| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/25/2013 | CN103327748A 电路板及其制作方法 Circuit board and its manufacturing method |
| 09/25/2013 | CN103327747A Intelligent-temperature-control applied copper plate corrosion equipment |
| 09/25/2013 | CN103327746A Method for etching PCB outer layer circuit of fine circuit |
| 09/25/2013 | CN103327745A Method for restraining warping of asymmetric printed circuit board |
| 09/25/2013 | CN103327744A Production method for improving resistance welding counterpoint accuracy of circuit boards |
| 09/25/2013 | CN103327743A Para-position production method with accuracy within 2Mil for circuit board resistance welding windowing |
| 09/25/2013 | CN103327742A Three-dimensional step PCB machining method |
| 09/25/2013 | CN103327741A 3D (Three Dimensional)-printing-based package substrate and manufacturing method thereof |
| 09/25/2013 | CN103327740A Structure composed of piezo actuator and flexible circuit board |
| 09/25/2013 | CN103327738A Softness-hardness combined circuit board and manufacturing method thereof |
| 09/25/2013 | CN103327737A Chip assembly structure and chip assembly method |
| 09/25/2013 | CN103327736A High heat conducting and insulating metal matrix printed circuit board |
| 09/25/2013 | CN103327735A High heat conducting and insulating metal matrix printed circuit board |
| 09/25/2013 | CN103327734A Integrated type high-thermal-conductivity circuit board and manufacturing method thereof |
| 09/25/2013 | CN103327732A High heat conduction substrate and manufacturing method thereof |
| 09/25/2013 | CN103326148A Plug-in type component, circuit board and preparation method for circuit board |
| 09/25/2013 | CN103325712A IGBT module packaging welding auxiliary device and system |
| 09/25/2013 | CN103324040A Method for raising contraposition precision between printed circuit board and film |
| 09/25/2013 | CN103322542A Device for strengthening LED heat dissipation through welding and welding method |
| 09/25/2013 | CN102666658B Polyimide resin, manufacturing method therefor, adhesive resin composition, coverlay film, and circuit board |
| 09/25/2013 | CN102469688B Bonding device for production equipment for flexible circuit boards and manufacturing method thereof |
| 09/25/2013 | CN102438412B Back drilling method of PCB (Printed Circuit Board) |
| 09/25/2013 | CN102387671B Manufacturing method for single face windowing hole plugging of tin spayed plate |
| 09/25/2013 | CN102210199B Electric circuit apparatus |
| 09/25/2013 | CN102172108B Method for treating the surface of a planar object, planar object and use |
| 09/25/2013 | CN102137541B Flex-rigid wiring board and method for manufacturing same |
| 09/25/2013 | CN101678671B Printing head, stencil printer and method for calibrating rubber scraper force against stencil |
| 09/24/2013 | US8541689 Method for removing a part of a planar material layer and multilayer structure |
| 09/24/2013 | US8541686 Wiring member and method for producing the same |
| 09/24/2013 | US8540903 Electrically conductive paste, and electrical and electronic device comprising the same |
| 09/19/2013 | WO2013138278A1 Copper cleaning and protection formulations |
| 09/19/2013 | WO2013137993A1 Sensor device with stepped pads for connectivity |
| 09/19/2013 | WO2013137668A1 The printed circuit board and the method for manufacturing the same |
| 09/19/2013 | WO2013137200A1 Flux, solder composition and method for producing electronic circuit mounting substrate |
| 09/19/2013 | WO2013137130A1 Sealant paste and sealing method |
| 09/19/2013 | WO2013136979A1 Circuit connection material and method for producing mounted product using same |
| 09/19/2013 | WO2013136729A1 Manufacturing method for laminated board and printed wiring board |
| 09/19/2013 | WO2013136695A1 Laser processing device and laser processing method |
| 09/19/2013 | WO2013136591A1 Image inspection method and inspection region setting method |
| 09/19/2013 | WO2013136575A1 Printed wiring board and circuit board |
| 09/19/2013 | WO2013135791A1 Method, device, and system for a power circuit |
| 09/19/2013 | WO2013135082A1 Multilayer printed circuit board and manufacturing method thereof |
| 09/19/2013 | US20130244490 High performance surface mount electrical interconnect |
| 09/19/2013 | US20130243941 Method of manufacturing coreless substrate having filled via pad |
| 09/19/2013 | US20130243655 Flexible IC/microfluidic integration and packaging |
| 09/19/2013 | US20130242518 Chip assembly and chip assembling method |
| 09/19/2013 | US20130242514 Electrical Subsea Node |
| 09/19/2013 | US20130242510 Photoimaging Method and Apparatus |
| 09/19/2013 | US20130242496 Electronic devices mounted on multiple substrates |
| 09/19/2013 | US20130242493 Low cost interposer fabricated with additive processes |
| 09/19/2013 | US20130241939 High capacitance density metal-insulator-metal capacitors |
| 09/19/2013 | US20130241589 Wiring base plate and method for manufacturing the same |
| 09/19/2013 | US20130240366 Plated terminations |
| 09/19/2013 | US20130240259 Method of manufacturing wiring board, wiring board, and via structure |
| 09/19/2013 | US20130240256 Method for Reducing Creep Corrosion |
| 09/19/2013 | US20130240254 Printed circuit board and method for manufacturing printed circuit board |
| 09/19/2013 | US20130239408 Power and ground vias for power distribution systems |
| 09/19/2013 | US20130239407 Bonding Components to Each Other Using Exothermic Reactions by Simultaneous Current Pulses |
| 09/19/2013 | US20130239404 System and Method for Integrated Inductor |
| 09/19/2013 | DE112011104460T5 Aufschmelzlötvorrichtung und Verfahren Reflow and procedures |
| 09/19/2013 | DE102012204069A1 Electrical plug connection for e.g. electrical appliance, of vehicle, has circuit board and/or housing part having recess in which body is partially immersed for positive connection of circuit board or housing part |
| 09/19/2013 | DE102012204012A1 Method for producing solder connection between semiconductor component and carrier element of power electronics module for e.g. hybrid car, involves arranging polyimide spacer element between semiconductor component and carrier element |
| 09/19/2013 | DE102006030010B4 Musterstrukturierverfahren und Verfahren zum Herstellen eines LCD Musterstrukturierverfahren and method of manufacturing a LCD |
| 09/18/2013 | EP2640173A2 Method for fabricating an electronic device |
| 09/18/2013 | EP2640172A1 Method for forming circuit on flexible laminate substrate |
| 09/18/2013 | EP2639884A1 Contact and contact joint structure |
| 09/18/2013 | EP2639640A1 Machine for exposing panels provided with a panel turner |
| 09/18/2013 | EP2639262A1 Thermoplastic composition |
| 09/18/2013 | CN203206593U Blind hole process structure of multilayer printed circuit board |
| 09/18/2013 | CN203206592U Novel controllable wave crest soldering tray |
| 09/18/2013 | CN203206591U PCB board and positioning column cooperation mounting structure |
| 09/18/2013 | CN203206590U V-shaped board placing frame used for placing circuit boards |
| 09/18/2013 | CN203206589U Copper-coated substrate hot-press device |
| 09/18/2013 | CN203206588U T-shaped reinforced steel sheet precise positioning apparatus |
| 09/18/2013 | CN203204300U Circuit graph positioning exposure system of circuit board |
| 09/18/2013 | CN203197426U Energy-saving type crest welder with intelligent control system |
| 09/18/2013 | CN203197423U Wave-soldering tray with soldering angle adjustable |
| 09/18/2013 | CN103314652A Wiring substrate and production method therefor |
| 09/18/2013 | CN103314651A Method for obtaining palladium surface finish for copper wire bonding on printed circuit boards and IC-substrates |
| 09/18/2013 | CN103314649A Method of transferring and electrically joining high density multilevel thin film to circuitized and flexible organic substrate and associated devices |
| 09/18/2013 | CN103314484A Board connecting terminal |
| 09/18/2013 | CN103314452A Pattern-forming method and solar cell manufacturing method |
| 09/18/2013 | CN103314286A Solder-attachment inspection method, solder-attachment inspection device, and PCB-inspection system |
| 09/18/2013 | CN103314135A Composition for forming layer to be plated, and process for producing laminate having metal film |
| 09/18/2013 | CN103313591A Part recognition system and part recognition method |
| 09/18/2013 | CN103313590A Surface Mount Technology (SMT) production line |
| 09/18/2013 | CN103313533A Manufacturing method of multi-layer flexible distributing board |
| 09/18/2013 | CN103313532A Direct laser drilling method for processing blind hole of circuit board |
| 09/18/2013 | CN103313531A Hole tamping method of circuit board |
| 09/18/2013 | CN103313530A Manufacturing method of rigid-flex circuit board |
| 09/18/2013 | CN103313529A Method for manufacturing rigid-flexible circuit board |
| 09/18/2013 | CN103313528A Multifunctional welder for electronic circuit |
| 09/18/2013 | CN103313527A Furnace-through fixture for reflow soldering |
| 09/18/2013 | CN103313526A IC (integrated circuit) chip placement jig |
| 09/18/2013 | CN103313525A System and method for positioning and correcting circuit board |
| 09/18/2013 | CN103313524A Capacitor configuration method, electronic equipment and printed circuit board |
| 09/18/2013 | CN103313523A Manufacturing method for electronic circuit |
| 09/18/2013 | CN103313522A Copper plating process of flexible circuit board and copper-plating hanging basket thereof |
| 09/18/2013 | CN103313521A Manufacturing method of plastic parts and surface conductor structures thereof |
| 09/18/2013 | CN103313520A Curved-surface metal graphic manufacturing method and curved-surface metal graphic substrate |