| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 08/07/2013 | CN103237422A Laminating manufacturing method for thick copper multilayer plate |
| 08/07/2013 | CN103237421A PCB (printed circuit board) segmentation golden finger preparation method |
| 08/07/2013 | CN103237420A Wave soldering jig |
| 08/07/2013 | CN103237419A Method for stripping silver surface of silver removing circuit board |
| 08/07/2013 | CN103237418A Judging method for warping of PCB (Printed Circuit Board) |
| 08/07/2013 | CN103237417A Method for separating flexible base material from load bearing plate |
| 08/07/2013 | CN103237416A Pattern fabrication method capable of realizing hard gold electroplating and soft gold electroplating on same surface |
| 08/07/2013 | CN103237415A Special production jig for horizontal line |
| 08/07/2013 | CN103237414A Key circuit board production method |
| 08/07/2013 | CN103237413A Method for protecting inner-layer flexible board area of flex-rigid board |
| 08/07/2013 | CN103237412A Electrical part mounting structure, manufacture method of electrical part mounting structure, and electrical part product |
| 08/07/2013 | CN103237411A LED (Light Emitting Diode) single-sided circuit board manufactured by using thin conducting wire row and method |
| 08/07/2013 | CN103237410A Non-etched aluminum substrate and manufacturing method thereof |
| 08/07/2013 | CN103235964A EAS electronic tag unit without insulating film and manufacture method thereof |
| 08/07/2013 | CN103235492A PCB and film alignment device |
| 08/07/2013 | CN102476494B Dielectric substrate manufacturing method |
| 08/07/2013 | CN102387672B Method for manufacturing multilayer circuit board |
| 08/07/2013 | CN102361542B Manufacturing process of printed circuit board with steps |
| 08/07/2013 | CN102341753B Photosensitive resin composition, and photosensitive element, resist pattern formation method and printed circuit board production method each utilizing same |
| 08/07/2013 | CN102256447B Etching device and circuit board etching method |
| 08/07/2013 | CN102246605B Circuit module |
| 08/07/2013 | CN101869007B Electrical component mounting assemblies |
| 08/07/2013 | CN101423969B Continuous plating apparatus |
| 08/07/2013 | CN101111129B Manufacturing method of printed circuit board |
| 08/06/2013 | US8503189 Pb-free solder-connected structure and electronic device |
| 08/06/2013 | US8502086 Laminated wiring board and method for manufacturing the same |
| 08/06/2013 | US8502082 Circuitized substrate utilizing three smooth-sided conductive layers as part thereof and electrical assemblies and information handling systems utilizing same |
| 08/06/2013 | US8501045 Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same |
| 08/06/2013 | US8500988 Device and method for ELID honing |
| 08/06/2013 | US8500984 Method for manufacturing printed-circuit board |
| 08/06/2013 | US8500949 Apparatus and method for wet processing substrate |
| 08/06/2013 | US8499446 Method of manufacturing multilayer printed wiring board |
| 08/06/2013 | US8499445 Method of forming an electrically conductive printed line |
| 08/06/2013 | US8499444 Method of manufacturing a package substrate |
| 08/06/2013 | US8499443 Method of manufacturing a piezoelectric vibrator |
| 08/06/2013 | US8499441 Method of manufacturing a printed circuit board |
| 08/06/2013 | US8499440 Method of making halogen-free circuitized substrate with reduced thermal expansion |
| 08/06/2013 | CA2702704C Electronic apparatus for lighting applications |
| 08/02/2013 | CA2804136A1 Composition of palladium unsaturated carboxylate and palladium nanoparticles |
| 08/02/2013 | CA2803519A1 Composition of palladium unsaturated organoamine and palladium nanoparticles |
| 08/01/2013 | WO2013111995A1 Multilayer printed circuit board and method for manufacturing same |
| 08/01/2013 | WO2013111907A1 Etching method and etching liquid used therein |
| 08/01/2013 | WO2013111805A1 Photosensitive conductive paste |
| 08/01/2013 | WO2013111767A1 Multilayer circuit board |
| 08/01/2013 | WO2013111651A1 Jet soldering height checking jig and method for handling same |
| 08/01/2013 | WO2013111516A1 Dry cleaning device |
| 08/01/2013 | WO2013111481A1 Novel resin composition for pigment-containing insulating film, and use thereof |
| 08/01/2013 | WO2013111478A1 Novel resin composition for insulating film, and use thereof |
| 08/01/2013 | WO2013111434A1 Assembly and semiconductor module |
| 08/01/2013 | WO2013111206A1 Electronic component separating/collecting method and electronic component separating/collecting apparatus |
| 08/01/2013 | WO2013111194A1 Multilayer printed board |
| 08/01/2013 | WO2013110685A1 Printing screen for surface mount devices |
| 08/01/2013 | US20130194780 Appliance user interface having reverse mount leds |
| 08/01/2013 | US20130194764 Wiring board and method for manufacturing the same |
| 08/01/2013 | US20130194708 Current Carrying Structures Having Enhanced Electrostatic Discharge Protection And Methods Of Manufacture |
| 08/01/2013 | US20130194653 Analog imod having a color notch filter |
| 08/01/2013 | US20130194137 Mobile wireless communications device including rigid mechanical stiffener slot antenna and related methods |
| 08/01/2013 | US20130193619 Micro-dispensing multi-layered 3d objects with curing steps |
| 08/01/2013 | US20130193572 Ball grid array package substrate with through holes and method of forming same |
| 08/01/2013 | US20130192885 Method of forming solder resist layer and printed circuit board comprising solder resist layer |
| 08/01/2013 | US20130192880 Printed wiring board and method of manufacturing printed wiring board |
| 08/01/2013 | US20130192879 Multilayer printed wiring board |
| 08/01/2013 | US20130192877 Wiring board and method for manufacturing wiring board |
| 08/01/2013 | US20130192065 Method for manufacturing a circuit |
| 08/01/2013 | US20130192064 Method for manufacturing packaged light emitting diode |
| 08/01/2013 | US20130192061 Led package manufacturing system and resin coating method in led package manufacturing system |
| 08/01/2013 | DE102013100347A1 System und verfahren für eine elektronikeinheit mit einem bei ausfall geöffneten mechanismus System and method for an electronic device with an open case failure mechanism |
| 08/01/2013 | DE102012207367A1 Method for manufacturing circuit board for e.g. hearing aid, involves arranging covering on base, where covering provides electrical interconnection to electrical component and contact such that component remains free by protecting layer |
| 08/01/2013 | DE102012201177A1 Plastic-sheathed component carrier for use in electronic powertrain mold device in motor car, has vias filled with covering region with mold compound such that connection is formed between mold layers above and below board, respectively |
| 07/31/2013 | EP2621254A1 Recyclable circuit assembly |
| 07/31/2013 | EP2621253A1 Wiring substrate, light emitting device, and manufacturing method of wiring substrate |
| 07/31/2013 | EP2621251A1 Current carrying structures having enhanced electrostatic discharge protection and methods of manufacture |
| 07/31/2013 | EP2621250A1 Wiring substrate, light emitting device, and manufacturing method of wiring substrate |
| 07/31/2013 | EP2621249A1 Printed wiring board and method of manufacturing printed wiring board. |
| 07/31/2013 | EP2620530A1 Method for manufacturing copper foil for printed circuit board and copper foil for printed circuit board |
| 07/31/2013 | EP2620523A2 Method of forming a microstructure |
| 07/31/2013 | EP2620485A1 Film sealant and sealing method |
| 07/31/2013 | EP2620479A1 Curable composition for inkjet, and method for producing electronic component |
| 07/31/2013 | EP2620478A1 Curable composition for inkjet and method for producing electronic component |
| 07/31/2013 | EP2620463A1 Powdered sealant and sealing method |
| 07/31/2013 | EP2620290A1 Resin composition for forming receiving layers, receiving base obtained using same, printed matter, conductive pattern, and electrical circuit |
| 07/31/2013 | EP2620283A1 Printer device, temperature adjustment method of printer device, and temperature adjustment system of printer device |
| 07/31/2013 | EP2620043A1 Manufacturing method of electrical bridges suitable for reel to reel mass manufacturing |
| 07/31/2013 | CN203104981U Inner layer line positioning device of multilayer board |
| 07/31/2013 | CN203104980U Microplate chemical copper activation back washing system |
| 07/31/2013 | CN203104979U Inductance coil through hole reflow soldering fixture |
| 07/31/2013 | CN203104978U Tin-coated electronic patch device at welding end |
| 07/31/2013 | CN203104977U Solder tank |
| 07/31/2013 | CN203104976U Tinning furnace jig |
| 07/31/2013 | CN203104975U Chip mounter automatic feeding mechanism |
| 07/31/2013 | CN203104974U Chip mounter visual calibration system |
| 07/31/2013 | CN203104973U High-speed array type surface mounting machine |
| 07/31/2013 | CN203104972U Feeder pedestal sliding locking mechanism of array type surface mounted technology-based machine |
| 07/31/2013 | CN203104971U Suction nozzle rotary motion mechanism of surface mounted technology-based machine |
| 07/31/2013 | CN203104970U Dual-platform board feeding mechanism of surface mounted technology-based machine |
| 07/31/2013 | CN203104969U Mount head up-and-down motion mechanism of surface mounted technology-based machine |
| 07/31/2013 | CN203104968U Rotating jig for rotating head part of mounting head |
| 07/31/2013 | CN203104967U FPC (Flexible Printed Circuit) laminating machine |
| 07/31/2013 | CN203104966U Selective electric thick gold production device |
| 07/31/2013 | CN203104965U A bearing device |