| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/28/2013 | CN203156194U Wave-soldering nozzle structure |
| 08/28/2013 | CN103270820A Flexible printed wiring board, and laminate for use in production of flexible printed wiring board |
| 08/28/2013 | CN103270819A Printed circuit board and method for manufacturing the same |
| 08/28/2013 | CN103270818A Circuit board and method of manufacturing same |
| 08/28/2013 | CN103270582A Tape adhering device and tape adhering method |
| 08/28/2013 | CN103270072A Epoxy resin compositions containing epoxy and vinyl ester groups |
| 08/28/2013 | CN103269858A Printing table assembly for printing e.g. substrate, has table with transport device to transport substrates in plane below another plane, where fixed distance between planes corresponds to distance between transport and printing planes |
| 08/28/2013 | CN103269857A Screen printing device and screen printing method |
| 08/28/2013 | CN103269856A Screen printing device and screen printing method |
| 08/28/2013 | CN103269855A Screen printing device and screen printing method |
| 08/28/2013 | CN103269820A Soldering nozzle for delivering molten solder to the underside of a PCB |
| 08/28/2013 | CN103269566A Wave-soldering jig with element locating function |
| 08/28/2013 | CN103269565A Method for packaging and designing power module |
| 08/28/2013 | CN103269564A Multilayer board local single-layer area inner layer cutting process |
| 08/28/2013 | CN103266336A Method for thickening copper surface of thick copper circuit board |
| 08/28/2013 | CN103266335A Copper foil for printed circuit and copper clad laminate |
| 08/28/2013 | CN102523694B Method for avoiding substrate exposure during pattern transfer of step circuit boards |
| 08/28/2013 | CN102516497B Fluorine-containing resin, preparation method thereof, conformal coating and printed circuit board |
| 08/28/2013 | CN102413646B Manufacturing method of circuit board |
| 08/28/2013 | CN102387668B Cutting machining technology for semi-hole plate provided with copper plating holes at plate edges |
| 08/28/2013 | CN102340938B 电路板制作方法 Circuit board production methods |
| 08/28/2013 | CN102340931B Method for making single-sided circuit board with flat wires arranged side by side |
| 08/28/2013 | CN102333419B Latch assembly and carrier with same |
| 08/28/2013 | CN102316664B Flexible circuit board and manufacture method thereof |
| 08/28/2013 | CN102291949B Manufacturing method of multi-layer circuit board |
| 08/28/2013 | CN102291927B Ceramic substrate of LED (light-emitting diode) lamp and LED lamp |
| 08/28/2013 | CN102223753B Circuit board and production method thereof |
| 08/28/2013 | CN102196672B 电路板制作方法 Circuit board production methods |
| 08/28/2013 | CN102196659B Circuit board film and circuit board manufacture method |
| 08/28/2013 | CN102158051B Power supply device and manufacturing method of printed circuit board winding |
| 08/28/2013 | CN102037615B Adhesive material reel |
| 08/28/2013 | CN101978001B Ink-jet ink composition for etching resist |
| 08/27/2013 | US8519511 Substrate dividing method |
| 08/27/2013 | US8519048 Formation of solid layers on substrates |
| 08/27/2013 | US8518801 Substrate dividing method |
| 08/27/2013 | US8518800 Substrate dividing method |
| 08/27/2013 | US8518230 Tin plating method |
| 08/27/2013 | US8517530 Fabrication of functional device mounting board making use of inkjet technique |
| 08/27/2013 | US8516693 Printed circuit board with embedded electronic components and methods for the same |
| 08/27/2013 | US8516692 Solder layer, substrate for device joining utilizing the same and method of manufacturing the substrate |
| 08/27/2013 | US8516691 Method of assembly of an in vivo imaging device with a flexible circuit board |
| 08/27/2013 | US8516689 Method of making a multi-layer interconnecting structure |
| 08/27/2013 | US8516683 Methods of making a radio frequency identification (RFID) tags |
| 08/22/2013 | WO2013121882A1 Circuit board for mounting electronic components |
| 08/22/2013 | WO2013121450A1 Improvements in the manufacturing of stacks of multiplayer plastic laminates for printed circuits |
| 08/22/2013 | WO2013120908A1 Microstructured polymer devices |
| 08/22/2013 | WO2013120660A1 Method for electroless nickel-phosphorous alloy deposition onto flexible substrates |
| 08/22/2013 | WO2012042667A9 Method for manufacturing substrate with built-in component, and substrate with built-in component manufactured using the method |
| 08/22/2013 | US20130219091 Island-Based Network Flow Processor Integrated Circuit |
| 08/22/2013 | US20130216878 Battery cell interconnect and voltage sensing assembly and method of manufacturing the assembly |
| 08/22/2013 | US20130216699 Method and apparatus for filling metal paste, and method for fabricating via plug |
| 08/22/2013 | US20130215722 Ultrasonic sensor devices, component module thereof and method for making the ultrasonic sensor device |
| 08/22/2013 | US20130215584 Laminate with integrated electronic component |
| 08/22/2013 | US20130215583 Embedded Electrical Component Surface Interconnect |
| 08/22/2013 | US20130215581 Board-mounted circuit breakers for electronic equipment enclosures |
| 08/22/2013 | US20130215579 Packaging techniques and configurations |
| 08/22/2013 | US20130215578 Method for creating resistive pathways |
| 08/22/2013 | US20130215577 Interface module and manufacturing method thereof |
| 08/22/2013 | US20130215566 Circuit layer manufacturing method and portable computer thereof |
| 08/22/2013 | US20130215200 Fine wiring pattern, manufacturing method thereof, and thermal print head |
| 08/22/2013 | US20130214890 High Current, Low Equivalent Series Resistance Printed Circuit Board Coil for Power Transfer Application |
| 08/22/2013 | US20130213705 Method of fabricating printed-wiring board, and printed-wiring board |
| 08/22/2013 | US20130213704 Package structure and the method to fabricate thereof |
| 08/22/2013 | US20130213703 Transparent conductive film |
| 08/22/2013 | US20130213701 Manufacturing method of printed wiring board and printed wiring board |
| 08/22/2013 | US20130213700 Manufacturing method of electrode substrate |
| 08/22/2013 | US20130213699 Substrate with built-in component and method for manufacturing the same |
| 08/22/2013 | US20130213693 Circuit board, structural unit thereof and manufacturing method thereof |
| 08/22/2013 | US20130213692 Fabricating method of circuit board and circuit board |
| 08/22/2013 | US20130212877 Manufacturing method of circuit board |
| 08/22/2013 | US20130212876 System for mounting components on boards |
| 08/22/2013 | DE112011103874T5 Reflow-Lötvorrichtung und Reflow-Lötverfahren Reflow soldering and reflow soldering |
| 08/22/2013 | DE112011103607T5 Leiterplatte und Leiterplattenblock für Fahrzeuge unter Verwendung der Leiterplatte PCB and PCB pad for vehicles using the printed circuit board |
| 08/22/2013 | DE102012202562A1 Mehrschichtige leiterplatte Multilayer PCB |
| 08/22/2013 | DE102012002945A1 Multi-functional multilayer printed circuit board for handbook, has wire elements electric conductively interconnected with electrically conductive structure of board by welding process e.g. ultrasonic welding process |
| 08/22/2013 | DE102004064161B4 Verfahren zum Ätzen von Metallen, ausgewählt aus Nickel, Chrom, Nickel-Chrom-Legierungen und/oder Palladium A method of etching of metals selected from nickel, chromium, nickel-chromium alloys, and / or palladium |
| 08/21/2013 | EP2629591A1 Light-emitting element mounting package, light-emitting element package, and method of manufacturing the same |
| 08/21/2013 | EP2628824A1 Method for electroless nickel-phosphorous alloy deposition onto flexible substrates |
| 08/21/2013 | EP2628504A1 EMI filtered co-connected hermetic feedthrough, feedthrough capacitor and leadwire assembly for an active implantable medical device |
| 08/21/2013 | EP2628370A1 Method and arrangement for attaching a chip to a printed conductive surface |
| 08/21/2013 | EP2628369A1 Process machine, in particular for treating and/or inspecting substrates |
| 08/21/2013 | EP2628176A2 Radiant heat circuit board, method of manufacturing the same, heat generating device package having the same, and backlight |
| 08/21/2013 | EP2628173A2 Semiconductor module and method of manufacturing a semiconductor module |
| 08/21/2013 | EP2628065A1 Electronic device having a hidden input key and method of manufacturing an electronic device |
| 08/21/2013 | CN203151939U Connecting pasting sheet of electronic component packaging material tape of SMT automatic paster equipment |
| 08/21/2013 | CN203151883U Welding material printing template and welding material printing template assembly |
| 08/21/2013 | CN203151882U Movable type centralized feeder |
| 08/21/2013 | CN203151881U A material moving apparatus of a chip mounter |
| 08/21/2013 | CN203151880U Automatic placement machine structure |
| 08/21/2013 | CN203151879U Jointed board carrier for surface mounting |
| 08/21/2013 | CN203151878U Nylon automatic peeling device for chip mounter material belt |
| 08/21/2013 | CN203151877U Electronic circuit surface mounting steel mesh |
| 08/21/2013 | CN203151876U Electronic circuit surface mounting glue net |
| 08/21/2013 | CN203151875U Electronic circuit surface mounting steel mesh |
| 08/21/2013 | CN203151874U Electronic circuit surface mounting steel mesh |
| 08/21/2013 | CN203151873U Full-automatic desktop chip mounter |
| 08/21/2013 | CN203151872U Laser alignment device for pressing and arrangement for PCBs (printed circuit boards) |
| 08/21/2013 | CN203151871U Protection device for haftplatte microswitch |
| 08/21/2013 | CN203151870U Work fixture for transporting flexible circuit board |
| 08/21/2013 | CN203151869U Automatic antifoaming agent adding device for printed circuit board |