| Patents for B23K 3 - Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (10,880) |
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| 05/16/2002 | US20020058406 Bump forming method and bump forming apparatus |
| 05/16/2002 | US20020057557 Circuit unit and method of producing same |
| 05/16/2002 | US20020056710 Heating device |
| 05/15/2002 | EP1205951A2 Process and device for contacting the winding wire of a coil |
| 05/14/2002 | US6386436 Method of forming a solder ball |
| 05/14/2002 | US6386435 Systems and methods for distributing solder paste using a tool having a solder paste aperture with a non-circular cross-sectional shape |
| 05/14/2002 | US6386434 Method of attaching a first part to a mating part |
| 05/14/2002 | US6386433 Solder ball delivery and reflow apparatus and method |
| 05/14/2002 | US6386429 Printed circuit board header attachment station |
| 05/14/2002 | US6386423 Soldering iron tips |
| 05/14/2002 | US6386422 Solder reflow oven |
| 05/14/2002 | CA2034209C Method, system and composition for soldering by induction heating |
| 05/09/2002 | US20020053591 Solder ball delivery and reflow method |
| 05/09/2002 | US20020053589 Material inspection |
| 05/09/2002 | US20020053588 Reflow method and reflow device |
| 05/08/2002 | EP1202862A1 Improvements relating to screen printing |
| 05/02/2002 | US20020050217 Screen-printing material replenishing device |
| 05/02/2002 | EP1202614A2 Electrode with brazed separator and method of making same |
| 05/02/2002 | EP1201344A1 Soldering iron with combustor |
| 05/02/2002 | EP1200224A1 Printhead for jetting a hot liquid medium and method of producing a joint that comprises a metallic solder |
| 05/02/2002 | EP1200223A1 Print chip for a printing head working according to the ink printing principle |
| 05/02/2002 | EP0956161A4 Ipc (chip) termination machine |
| 05/01/2002 | CN1347358A Hot iron such as soldering iron |
| 04/30/2002 | US6378756 Solder ball arrangement device |
| 04/25/2002 | US20020047052 Dispensing assembly |
| 04/25/2002 | US20020047039 Automatic wave soldering apparatus and method |
| 04/25/2002 | US20020047001 Cordless soldering iron |
| 04/25/2002 | DE10049660A1 Verfahren zum Herstellen lokal verstärkter Blechumformteile A method for producing the locally enhanced formed sheet metal parts |
| 04/24/2002 | EP1198401A1 Apparatus and method for supplying solder balls |
| 04/24/2002 | CN2487489Y Three-phase asynchronous induction electromagnetic pump for molten metal soft hard-soldering |
| 04/24/2002 | CN2487488Y Multifunctional integrated welding gun |
| 04/24/2002 | CN1346584A Dispensing assembly |
| 04/24/2002 | CN1346299A Dispensing assembly |
| 04/24/2002 | CN1083685C Apparatus for the wave soldering of circuit boards |
| 04/18/2002 | WO2002032201A1 Method of jetting viscous medium |
| 04/18/2002 | WO2002030606A1 A gas powered soldering tool |
| 04/18/2002 | US20020045330 Kinetically controlled solder bonding |
| 04/18/2002 | US20020043570 Dispensing assembly |
| 04/18/2002 | US20020042960 Soldering iron cleaning apparatus |
| 04/17/2002 | EP1051278B1 Method for introducing solder into a system |
| 04/17/2002 | CN2486256Y Portable fuel iron |
| 04/17/2002 | CN1082861C Ultrasonic vibration soldering apparatus |
| 04/11/2002 | WO2002028590A1 Device for positioning a tool in relation to a workpiece |
| 04/11/2002 | WO2002028589A1 Method and device for applying pieces of material to a workpiece |
| 04/11/2002 | WO2002028588A1 Method and device for applying material to a workpiece |
| 04/11/2002 | WO2002028584A1 System and method for mounting electronic components onto flexible substrates |
| 04/11/2002 | WO2002028583A1 System and method for mounting electronic components onto flexible substrates |
| 04/11/2002 | US20020041485 Circuit board cooling apparatus with air guide plates |
| 04/11/2002 | US20020040947 Desoldering wick dispenser |
| 04/11/2002 | US20020040921 Device and method for clamping and wire-bonding the leads of a lead frame one set at a time |
| 04/10/2002 | EP1195218A2 Curcuit board cooling apparatus with air guide plates |
| 04/10/2002 | EP1195208A2 Method to produce locally reinforced sheet metal |
| 04/09/2002 | US6369451 Solder balls and columns with stratified underfills on substrate for flip chip joining |
| 04/09/2002 | US6369359 Self-feeding soldering device |
| 04/09/2002 | US6367688 Soldering pliers construction |
| 04/09/2002 | US6367679 Detection of flux residue |
| 04/09/2002 | US6367677 Wave solder apparatus and method |
| 04/04/2002 | WO2002028156A1 Method and device for flow soldering |
| 04/04/2002 | WO2001087535A3 Soldering flux with cationic surfactant |
| 04/04/2002 | US20020038814 Method and apparatus for applying viscous material |
| 04/03/2002 | EP1193018A2 Soldering apparatus |
| 04/03/2002 | EP0849023B1 Brazing apparatus |
| 04/03/2002 | CN1342539A Method and apparatus for welding metallic electrode to ceramic |
| 04/02/2002 | US6364195 Brazing Apparatus |
| 04/02/2002 | US6364194 Soldering apparatus |
| 03/28/2002 | WO2002026007A1 Flux applying method and device, flow soldering method and device and electronic circuit board |
| 03/28/2002 | WO2002024391A1 Polymer collar for solder bumps |
| 03/28/2002 | US20020036223 Soldering apparatus |
| 03/28/2002 | DE10045359A1 Vorrichtung zum Aufbringen von Lotpaste auf eine Leiterplatte Apparatus for applying solder paste to a circuit board |
| 03/27/2002 | EP1190801A1 Apparatus for multi-point deposition of solder paste on a printed circuit board |
| 03/27/2002 | EP1189725A1 A control method for copper content in a solder dipping bath |
| 03/27/2002 | EP1189721A1 Closed loop solder wave height control system |
| 03/27/2002 | EP0944453B1 Soldering/unsoldering arrangement |
| 03/26/2002 | US6360935 Apparatus and method for assessing solderability |
| 03/26/2002 | CA2049666C Method for reducing the energy consumption and minimizing the martensite formation when joining a connecting piece of metal with a metal surface by pin brazing and arrangement forcarrying out the method |
| 03/21/2002 | US20020034582 Print head for ejecting liquid droplets and associated methods |
| 03/21/2002 | US20020034581 Micro C-4 semiconductor die and method for depositing connection sites thereon |
| 03/20/2002 | CN1340395A Method for brazed joint of metal workpieces |
| 03/19/2002 | US6357649 Method and apparatus for automatically soldering a lead wire to a solar battery |
| 03/14/2002 | US20020031903 Component mounting apparatus and method, component mounting system having the apparatus, and circuit board manufactured by the method |
| 03/14/2002 | US20020031612 Scanning pattern; accuracy |
| 03/14/2002 | US20020030088 Device and method for clamping and wire-bonding the leads of a lead frame one set at a time |
| 03/14/2002 | US20020029704 Screen printing paste, screen printing method, and baked thick film body |
| 03/14/2002 | DE10143697A1 Process for removing heat from the soldering or welding region of two metallic workpieces comprises measuring the temperature of the metallic materials to be joined |
| 03/14/2002 | DE10043653A1 Plant for removal of soldering flux residues from soldered, metallic workpieces, includes rinsing tank for washing an active medium with water |
| 03/13/2002 | CN1339993A Method and apparatus for dispensing material in a printer |
| 03/13/2002 | CN1080599C Spreading apparatus |
| 03/07/2002 | WO2002018085A1 Rapid surface cooling of solder droplets by flash evaporation |
| 03/07/2002 | US20020027157 Solder dross removal apparatus and method |
| 03/07/2002 | US20020026708 Method of fabricating temperature control device |
| 03/07/2002 | DE10042246C1 Production of overlapping joints on aluminum fine sheets comprises heating solder plated sheets, and maintaining such a force until the material is cooled to below the solidus temperature of the solder to safely form a solid joint |
| 03/07/2002 | DE10038330A1 Lötverfahren zur Befestigung elektrischer Bauelemente Soldering for mounting electrical components |
| 03/06/2002 | CN1338892A Solder ball releaser |
| 03/05/2002 | US6352189 Ball suction head |
| 02/28/2002 | WO2002017380A2 Selective flux deposition |
| 02/28/2002 | WO2002016135A1 Method and apparatus for dispensing viscous material |
| 02/28/2002 | US20020023947 Method of brazing metal work |
| 02/28/2002 | US20020023945 Low temperature solder column attach by injection molded solder and structure formed |
| 02/27/2002 | EP1181535A1 Method and apparatus for inspecting solder paste deposits on substrates |
| 02/27/2002 | CN1337290A Braze-welding apparatus of controlling heating degree according to temp. of structural member being braze-welded and method thereof |