Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/2013
12/04/2013CN103429984A Solder height detection method and solder height detection device
12/04/2013CN103429789A Process for etching recessed structure filled with tin or tin alloy
12/04/2013CN103429663A Resin composition, protective film containing same, dry film, circuit board, and multilayer circuit board
12/04/2013CN103429014A Multilayer board lamination device
12/04/2013CN103429013A Multi-layer printed wiring board and manufacturing method thereof
12/04/2013CN103429012A PCB (Printed Circuit Board) and production method of back drilling hole in PCB
12/04/2013CN103429011A Method for fabricating conductive structures of substrate
12/04/2013CN103429010A Forming method for conductive jack of ceramic heat dissipation substrate
12/04/2013CN103429009A Manufacture method of printed circuit board comprising metal aluminium layer
12/04/2013CN103429008A Manufacture method of printed circuit board with via on pad
12/04/2013CN103429007A Connecting method of printed circuit board substrates
12/04/2013CN103429006A BGA (Ball Grid Array) ball embedding method using SMT (Surface Mounting Technology) chip mounter
12/04/2013CN103429005A Bonding apparatus and method for display device
12/04/2013CN103429004A Embedding method and system of discrete passive components
12/04/2013CN103429003A Method for manufacturing ceramic metallization heating panel
12/04/2013CN103429002A PCB (printed circuit board) protection device
12/04/2013CN103429001A Method of manufacturing substrate for mounting electronic device
12/04/2013CN103429000A Method for preparing radiator-based copper foil-clad printed circuit board
12/04/2013CN103428999A PCB board moulding processing method and laminated plate
12/04/2013CN103428998A Flexible circuit board and method for manufacturing the same
12/04/2013CN103428996A Printed heating element
12/04/2013CN103428995A Invisible fine electric conduction coil and method for manufacturing same
12/04/2013CN103428994A Printed circuit board, manufacturing method thereof and electronic device
12/04/2013CN103428993A Wiring board and method for manufacturing the same
12/04/2013CN103428992A Circuit board, electronic module, lighting device and method for manufacturing circuit board
12/04/2013CN103428988A Printed circuit board and method of manufacturing the same
12/04/2013CN103427085A Battery panel nickel sheet welding product
12/04/2013CN103426994A Flexible PCB packaging process
12/04/2013CN103426785A Method and apparatus for tracking mounting error of chip mounter
12/04/2013CN103426499A Conductive particle, anisotropic conductive adhesive film and connecting structure
12/04/2013CN103422141A Automatic feeding and discharging location system of vertical continuous plating device
12/04/2013CN103419459A Hot pressing device and hot pressing method
12/04/2013CN103418873A Shielding screen welding or welding releasing method implemented by aid of laser welding machine
12/04/2013CN102523696B Solder resist manufacturing method of thick copper plate
12/04/2013CN102427679B Flexible printed circuit board with embedded lug interconnection structure and manufacturing method of flexible printed circuit board
12/04/2013CN102417794B Circuit connecting material, connecting method, connecting structure, manufacturing method and use thereof
12/04/2013CN102299081B Method for manufacturing packaging substrate and packaging substrate
12/04/2013CN102271919B Solder feeder, printer, and print method
12/04/2013CN102209441B Quality control method for solder joint portion and quality control device
12/04/2013CN102199404B Film-like circuit connecting material and connection structure for circuit member
12/04/2013CN102153957B Adhesive film, and connection structure and connecting method for circuit member
12/04/2013CN102074813B Electronic assembly and production method thereof
12/04/2013CN101980870B Method for manufacturing laminated circuit board
12/04/2013CN101648449B Metal laminated plate and preparation method thereof
12/03/2013US8601405 Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids
12/03/2013US8599539 Ceramic chip assembly
12/03/2013US8599524 Surface mount spark gap
12/03/2013US8598458 Electronic device and method of manufacturing the same
12/03/2013US8595927 Method for manufacturing multilayer printed wiring board
12/03/2013US8595926 Printed wiring board manufacturing method
12/03/2013US8595925 Manufacturing method of identifiable print circuit board
12/03/2013US8595924 Method of electromagnetic noise suppression devices using hybrid electromagnetic bandgap structures
12/03/2013US8595923 Method of determining a flexoelectric effect in a liquid crystal material
11/2013
11/28/2013WO2013177445A1 Grid arrays with enhanced fatigue life
11/28/2013WO2013177089A2 Accessory button controller assembly
11/28/2013WO2013176336A1 Method of manufacturing flexible substrate having metal wiring by using plasma and flexible substrate manufactured by using the method
11/28/2013WO2013176224A1 Method for manufacturing multilayer printed wiring board
11/28/2013WO2013176155A1 Method for producing patterned conductive base, patterned conductive base produced by same, and touch panel
11/28/2013WO2013176148A1 Device for evaluating visibility of transparent substrate, device for positioning laminate, determination device, position detection device, device for evaluating surface state of metal foil, program, recording medium, method for manufacturing printed wiring board, method for evaluating visibility of transparent substrate, method for positioning laminate, determination method, and position detection method
11/28/2013WO2013176133A1 Printed wiring board
11/28/2013WO2013175965A1 Electroconductive composition and circuit board having electroconductive film formed from same
11/28/2013WO2013175356A1 Illumination device
11/28/2013WO2013174872A1 Polymer thick film device
11/28/2013WO2013144738A3 A deformable apparatus and method
11/28/2013WO2012151500A9 Metal alloys from molecular inks
11/28/2013US20130316551 Universal press-fit connection for printed circuit boards
11/28/2013US20130316517 Substrate dividing method
11/28/2013US20130316321 Interactive printed article with touch-activated presentation
11/28/2013US20130316092 Method of high resolution laser etching on transparent conducting layer of touch panel
11/28/2013US20130315528 High-speed optical module with flexible printed circuit board
11/28/2013US20130314887 Slot-Mounted Printed Circuit Board Having Small Insertion Force
11/28/2013US20130314885 Printed circuit board assembly
11/28/2013US20130314876 Electrical Device
11/28/2013US20130314875 Thin multi-layered structures providing rigidity and conductivity
11/28/2013US20130313223 Method for producing substrate having surface nanostructure
11/28/2013US20130313012 Tsv fabrication using a removable handling structure
11/28/2013US20130313011 Interposed substrate and manufacturing method thereof
11/28/2013US20130313007 Grid Arrays with Enhanced Fatigue Life
11/28/2013US20130313006 Touch panel and producing method of the same
11/28/2013US20130313005 Wiring substrate and manufacturing method of wiring substrate
11/28/2013US20130313002 Multilayer printed circuit board and method for manufacturing same
11/28/2013US20130312901 Printed circuit board and manufacturing method thereof
11/28/2013US20130312256 Stretchable circuit assemblies
11/27/2013CN203313532U Circuit board solder paste brushing apparatus
11/27/2013CN203313531U Embedded memory device and electronic device
11/27/2013CN203313530U Copper clad plate corrosion equipment
11/27/2013CN203313529U Fixture for reducing gumming at edges of aluminum substrate
11/27/2013CN203313528U Dual-positioning and pressing device
11/27/2013CN203313527U Frame-type board frame for thin type circuit board
11/27/2013CN203313526U Frame-type thin circuit board plate rack
11/27/2013CN203313525U Novel-type bump mold for flexible circuit board
11/27/2013CN203313524U All-in-one bump mold
11/27/2013CN203312610U Pin flattening device for connector of displayer
11/27/2013CN203312275U Semiconductor device with formation of embedded SOP fan-out type packaging
11/27/2013CN203307457U Coating copper control device of electroplating process
11/27/2013CN103416112A Multilayer substrate having built-in electric element, and method for manufacturing multilayer substrate having built-in electric element
11/27/2013CN103416111A Flexible wiring board, method for manufacturing flexible wiring board, package product using flexible wiring board, and flexible multilayer wiring board
11/27/2013CN103416110A Printed circuit board and method for manufacturing the same
11/27/2013CN103416109A Printed circuit board and method for manufacturing the same
11/27/2013CN103416108A Printed circuit board and method for manufacturing same
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