Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2013
11/14/2013US20130298398 Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board
11/14/2013US20130298397 Method for making circuit board
11/14/2013US20130298395 Method for manufacturing flexible printed circuit board
11/14/2013DE112012000872T5 Aufschmelzverfahren für bleifreies Lötmittel Reflow for lead-free solder
11/14/2013DE102013208350A1 Herstellungsverfahren für einen kühler Manufacturing method for a radiator
11/14/2013DE102012207833A1 Method for forming coil in circuit board for e.g. highly efficient bus system, involves forming helical conductor at inner wall of hole for formation of coil in circuit board, where helical conductors are wound around longitudinal axis
11/14/2013DE102012104903A1 Verfahren zum Herstellen von Metall-Keramik-Substraten sowie nach diesem Verfahren hergestelltes Metall-Keramik-Substrat A method for producing metal-ceramic substrates and manufactured by this process the metal-ceramic substrate
11/14/2013DE102012009345A1 Method for forming conductive layer region on surface of e.g. endless belt in component part in electric/electronic industry, involves accounting features of volume shrinkage such that conductive particles form predefinable geometry
11/13/2013EP2663169A1 Retaining and contacting element, contacting arrangement and method for establishing a contacting arrangement
11/13/2013EP2662424A1 Hot melt composition and a method and system for manufacturing electronic and/or optical components using such hot melt composition
11/13/2013EP2662191A1 De-burring tool
11/13/2013EP2662151A1 Method for pore sealing of porous materials using polyimide langmuir-blodgett film
11/13/2013CN203289752U Novel microwave high frequency metal circuit board
11/13/2013CN203289751U SMT automatic material sucking tray
11/13/2013CN203289750U Solder paste brushing head for circuit board
11/13/2013CN203289749U Solder paste brushing head for circuit board
11/13/2013CN203289748U Electronic element mounting equipment
11/13/2013CN203289747U Circuit board part assembly jig
11/13/2013CN203289746U Copper substrate structure with direct radiating copper-based boss
11/13/2013CN203289745U Frame and alignment and attaching device for circuit board
11/13/2013CN203289744U Track transmission positioning mechanism
11/13/2013CN203289743U Automatic printed circuit board (PCB) width adjusting device for automated optical inspection (AOI) detection workbench
11/13/2013CN203289742U Mutually-aligned film and semi-finished plate during image transfer process
11/13/2013CN203284493U Plating hanger for flexible circuit boards
11/13/2013CN203283930U Quick automatic plate collecting machine
11/13/2013CN203282006U Multifunctional soldering apparatus of electronic circuit
11/13/2013CN103392388A Method for producing multilayer substrate and desmearing method
11/13/2013CN103392387A Film forming method and film forming device
11/13/2013CN103392386A Method for manufacturing printed circuit board
11/13/2013CN103392385A Improvements in the manufacturing of stacks of multiplayer plastic laminates for printed circuits
11/13/2013CN103392384A Printed circuit board with an insulated metal substrate
11/13/2013CN103391848A Screen printing device and image recognition method for screen printing device
11/13/2013CN103391694A Manufacturing method for flexible printed circuit board
11/13/2013CN103391693A Positioning device for welding electronic component and method for welding electronic component
11/13/2013CN103391692A Circuit connecting material, circuit connecting structure and circuit element connecting method
11/13/2013CN103391691A 电路板及其制造方法 The circuit board and its manufacturing method
11/13/2013CN103391690A Solder resistance and de-bubbling method and device for printed circuit board
11/13/2013CN103391689A Printing base plate provided with pinhole limiting grooves
11/13/2013CN103391688A Multi-level circuit board printing chassis
11/13/2013CN103391687A Printing base plate provided with contact pin structure
11/13/2013CN103391686A Processing method of circuit boards
11/13/2013CN103391685A PCB pattern forming method and automatic optic inspection device
11/13/2013CN103391684A Manufacturing method of half-hole PCB (printed circuit board)
11/13/2013CN103391683A Device capable of moistening circuit board film body
11/13/2013CN103391682A Method for processing PCB with step groove
11/13/2013CN103391681A 印刷线路板及其制造方法 A printed wiring board and its manufacturing method
11/13/2013CN103391679A Rigid-flexible printed circuit board and method for manufacturing the same
11/13/2013CN103386524A Welding method
11/13/2013CN102884872B Multilayer wiring board and method for manufacturing multilayer wiring board
11/13/2013CN102458042B Circuit substrate manufacturing process, circuit substrate and semiconductor manufacturing process
11/13/2013CN102421247B Manufacturing process of inductive magnetic ring board
11/13/2013CN102369791B Multilayer wiring substrate producing method and multilayer wiring substrate obtained by the same
11/13/2013CN102361533B Electromagnetic band gap structure for optimizing power distribution network of PCB (printed circuit board) and construction method thereof
11/13/2013CN102215630B Flexible printed board and method of manufacturing same
11/13/2013CN102204420B Electronic device manufacturing method and electronic device
11/13/2013CN101780605B Wave-soldering brazing filler metal active agent
11/13/2013CN101072886B Anti-tombstoning lead free alloys for surface mount reflow soldering
11/12/2013US8581407 Electronic system modules and method of fabrication
11/12/2013US8581395 Hybrid integrated circuit device and electronic device
11/12/2013US8581109 Method for manufacturing a circuit board structure
11/12/2013US8581105 Electrical device with teeth joining layers and method for making the same
11/12/2013US8580390 Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using same
11/12/2013US8578599 Method of making a supported foam circuit laminate
11/12/2013US8578598 Fabricating method of embedded package structure
11/07/2013WO2013082638A3 Method for the production of a circuit board involving the removal of a subregion thereof, and use of such a method
11/07/2013US20130295276 Method for forming a copper wiring pattern
11/07/2013US20130294780 Planar optical interface and splitter
11/07/2013US20130294075 Lighting system and method of manufacture
11/07/2013US20130294036 Module for use with a monitoring system and method of assembling same
11/07/2013US20130294034 Method of manufacturing electronic component module and electronic component module
11/07/2013US20130293482 Transparent through-glass via
11/07/2013US20130293127 Method of forming an led control circuit and structure therefor
11/07/2013US20130292471 High frequency antenna formed on a compound surface
11/07/2013US20130292164 Rigid-flexible printed circuit board and method for manufacturing the same
11/07/2013US20130292162 Method for fabricating peripheral wiring unit of touch panel, the touch panel and touch screen display apparatus
11/07/2013US20130292050 Method of manufacturing a combined circuit board
11/07/2013US20130291381 Integrated circulators sharing a continuous circuit
11/07/2013US20130291380 Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package
11/07/2013US20130291379 Electronic component mounting device, electronic component mounting method, and method for changing arrangement of bottom reception pin module
11/07/2013DE112007001868B4 Glaskeramikzusammensetzung, gesinterter Glaskeramikkörper und elektronische Komponente aus monolithischer Keramik Glass ceramic composition sintered ceramic body and electronic component of monolithic ceramics
11/07/2013DE112007001859B4 Glaskeramikzusammensetzung, Glaskeramiksinterkörper und keramisches Mehrschicht-Elektronikbauteil Glass ceramic composition, glass ceramic sintered body and ceramic multi-layer electronic component
11/07/2013DE102012207296A1 Elektrische Durchkontaktierung mit mechanischer Dämpfung Electrical through with mechanical damping
11/07/2013DE102012103430A1 Verfahren zum Heften von Chips auf ein Substrat Method for stitching of chips on a substrate
11/06/2013EP2661160A1 Metallized substrate, metal paste composition, and method for producing metallized substrate
11/06/2013EP2661159A1 Circuit board and method of manufacturing same
11/06/2013EP2659751A1 Improvements in the manufacturing of stacks of multiplayer plastic laminates for printed circuits
11/06/2013EP2659750A1 Assembly comprising an electronic circuit wafer and a member supporting said wafer, and a method for assembling same
11/06/2013EP2659749A1 Printed circuit board, method for producing a printed circuit board and testing device for testing a printed circuit board
11/06/2013EP2659524A1 Encapsulation housing and led module with the same
11/06/2013EP2658698A1 Potting method for lamp chain
11/06/2013DE202013007756U1 Sensor und Abdeckelement für einen Sensor Sensor and cover for a sensor
11/06/2013CN203279371U Air guide backup plate
11/06/2013CN203279370U BGA automatic-temperature-control high-definition optical accurate-contraposition repair station
11/06/2013CN203279369U Assembling positioning jig for mobile phone main board
11/06/2013CN203279368U Vacuum mechanism connected with suction head for surface mount system
11/06/2013CN203279367U Platform elevating mechanism for surface mounts system
11/06/2013CN203279366U Suction head lifting swing rod mechanism for surface mount system
11/06/2013CN203279365U Lateral floating clamp mechanism used for transport rails of surface mount system
11/06/2013CN203279364U Material connection box of surface mount machine
11/06/2013CN203279363U Surface mount device based on network intelligent control
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