Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/2013
07/31/2013CN203104964U Glue-pouring device for LED (light-emitting diode) circuit board
07/31/2013CN203104963U Circuit board water sucking line roller clamping device
07/31/2013CN203104957U Metal dome encapsulation pad structure and PCB with the structure
07/31/2013CN203091920U Wave-soldering tray
07/31/2013CN203091914U Solder pallet fixture
07/31/2013CN203091913U Solder pallet fixture
07/31/2013CN203091906U Novel wave source generating structure of lead-free tin furnace
07/31/2013CN103229605A Wiring substrate
07/31/2013CN103229604A Reflow soldering device and reflow soldering method
07/31/2013CN103229100A Polymerizable composition, and photosensitive layer, permanent pattern, wafer-level lens, solid-state imaging device and pattern forming method, each using the composition
07/31/2013CN103228818A A solution and a process for the pre-reatment of copper surfaces using a N-alkoxylated adhesion-promoting compound
07/31/2013CN103228754A Film sealant and sealing method
07/31/2013CN103228112A Electroless copper plating method for PCBs (printed circuit boards) with high aspect ratios
07/31/2013CN103228111A Filtering element and printed circuit board soldering method and structure
07/31/2013CN103228110A Line resistance welding process for printed circuit board
07/31/2013CN103228109A Line resistance welding process for printed circuit board
07/31/2013CN103228108A Method for manufacturing wiring pattern
07/31/2013CN103228107A Position correction device and position correction method using same
07/31/2013CN103228106A Plastic-sheathed component carrier with circuit-via
07/31/2013CN103228105A Wiring board and method for manufacturing the same
07/31/2013CN103228103A Wiring board and mounting structure using the same
07/31/2013CN103228102A Metallized via-holed ceramic substrate, and method for manufacture thereof
07/31/2013CN103226291A An ultraviolet curing transparent resin composition
07/31/2013CN102445850B Alkali development-type solder resist, cured product thereof, and printed wiring board prepared by using the same
07/31/2013CN102355797B Sintering process for metal substrate and printed board
07/31/2013CN102301840B Automatic soldering device and carrier device
07/31/2013CN102272676B Photosensitive resin composition, and photosensitive element, resist pattern formation method and printed circuit board production method each utilizing same
07/31/2013CN102271471B Hybrid high/low density multi-layer circuit board and process thereof
07/31/2013CN102256445B Method for manufacturing organic substrate
07/31/2013CN102227959B Wiring board and method for manufacturing same
07/31/2013CN102196669B Printed circuit board and manufacturing method thereof
07/31/2013CN102123566B Embedded circuit board and manufacturing method thereof
07/31/2013CN102090159B Flex-rigid wiring board and electronic device
07/31/2013CN101779530B Component mounting device and method
07/31/2013CN101754580B Wired circuit board and connection structure between wired circuit boards
07/31/2013CN101548587B Method for printing electrically conductive circuits
07/30/2013US8497431 Circuit connection material, circuit member connecting structure and method of connecting circuit member
07/30/2013US8495815 Electromagnetic shielding method and electromagnetic shielding film
07/25/2013WO2013109606A1 Printed circuit boards including strip-line circuitry and methods of manufacturing same
07/25/2013WO2013109340A1 Integrated circuit connectivity using flexible circuitry
07/25/2013WO2013108890A1 Resin composition, layered product, multilayered printed wiring board, multilayered flexible wiring board, and process for producing same
07/25/2013WO2013108696A1 Conductive paste and method for producing conductive pattern
07/25/2013WO2013108599A1 Wiring substrate and production method therefor
07/25/2013WO2013107065A1 Circuit substrate structure and manufacturing method thereof
07/25/2013US20130190060 Mobile wireless communications device including conformable, shape-retaining vacuum formed film and related methods
07/25/2013US20130189580 Strongly coupled inorganic-graphene hybrid materials, apparatuses, systems and methods
07/25/2013US20130189489 Micro-relief structures
07/25/2013US20130188361 Wiring substrate, light emitting device, and manufacturing method of wiring substrate
07/25/2013US20130188359 Radiant heat circuit board, method of manufacturing the same, heat generating device package having the same, and backlight
07/25/2013US20130188356 Led lighting assembly and method of lighting for a merchandise display
07/25/2013US20130188350 Electrical connectors and light emitting device package and methods of assembling the same
07/25/2013US20130188235 Switchable windows with mems shutters
07/25/2013US20130187630 Sensor tape for security detection and method of fabrication
07/25/2013US20130187182 Wiring substrate, light emitting device, and manufacturing method of wiring substrate
07/25/2013US20130186850 Slurry for cobalt applications
07/25/2013US20130186680 Tape Film Packages and Methods of Fabricating the Same
07/25/2013US20130186679 Multilayer wiring structure and method of manufacturing the same
07/25/2013US20130186678 Substrate set, electronic device, and method for manufacturing substrate set
07/25/2013US20130186677 Printed circuit board and method of manufacturing the same
07/25/2013US20130186676 Methods and Apparatus for a Substrate Core Layer
07/25/2013US20130186674 Multi-layer printed circuit board (pcb)
07/25/2013US20130185936 Wiring board and method of manufacturing the same
07/25/2013US20130185935 Method of fabricating a base layer circuit structure
07/25/2013US20130185934 Resin composition sheet for encapsulating electronic parts and method of producing electronic part apparatus using the sheet
07/25/2013US20130185933 Capacitor-circuit board interface for welding system components
07/25/2013DE102012001345A1 Verfahren zum Herstellen eines Datenträgers A method for producing a data carrier
07/25/2013DE102012001220A1 Electrical connection assembly for pressure-sensitive film arrangement used for touch screen of output apparatus, has force compensation and stabilization layer which is formed on bottom face of sensor film
07/24/2013EP2618373A1 Mobile wireless communications device including conformable, shape-retaining vacuum formed film and related methods
07/24/2013EP2618372A1 Multi-layer through-hole stacked layer structure
07/24/2013EP2617515A1 Semiconductor device bonding material
07/24/2013EP2617514A1 Laser processing method
07/24/2013EP2617272A1 Method for producing a circuit board consisting of a plurality of circuit board areas and circuit board
07/24/2013EP2617271A1 Electronic component with improved conduction structure
07/24/2013EP2617270A1 Assembling and packaging a discrete electronic component
07/24/2013EP2616995A1 Systems and methods for integrating radio-frequency indentification circuitry into flexible circuits
07/24/2013EP2616784A1 Printed temperature sensor
07/24/2013DE202012102248U1 Anschlussvorrichtung für einen Spulenkörper Connection device for a bobbin
07/24/2013CN203086862U Bottom support tooling used for printing of microphone PCB
07/24/2013CN203086861U Full-automatic intermediate speed placement machine
07/24/2013CN203086860U Multi-station efficient LED chip mounter
07/24/2013CN203086859U Circuit board cleaning water jet knife
07/24/2013CN203086858U Circuit board flushing device
07/24/2013CN203086857U Precise vertical-traveling guiding device and FPC multi-station film-laminating and pressing machine thereof
07/24/2013CN203086856U Pin nail film tooling used in PCB pattern transferring process
07/24/2013CN203086855U LED lamp belt carrier
07/24/2013CN203086854U Circuit board stripping device
07/24/2013CN203086853U Rapid dismounting device for molding circuit board
07/24/2013CN203086849U Connection structure of flexible circuit board and rigid circuit board
07/24/2013CN203077815U Novel printed circuit board (PCB) stencil
07/24/2013CN103222356A Method for performing chip level electromagnetic interference reduction, and associated apparatus
07/24/2013CN103222352A Multilayer wiring board
07/24/2013CN103222350A Selective seed layer treatment for feature plating
07/24/2013CN103222349A Method for forming circuit on flexible laminate substrate
07/24/2013CN103222131A Terminal assembly and method for connecting an electric wire to a terminal element
07/24/2013CN103222050A Crack arrest vias for ic devices
07/24/2013CN103221578A Method for forming functional pattern, and functional device
07/24/2013CN103221455A Powdered sealant and sealing method
07/24/2013CN103221330A Sensor comprising a preferably multilayered ceramic substrate and method for producing it
07/24/2013CN103221171A Transport device
07/24/2013CN103220889A Method for manufacturing oversize printed circuit board (PCB) back plate inner layer
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