| Patents for B23K 3 - Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (10,880) |
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| 04/22/2004 | WO2004033140A1 A method and a means for the fixation of objects |
| 04/22/2004 | WO2003090507A9 Filtration of flux contaminants |
| 04/22/2004 | US20040074946 Solder ball holding terminal in a bga arrangement |
| 04/21/2004 | EP1410866A2 Methods and apparatus for dispensing materials on a substrate |
| 04/20/2004 | US6722554 Soldering apparatus |
| 04/15/2004 | WO2004032584A2 Selective wave solder system |
| 04/15/2004 | WO2004030855A1 Cleaning gas device cleaning the process gas of a reflow soldering system |
| 04/15/2004 | WO2004030854A2 Selective gas knife for wave soldering |
| 04/15/2004 | US20040069840 Method and apparatus for filling a mask with solder paste |
| 04/15/2004 | US20040069758 Method and device for applying a solder to a substrate |
| 04/15/2004 | DE10147789B4 Vorrichtung zum Verlöten von Kontakten auf Halbleiterchips Apparatus for soldering contacts on semiconductor chips |
| 04/13/2004 | US6719144 Method of separating oxide from dross, device for separating oxide from dross, and jet solder tank |
| 04/08/2004 | US20040065653 Iron tip and electric soldering iron |
| 04/08/2004 | DE10342964A1 Flachdrahtreparaturwerkzeugsysteme und -verfahren Flat wire repair tool systems and procedures |
| 04/08/2004 | DE10246540A1 Reinigungsvorrichtung und Verfahren zur Reinigung von Prozessgas einer Reflowlötanlage Cleaning apparatus and method for cleaning a process gas reflow soldering |
| 04/07/2004 | EP1405687A2 Method and device for flow soldering |
| 04/07/2004 | EP1404478A1 Soldering nozzle for wave soldering printed circuit boards |
| 04/07/2004 | EP1214168B1 System for monitoring and controlling a welding/brazing operation |
| 04/07/2004 | CN1487359A Mask. wiring substrate for brazing filler metal printing and producing method thereof, and their application |
| 04/07/2004 | CN1486813A Soft brazing method |
| 04/07/2004 | CN1144644C Method for setting reflux furnace parameters for soldering surface mounted element |
| 04/06/2004 | US6715662 Waste energy recovery system for a controlled atmosphere system |
| 04/01/2004 | US20040060971 Method for the production of a soldered connection |
| 04/01/2004 | US20040060963 Selective wave solder system |
| 04/01/2004 | US20040060961 Fluxless tube seal |
| 04/01/2004 | US20040060960 Selective gas knife for wave soldering |
| 03/31/2004 | CN2608208Y Low voltage electric iron |
| 03/25/2004 | US20040058183 Metal foil connection, honeycomb body, metal foil brazing medium particle fraction for metal foils and method for manufacturing a metal foil connection |
| 03/25/2004 | US20040055746 Subterranean well completion incorporating downhole-parkable robot therein |
| 03/25/2004 | DE10301102B3 Cleaning system for process gas, at soldering kiln, takes gas from hot zone to be passed through condensation trap for cooling and retaining any impurities within condensation |
| 03/23/2004 | US6710304 Cartridge type soldering iron with a releasable and replaceable handle |
| 03/23/2004 | US6709469 Spacer plate solder ball placement fixture and methods therefor |
| 03/23/2004 | US6708872 Method and apparatus for applying solder to an element on a substrate |
| 03/23/2004 | US6708871 Solder mask formed of laser ablatable material overlying the pads, and dispensing liquid solder onto the pads. |
| 03/23/2004 | US6708868 Method for producing weld points on a substrate and guide for implementing said method |
| 03/18/2004 | WO2003092947A8 Method and apparatus for dispensing solder |
| 03/18/2004 | US20040052678 Tin, silver, bismuth alloy |
| 03/18/2004 | US20040050911 Solder-fill and its manufacturing method for using semiconductor package and its application for mounting semiconductor chip on PCB |
| 03/18/2004 | US20040050910 Flatwire repair tool systems and methods |
| 03/18/2004 | US20040050905 Processing device, processing method, and production equipment using the device and the method |
| 03/18/2004 | US20040050832 Method for soldering work pieces |
| 03/17/2004 | CN1482956A Solder foil, semiconductor device and electronic device |
| 03/17/2004 | CN1481960A Nozzle structure for automatic welding devic |
| 03/16/2004 | US6707007 Electrically heated soldering pliers with removably attachable jaw portions |
| 03/16/2004 | US6705506 Inert atmosphere soldering apparatus |
| 03/16/2004 | US6705505 Paste providing method, soldering method and apparatus and system therefor |
| 03/10/2004 | CN1480288A Method for directly coating welding agent on brazing surface |
| 03/04/2004 | US20040043347 Gas powered soldering tool |
| 03/04/2004 | DE20316711U1 Viscose paste printing apparatus e.g. for solder paste for mounting components on circuit boards, has massive pressing piece, printing stencil made of flexible material and substrate carrier |
| 03/04/2004 | DE10160710A1 Soldering process uses robot mounted tool that positions soldering tool that operates with a protective gas atmosphere |
| 03/03/2004 | EP1393847A1 Workpiece support for a thermal cutting apparatus and apparatus and method for manufacturing the workpiece support |
| 03/03/2004 | EP1393845A2 Method and apparatus for applying solder to a substrate |
| 03/03/2004 | CN1479661A Working device and working method, and production equipment using it |
| 03/02/2004 | US6699306 Dip soldering printed circuit board with surfaced copper foil and component having a copper lead attached thereto; replenishment; lead-free solders |
| 03/02/2004 | US6698346 Screen-printing material replenishing device |
| 02/26/2004 | US20040035917 Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece |
| 02/26/2004 | US20040035908 Filling device and method for filling balls in the apertures of a ball-receiving element |
| 02/26/2004 | US20040035907 Apparatus and method for dispensing solder |
| 02/24/2004 | US6697151 Material inspection |
| 02/24/2004 | US6696668 Laser soldering method and apparatus |
| 02/24/2004 | US6696321 High performance multi-chip flip chip package |
| 02/24/2004 | US6695200 Bumps made with adhesive film instead of gold plating |
| 02/19/2004 | WO2003066265A3 Vacuum compression brazing furnace and method of using same |
| 02/18/2004 | EP1389406A1 A jetting device and a method at a jetting device |
| 02/18/2004 | CN2603721Y Tin groove structure of stove with rotatable nozzle |
| 02/18/2004 | CN2603720Y Tin groove structure with rotatable nozzle |
| 02/17/2004 | US6693263 Convection type brazing apparatus for metal workpieces |
| 02/17/2004 | US6691908 Brazing apparatus and brazing method in which the amount of heating is controlled on the basis of temperature of articles to be brazed |
| 02/12/2004 | US20040026479 Continuous mode solder jet apparatus |
| 02/12/2004 | DE10248110A1 System to obtain reproducible conditions when soldering contact points on an electronic circuit board uses voltage and temperature measurements |
| 02/11/2004 | EP1047524B1 Paste for welding ceramics to metals and method for producing a welded joint |
| 02/10/2004 | US6688511 Wave solder apparatus and method |
| 02/05/2004 | WO2004011191A1 Apparatus and method for holding in position adjacent facing ends of tube sections for joining them by welding |
| 02/05/2004 | WO2004011177A2 Building a three-dimensional structure by manipulating individual particles |
| 01/29/2004 | WO2004010753A1 Jetting device and method at a jetting device |
| 01/29/2004 | US20040016793 Method for direct application of flux to a brazing surface |
| 01/29/2004 | US20040016791 Automated soldering system with multiple feed lines |
| 01/28/2004 | EP1384545A2 Method for direct application of flux to a surface to be brazed |
| 01/27/2004 | US6681980 Structure of soldering iron tip |
| 01/27/2004 | US6681838 Liquid-solid rolling bonding method for different kinds of metals and the apparatus therefor |
| 01/22/2004 | WO2004007133A1 Dispensing system and method |
| 01/22/2004 | US20040015030 Protecting catalytic activity of a SAPO molecular sieve |
| 01/22/2004 | US20040011857 Electrical terminal tinning process |
| 01/22/2004 | US20040011856 Soldering method for mounting electric components |
| 01/22/2004 | US20040011852 Method and device for applying pieces of material to a workpiece |
| 01/22/2004 | US20040011851 Dross removal and solder reclamation improvements |
| 01/22/2004 | US20040011850 Centrifugal apparatus for removing excess solder |
| 01/21/2004 | EP1381487A1 Appliance for improved inertizing during wave soldering |
| 01/20/2004 | US6678946 Method of manufacturing a circuit unit |
| 01/15/2004 | US20040007384 Electronic device |
| 01/13/2004 | US6677668 Configuration for testing a substrate mounted with a most performance-demanding integrated circuit |
| 01/13/2004 | US6676006 Flux supply device in which liquid flux is supplied through liquid holding portion, and liquid flux supply method |
| 01/08/2004 | US20040003891 Apparatus and method for application of adhesive substances to objects |
| 01/08/2004 | DE4290735B4 Verfahren und Vorrichtung zum Stumpfspleißen von Metallbändern Method and apparatus for butt splicing of metal strips |
| 01/07/2004 | EP1378309A2 Soldering apparatus, and agent and method for seperating solder and solder oxides |
| 01/07/2004 | CN1134098C Linear motor-driven pump for wave welding device |
| 01/06/2004 | US6672500 Method for producing a reliable solder joint interconnection |
| 01/06/2004 | US6671952 Method of lead wire connection |
| 01/02/2004 | EP1035940B1 Apparatus for dispensing materials on a substrate |
| 01/01/2004 | US20040000574 Solder applying method and solder applying apparatus |