exhaust flow, measuring the flow and at a predetermined level |
| 06/17/2004 | WO2004050286A1 Method for the application of solder material, use of a system for laser-aided direct metal deposition and contact surfaces with solder material |
| 06/17/2004 | US20040112935 Integrated flex substrate metallurgical bonding |
| 06/15/2004 | US6749655 Reflow apparatus for solder joining electronic components to circuit boards |
| 06/15/2004 | US6749460 Apparatus and method for preventing soldering material migration |
| 06/10/2004 | WO2004048024A1 Tip of soldering iron, process for producing the same, and electrical soldering iron and electrical solder sucking iron including the iron tip |
| 06/10/2004 | WO2003085697A3 Solder-bearing articles and method of retaining a solder mass thereon |
| 06/10/2004 | US20040110366 Forming solder balls on substrates |
| 06/10/2004 | US20040108365 Method and apparatus for positioning solder or braze material on the fins |
| 06/09/2004 | EP1427073A1 Solder reserve transfer device and process |
| 06/09/2004 | DE10351541A1 Arrangement for soldering a metal block comprises fixing elements acting as supports for soldering material |
| 06/08/2004 | US6746710 Screen printing |
| 06/08/2004 | US6745450 Method for loading solder balls into a mold |
| 06/03/2004 | US20040106334 Microparticle arrangement film, electrical connection film, electrical connection structure, and microparticle arrangement method |
| 06/03/2004 | DE10351797A1 Handwerkzeug mit Sprach- und/oder Musikfunktion Hand tool with voice and / or music feature |
| 06/03/2004 | DE10251896A1 Connecting device for electrical or electronic components comprises a temperature-variable and pressure-exerting thermode having on its pressing surface an electrically conducting temperature-variation element |
| 06/02/2004 | EP1423225A2 Soldering method for metallic fastening elements |
| 06/02/2004 | EP1423224A1 Method and device for applying a solder material to a metallic structure by means of vibration |
| 06/02/2004 | CN2618713Y Multifunction soldering tin box |
| 06/01/2004 | US6744003 Automatic soldering machine |
| 06/01/2004 | US6742702 Gas injection type soldering method and apparatus |
| 06/01/2004 | US6742694 Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus |
| 06/01/2004 | US6742693 Solder bath with rotatable nozzle |
| 05/27/2004 | WO2004044577A1 Convenient method and apparatus for analyzing solder component |
| 05/27/2004 | US20040099715 System and method for seal formation |
| 05/26/2004 | EP1202862B1 Improvements relating to screen printing |
| 05/26/2004 | CN2617512Y Improved structure of angular rotating mechanism of multifunctional rotary soldering tin machine |
| 05/26/2004 | CN1500026A Slotting appts. of wire state welding material added with resin |
| 05/26/2004 | CN1498713A Lead-less joining material and joining method using such material |
| 05/25/2004 | US6739498 Solder ball attachment system |
| 05/25/2004 | US6739044 Electrical terminal tinning process |
| 05/21/2004 | WO2004042420A2 Arrangement for the soldering of a metal block with a number of jointing segment sheets with fixing elements as support for soldering material |
| 05/21/2004 | WO2004041469A2 Welding tip |
| 05/21/2004 | CA2502176A1 Welding tip |
| 05/20/2004 | US20040096688 Zinc, tin, bismuth, germanium alloy; joining connectors |
| 05/20/2004 | US20040094607 System and method for mounting electronic components onto flexible substrates |
| 05/20/2004 | US20040094602 Hand tool with vocal function |
| 05/20/2004 | US20040094600 Device for applying solder globules |
| 05/19/2004 | CN2616328Y Heat-filling cordless electric iron |
| 05/19/2004 | CN1150077C Electric iron |
| 05/18/2004 | US6738505 Method and apparatus for detecting solder paste deposits on substrates |
| 05/18/2004 | US6736308 Systems and methods for distributing solder paste using a tool having a solder paste aperture with a non-circular cross-sectional shape |
| 05/18/2004 | US6735857 Method of mounting a BGA |
| 05/13/2004 | WO2004039526A1 Soldering method and device |
| 05/13/2004 | US20040089697 Bump ball crimping apparatus |
| 05/13/2004 | US20040089228 Dispensing system and method |
| 05/12/2004 | EP1417070A2 Spark erosion |
| 05/12/2004 | CN2614827Y Intelligent temperature controlling electric solder iron |
| 05/12/2004 | CN2614826Y Main body of pen shape electric soldering iron |
| 05/12/2004 | CN1494975A Welding heater tube with replaceable welding head and soldering iron using said welding heater |
| 05/11/2004 | US6733598 Brazing flux for dry application |
| 05/11/2004 | US6732912 Solder ball attaching process |
| 05/11/2004 | US6732904 Solder ball holding terminal in a BGA arrangement |
| 05/11/2004 | US6732903 Adjustable nozzle of stannic furnace |
| 05/06/2004 | WO2004037475A1 Electric welding apparatus having harmful gas purifier |
| 05/06/2004 | US20040084417 Clad material for lead wire connection |
| 05/04/2004 | US6730173 Method and apparatus of manufacturing electronic circuit module, and method and apparatus of manufacturing semiconductor module |
| 04/29/2004 | WO2004035253A1 An apparatus and method for filling a ball grid array template |
| 04/29/2004 | WO2004035252A1 A gas powered heating tool |
| 04/29/2004 | US20040082160 Bump forming method and apparatus for heating and compressing bump materials inserted in positioning holes |
| 04/29/2004 | US20040079788 Cost effective substrate fabrication for flip-chip packages |
| 04/29/2004 | US20040078976 Stainless steel honeycomb panel and method for manufacturing thereof |
| 04/27/2004 | US6726083 Closed loop solder wave height control system |
| 04/27/2004 | US6726082 Soldering apparatus |