Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2013
11/20/2013CN203301867U Ultra-thin vibration motor base material circuit board processing system
11/20/2013CN203301866U Improved transportation device
11/20/2013CN203298671U Circuit board bridge pile positioning fixture
11/20/2013CN203293062U Fitting jig
11/20/2013CN203292740U Wave-soldering tool
11/20/2013CN103404245A Hybrid-core through holes and vias
11/20/2013CN103404244A Printed circuit board and method for manufacturing same
11/20/2013CN103404243A Printed circuit board and method for manufacturing the same
11/20/2013CN103404242A Assembly having substrate, SMD component, and lead frame part
11/20/2013CN103404241A Ceramic multilayered substrate and manufacturing method for same
11/20/2013CN103404239A Multilayered wired substrate and method for producing the same
11/20/2013CN103403891A Carrier for an optoelectronic structure and optoelectronic semiconductor chip comprising such a carrier
11/20/2013CN103403624A Alignment device and exposure device provided with same
11/20/2013CN103403619A Photosensitive composition, photosensitive film, photosensitive laminate, permanent pattern formation method, and printed substrate
11/20/2013CN103403228A Through-hole plating method and substrate manufactured using same
11/20/2013CN103403106A Photocurable/thermosetting inkjet composition, and printed wiring board using same
11/20/2013CN103403089A Resin composition and method for producing circuit board
11/20/2013CN103402769A Screen printing device and screen printing method
11/20/2013CN103402659A Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment
11/20/2013CN103402333A Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof
11/20/2013CN103402332A Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof
11/20/2013CN103402331A Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof
11/20/2013CN103402330A Adjustable circuit board printing chassis
11/20/2013CN103402329A Elastic force printing chassis structure
11/20/2013CN103402328A Technology solving burring problem of half edge PTH hole of circuit board combining softness and hardness
11/20/2013CN103402327A Manufacturing method of printing electrode for portable heavy metal detection
11/20/2013CN103402326A Sealed circuit board printing plate
11/20/2013CN103402325A Clamp for quickly and circularly electroplating circuit board by matching pneumatic worktable
11/20/2013CN103402324A Production process for improving blind routing depth accuracy
11/20/2013CN103402323A Production jig special for sheet for use on horizontal line
11/20/2013CN103402322A Circuit board printing chassis structure
11/20/2013CN103402321A Printing underpan structure
11/20/2013CN103402320A Novel circuit board printing underpan structure
11/20/2013CN103402319A Double-layer sealed printing chassis structure
11/20/2013CN103402318A Permanent seat used for circuit board printing
11/20/2013CN103402317A Printing chassis with winding drum positioning needle
11/20/2013CN103402316A Circuit board printing chassis with double-row fixed pin structure
11/20/2013CN103402315A Plug-and-play circuit board printing chassis structure
11/20/2013CN103402314A Method for manufacturing PCB (Printed Circuit Board) board and manufactured PCB board
11/20/2013CN103402313A Thin film microcircuit cutting method based on sacrificial layer
11/20/2013CN103402312A A substrate with built-in electronic components
11/20/2013CN103402310A Soft-hard combined printed circuit board and manufacturing method thereof
11/20/2013CN103402303A Flexible printed circuit board and manufacturing method thereof
11/20/2013CN103402300A Integrated magnetic substrate based on LTCF (Low Temperature Co-fired Ferrite) and manufacturing method
11/20/2013CN103400778A Packaging-prior-to-etching passive device type three-dimensional system-level metal circuit board structure and process method thereof
11/20/2013CN103397359A Manufacturing method of electroplated connecting fingers free of lead wire residual
11/20/2013CN103396733A Polymerizable compound and curable composition comprising same
11/20/2013CN103394787A Nitrogen protector
11/20/2013CN102652147B Polymerizable compound and curable composition containing same
11/20/2013CN102415228B Build-up multilayer printed wiring board and production method therefor
11/20/2013CN102378489B Soft and hard circuit board and manufacturing method thereof
11/20/2013CN102365310B Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same
11/20/2013CN102165370B Photosensitive siloxane polyimide resin composition
11/20/2013CN102137547B Manufacturing method of circuit structure of circuit board
11/20/2013CN102112921B Flame-retardant photocurable resin composition, dry film and cured product of same, and printed circuit board using composition thereof
11/20/2013CN102112920B Flame-retardant photocurable resin composition, dry film and cured product of same, and printed circuit board using composition thereof
11/20/2013CN102065650B Printed-circuit board and manufacturing method thereof
11/20/2013CN102045964B Making method of circuit board
11/20/2013CN102037725B Digital television receiver
11/20/2013CN102036487B Method and device for carrying out formation machining on deck plate and deck plate
11/19/2013US8587112 Underbump metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stack
11/19/2013US8585432 Connector and optical transmission apparatus
11/19/2013US8584924 Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate
11/19/2013US8584354 Method for making glass interposer panels
11/19/2013US8584352 Process for producing multilayer printed wiring board
11/19/2013US8584331 In situ flexible circuit embossing to form an electrical interconnect
11/19/2013CA2526081C Fabrication process for a non-contact ticket and ticket obtained from such a process
11/14/2013WO2013169552A1 System for interconnecting printed circuit boards
11/14/2013WO2013169222A1 Printed circuit board comprising a via
11/14/2013WO2013168773A1 Laminate of conductive film, touch panel, wiring board, electronic appliance, transparent double-faced pressure-sensitive adhesive sheet, and transparent pressure-sensitive adhesive sheet
11/14/2013WO2013168761A1 Multilayer wiring board
11/14/2013WO2013168729A1 Insulation inspection method and insulation inspection device
11/14/2013WO2013168646A1 Surface-treated copper foil and laminate using same, copper foil, printed wiring board, electronic device, and process for producing printed wiring board
11/14/2013WO2013168611A1 Adhering apparatus and adhering method
11/14/2013WO2013168539A1 Resin multilayer substrate and production method therefor
11/14/2013WO2013168377A1 Waveguide structure having ebg characteristic
11/14/2013WO2013168357A1 Surface-mounting substrate
11/14/2013WO2013168352A1 Mounting structure and method for manufacturing same
11/14/2013WO2013168328A1 Screen printing device and screen printing method
11/14/2013WO2013168195A1 Pattern forming method
11/14/2013WO2013167123A1 Method for producing metal-ceramic substrates, and metal-ceramic substrate produced according to said method
11/14/2013WO2013166968A1 Jig for positioning flat cable for welding
11/14/2013WO2013102607A3 Hot melt ink composition, method for preparing a hot melt ink composition and use thereof
11/14/2013US20130303021 Connector Block for Coaxial Connectors
11/14/2013US20130302938 Method for forming wiring, semiconductor device, and method for manufacturing semiconductor device
11/14/2013US20130302534 Method for manufacturing display device
11/14/2013US20130301227 Circuit module and method of manufacturing same
11/14/2013US20130301202 Reconfigurable Modular Computing Device
11/14/2013US20130300986 Wire grid polarizer and method for fabricating thereof, liquid crystal display panel and liquid crystal display device having the same
11/14/2013US20130300387 Method of forming a semiconductor device and structure thereof
11/14/2013US20130299227 New printed circuit board and method for manufacturing same
11/14/2013US20130299223 Printed circuit board and method for manufacturing the same
11/14/2013US20130299221 Space transformer for probe card and method of manufacturing the same
11/14/2013US20130299220 Touch panel and method for manufacturing electrode member
11/14/2013US20130299219 Multilayer circuit board and method for manufacturing the same
11/14/2013US20130299218 Multilayer printed wiring board
11/14/2013US20130299217 Electrical and thermal conductive thin film with double layer structure provided as a one-dimensional nanomaterial network with graphene/graphene oxide coating
11/14/2013US20130299214 Patterned Substrates With Darkened Conductor Traces
11/14/2013US20130299133 High performance transient uniform cooling solution for thermal compression bonding process
11/14/2013US20130298669 Integrated sensors and sensing methods
1 ... 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 ... 1185