Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/2013
09/04/2013CN103283313A Metal base circuit board, and method for producing metal base circuit board
09/04/2013CN103282830A Novel photosensitive resin composition and use thereof
09/04/2013CN103282829A 感光性树脂组合物 The photosensitive resin composition
09/04/2013CN103282546A Laminate and method for producing laminate
09/04/2013CN103282168A Drill entry sheet
09/04/2013CN103281878A Manufacturing method for printed circuit board with penetrating-through holes
09/04/2013CN103281877A Interlamination interconnection manufacturing method of printed circuit board
09/04/2013CN103281876A Pit embedded circuit board three-dimensional assembling method
09/04/2013CN103281875A Method for manufacturing embedded electronic circuit three-dimensional assembly substrate
09/04/2013CN103281874A Welding method of pasted electronic element
09/04/2013CN103281873A Automatic chip mounter
09/04/2013CN103281872A Automatic chip mounting device and chip mounting method
09/04/2013CN103281871A Electronic circuit manufacturing method
09/04/2013CN103281870A Local electrogilding circuit board manufacturing method capable of avoiding nickel layer suspended falling
09/04/2013CN103281869A Manufacturing method for circuit board
09/04/2013CN103281868A Flexible circuit board hot-press overflowing glue non-stick heating head mechanism
09/04/2013CN103281867A Heating jig protection device for use in jointing of flexible circuit board
09/04/2013CN103281866A Printed circuit board (PCB), design method for circuit diagram of PCB and electronic device
09/04/2013CN103281865A Precise typesetting pressure-sensitive adhesive carrier combined structure
09/04/2013CN103281864A Method for producing static flexible and foldable step circuit board
09/04/2013CN103281863A Reworking method of gold plating finger of circuit board
09/04/2013CN103281860A Heat dissipation conducting circuit board and manufacturing method thereof
09/04/2013CN103281859A Rigid-flex combined circuit board and manufacturing method therefore
09/04/2013CN103281858A Printed circuit board and manufacturing method thereof, and flip-chip packaging member and manufacturing method thereof
09/04/2013CN103280436A Surface-mounted device and production method thereof
09/04/2013CN102487579B Preparation method of metamaterial and the same
09/04/2013CN102428407B Photocurable thermosetting resin composition, dry film and cured product thereof, and printed wiring board using those materials
09/04/2013CN102272677B Photocurable resin composition, dry film and cured product of the photocurable resin composition, and printed wiring board using the photocurable resin composition, the dry film, and the cured product
09/04/2013CN102106195B Electroless copper plating method, printed wiring board, method for manufacturing printed wiring board and semiconductor device
09/04/2013CN102056403B Printed wiring board
09/04/2013CN101884258B Method for making an electric interconnection between two conducting layers
09/03/2013US8524629 Catalysts
09/03/2013US8524535 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
09/03/2013US8524531 System and method for improving solder joint reliability in an integrated circuit package
09/03/2013US8524032 Connecting film, and joined structure and method for producing the same
09/03/2013US8522430 Clustered stacked vias for reliable electronic substrates
09/03/2013US8522428 Method for producing a sensor board
09/03/2013US8522427 Method of manufacturing a printed circuit board
09/03/2013US8522426 Vent blocking on vented ball grid arrays to provide a cleaner solution barrier
09/03/2013US8522425 Assembly techniques for electronic devices having compact housing
09/03/2013US8522411 Method to control BAW resonator top electrode edge during patterning
08/2013
08/29/2013WO2013126600A1 Low profile, space efficient circuit shields
08/29/2013WO2013126270A1 Method for creating resistive pathways
08/29/2013WO2013087101A8 Substrate-supported circuit parts with free-standing three-dimensional structures
08/29/2013WO2013057252A3 Device and method for soldering
08/29/2013WO2013045364A3 Layered composite of a substrate film and of a layer assembly comprising a sinterable layer made of at least one metal powder and a solder layer
08/29/2013US20130226176 Electrode Device of an Electrosurgical Instrument
08/29/2013US20130223038 Module substrate and method for manufacturing module substrate
08/29/2013US20130223034 High performance electrical circuit structure
08/29/2013US20130223032 Chip-integrated through-plating of multi-layer substrates
08/29/2013US20130223031 Sensor comprising a multi-layered ceramic substrate and method for its production
08/29/2013US20130223030 Process for making stubless printed circuit boards
08/29/2013US20130223027 Electronic device and printed circuit board connection method
08/29/2013US20130223018 High-density sim card package and production method thereof
08/29/2013US20130222992 Storage bridge bay canister attachment system and method of forming same
08/29/2013US20130222750 Display substrate, display panel having the same, method of manufacturing the same and method of manufacturing the display panel
08/29/2013US20130222686 Camera module, terminal and manufacturing method
08/29/2013US20130221075 Method of Reducing Solder Wicking on a Substrate
08/29/2013US20130220995 Method and apparatus for welding printed circuits
08/29/2013US20130220691 Multilayer wiring substrate and method of manufacturing the same
08/29/2013US20130220689 Manufacturing method of electrical bridges suitable for reel to reel mass manufacturing
08/29/2013US20130220688 Mounting structure and mounting method
08/29/2013US20130220685 Copper foil for printed wiring board, method for producing said copper foil, resin substrate for printed wiring board and printed wiring board
08/29/2013US20130220683 Printed circuit board and method for manufacturing printed circuit board
08/29/2013US20130220681 Resin composition for forming receiving layer, and receiving substrate; printed matter, conductive pattern, and electric circuit produced by using the resin composition
08/29/2013US20130220680 Pattern substrate, method of producing the same, information input apparatus, and display apparatus
08/29/2013US20130220679 Copper foil and manufacturing method therefor, copper foil with carrier and manufacturing method therefor, printed circuit board, and multilayer printed circuit board
08/29/2013US20130220673 Heavy-wire bond arrangement and method for producing same
08/29/2013US20130220672 Single Layer Touch-Control Sensor Structure With Reduced Coupling To Proximate Ground Structures
08/29/2013US20130220535 Method of manufacturing rigid-flexible printed circuit board
08/29/2013US20130219714 Wiring board and method for manufacturing the same
08/29/2013US20130219713 Method of manufacturing a laminate circuit board with a multilayer circuit structure
08/29/2013US20130219712 Method of manufacturing multilayer wiring board
08/29/2013US20130219711 Electronic component and selection method
08/29/2013US20130219708 Mounting head unit, component mounting apparatus, and method of manufacturing a substrate
08/29/2013US20130219679 Pattern-wise defining micro-wires with different heights
08/29/2013DE102013203145A1 Leiterplatte Circuit board
08/29/2013DE102012203166A1 Method for manufacturing electrical conductive structures used in solar cell, involves locally defining nanoparticle connected energy input for each position on substrate during thermal treatment, to produce conductive structures
08/29/2013DE102012007804A1 Verfahren zum technologisch optimierten Ausführen von Lötverbindungen A method for performing technologically optimized solder joints
08/29/2013DE102012003520A1 Connector for LED located on circuit board in LED lamp, has attaching element whose anchor element is engaged with receptacle to fix connector on lamp component and clamping element fixes connector on component under defined system pressure
08/29/2013DE102006050890B4 Verfahren zur Herstellung einer Leiterplatte mit feinen Leiterstrukturen und lötaugenfreien Durchkontaktierungen A process for producing a circuit board having fine conductor structures and vias lötaugenfreien
08/28/2013EP2632237A1 Wiring substrate
08/28/2013EP2632236A1 Patterned base, method for manufacturing same, information input device, and display device
08/28/2013EP2631934A1 Semiconductor junction structure and method for manufacturing semiconductor junction structure
08/28/2013EP2630848A2 Method and apparatus for welding printed circuits
08/28/2013EP2630847A2 Metal core board and electric connection box having the same
08/28/2013EP2630656A1 Method of making a multi-chip module having a reduced thickness and related devices
08/28/2013EP2630652A1 Method of manufacturing printed circuit boards having vias with wrap plating
08/28/2013EP2630205A2 Water reducible coating compositions including carboxy ester ketals, methods of manufacture, and uses thereof
08/28/2013CN203167443U Preheating device of repair table
08/28/2013CN203167442U Screen board with openings
08/28/2013CN203167441U Pressing bar fixture
08/28/2013CN203167440U Circuit board element welding support device
08/28/2013CN203167439U Tool for peak-welding circuit board
08/28/2013CN203167438U Automatic placement machine
08/28/2013CN203167437U Surface mounting glue mesh for electronic circuit
08/28/2013CN203167436U Heavy roll compacting precise stainless steel mesh
08/28/2013CN203167417U PCB routing structure
08/28/2013CN203166702U Fan motor
08/28/2013CN203159733U Copper deposition basket device for printed circuit board (PCB)
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