Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2013
10/02/2013CN103338597A Jig used in electronic assembly system
10/02/2013CN103338596A Manufacturing method of whole addition circuit board without photoresist
10/02/2013CN103338595A Heavy-copper step circuit board and preparation method thereof
10/02/2013CN103338594A Integral forming machine for flexible circuit board
10/02/2013CN103338593A Circuit board with large current module and manufacturing method for circuit board
10/02/2013CN103338592A Buried resistor and manufacture process thereof
10/02/2013CN103338590A 软性电路板及其制造方法 The flexible circuit board and its manufacturing method
10/02/2013CN103338587A Circuit board and fabrication technology thereof
10/02/2013CN103337487A Method and apparatus for attachment of integrated circuits
10/02/2013CN103335236A Manufacturing technology of high-voltage LED lamp bar, high-voltage LED lamp bank, and assembly method of high-voltage LED lamp bank
10/02/2013CN103331278A Automatic dust collection device of chip mounter
10/02/2013CN102476231B Reflow soldering machine with double guide rails
10/02/2013CN102348331B Circuit board manufacturing tool and circuit board manufacturing method
10/02/2013CN102198670B Board cutting system
10/02/2013CN102196676B Manufacturing method of multilayer circuit substrate, conductive material filling device and use method thereof
10/02/2013CN102192912B Solder printing inspection apparatus and solder printing system
10/02/2013CN101809206B Copper foil for printed circuit and copper clad laminate
10/02/2013CN101734004B Screen printing machine and printing unit
10/02/2013CN101690433B Wiring substrate, and its manufacturing method
10/01/2013US8546696 Printed circuit board and method for manufacturing the same
10/01/2013US8545931 Thin line conformal coating method
10/01/2013US8545929 Method for applying a liquid coating material to a substrate
10/01/2013US8544168 Part-mounting, inspecting and repairing method
10/01/2013US8544167 Collective mounting method of electronic components and manufacturing method of electronic component-embedded substrate
10/01/2013US8544157 Method for producing a liquid transport apparatus
10/01/2013CA2616793C Bending-type rigid printed wiring board and process for producing the same
09/2013
09/30/2013CA2773259A1 Low melting temperature solder alloy
09/26/2013WO2013142580A1 Application of dielectric layer and circuit traces on heat sink
09/26/2013WO2013141509A1 Printed circuit board and method of manufacturing the same
09/26/2013WO2013141392A1 Method for manufacturing electronic component
09/26/2013WO2013141339A1 Multilayer wiring board and method for manufacturing same
09/26/2013WO2013141299A1 Entry sheet for forming drill hole and drill hole-forming method
09/26/2013WO2013141247A1 Active ester resin, thermosetting resin composition, cured product of same, semiconductor encapsulation material, prepreg, circuit board, and build-up film
09/26/2013WO2013141131A1 Method for manufacturing connecting body, and method for connecting electronic component
09/26/2013WO2013140588A1 Method for manufacturing printed wiring board, and printed wiring board and semiconductor device
09/26/2013WO2013140471A1 Design rule checking system, method, and non-transitory computer readable medium having program stored therein
09/26/2013WO2013139058A1 Thermal dissipation substrate and manufacturing method therefor
09/26/2013US20130252457 Electrical connector having position fixer for conductive terminals
09/26/2013US20130252443 Structure having circuit boards connected therein and method for connecting circuit boards
09/26/2013US20130251966 Low temperature sintering conductive metal film and preparation method thereof
09/26/2013US20130251892 Method of forming a wiring pattern
09/26/2013US20130250577 Lighting unit and lighting device
09/26/2013US20130250576 Wiring board device, luminaire and manufacturing method of the wiring board device
09/26/2013US20130250562 Wiring board device, luminaire, and manufacturing method of the wiring board device
09/26/2013US20130250531 Electrically activatable integrated mechanical anti-rollback device with one or more positions
09/26/2013US20130249740 Flexible Printed Circuit Structures
09/26/2013US20130249112 Passive within via
09/26/2013US20130249069 Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit
09/26/2013US20130248608 Conductive Pattern and Method of Making
09/26/2013US20130248239 Electrical conductor and a production method therefor
09/26/2013US20130248236 Circuit board having holes to increase resonant frequency of via stubs
09/26/2013US20130248234 Multilayer Printed Wiring Board
09/26/2013US20130248232 Conductive pattern film substrate and manufacturing method
09/26/2013US20130248231 Ground feature for disk drive head suspension flexures
09/26/2013US20130248227 Conductive film having oxide layer and method of manufacturing the same
09/26/2013US20130248225 Laser Ablation Technique for Electrical Contact to Buried Electrically Conducting Layers in Diamond
09/26/2013US20130247977 Metal foil pattern laminate, method for punching metal foil, circuit board, method for manufacturing same, and solar cell module
09/26/2013US20130247373 Method of producing printed wiring board and copper foil for laser processing
09/26/2013US20130247372 Multilayer wiring board for an electronic device
09/26/2013US20130247371 Method for manufacturing a suspension board assembly sheet with circuits
09/26/2013US20130247367 Method for manufacturing switchable particle-based display using a pre-filling process
09/26/2013DE112011104326T5 Hybridkern-Durchgangslöcher und -Durchkontakte Hybrid core-through holes and -Durchkontakte
09/26/2013DE112011103520T5 Bonden und elektrisches Koppeln von Komponenten Bonding and electrically coupling of components
09/26/2013DE102012213573B3 Semiconductor module arrangement, has module connected and mechanically held at terminals with circuit board in electrical conductive manner, where form-fit connection is indirectly formed between module and body over circuit board
09/26/2013DE102012204630A1 Control device for controlling thermoplastic molding, during manufacturing of e.g. chip, has substrate and electronic component enclosed by mold where device is surrounded by cover over sealing region that is overlapped in exposed region
09/26/2013DE102012102567A1 Verschiebbare Isolationsbarriere Movable insulation barrier
09/25/2013EP2642838A1 Metal foil pattern laminate, method for punching metal foil, circuit board, method for producing same, and solar cell module
09/25/2013EP2642837A1 Conductive pattern film substrate and manufacturing method
09/25/2013EP2642589A1 Film-like member and method for attaching same
09/25/2013EP2641997A1 Laminate and method for producing laminate
09/25/2013EP2641457A1 Method for mounting a component in or on a circuit board, and circuit board
09/25/2013EP2641456A1 Method for reducing creep corrosion
09/25/2013EP2641297A1 Multiple information carrier
09/25/2013EP2640868A2 Metal coating of objects using a plasma polymerisation pretreatment
09/25/2013CN203219688U Material rack of vibration machine
09/25/2013CN203219624U Multilayer printed circuit board riveting and positioning tool
09/25/2013CN203219623U Lamination stack plate structure of multilayer PCB (printed circuit board)
09/25/2013CN203219622U Resin hole plugging tool for printed circuit board
09/25/2013CN203219621U Device used in welding process of circuit board
09/25/2013CN203219620U Temperature control carry tool for processing hard disk control card
09/25/2013CN203219619U Clamping fixture used for circuit board
09/25/2013CN203219618U Tool for milling mini-sized printed circuit board
09/25/2013CN203219617U Precise positioning apparatus for circuit print of capacitive touch screen
09/25/2013CN203219614U 电路板 Board
09/25/2013CN203219605U A flexible circuit board lamination structure and a lamination manufacture device
09/25/2013CN203209815U Portable solder heating tank
09/25/2013CN203209812U Spraying type dual wave soldering unit
09/25/2013CN103329637A Resin multilayer substrate and method for manufacturing same
09/25/2013CN103328959A Substrate inspecting apparatus, substrate inspecting system, and method for displaying image for checking substrate inspection results
09/25/2013CN103328686A Metal coating of objects using plasma polymerisation
09/25/2013CN103328685A Process for producing metallic structures
09/25/2013CN103328215A Mask holder
09/25/2013CN103327756A Multilayer circuit board with partial mixed structure and manufacturing method thereof
09/25/2013CN103327755A Method of manufacturing stepped plate and stepped plate
09/25/2013CN103327754A Method for manufacturing multilayer circuit structure of circuit laminated board
09/25/2013CN103327753A Manufacturing method for metal semi-hole circuit board
09/25/2013CN103327752A 夹持装置 Clamping device
09/25/2013CN103327751A PCB fixed heating device, PCB lead bonding device and lead bonding method
09/25/2013CN103327750A Method for manufacturing inductor-buried type printed circuit board and circuit board manufactured through method
09/25/2013CN103327749A Electronic component placement equipment
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