Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2013
10/31/2013US20130283599 Making electronic storage system having code circuit
10/31/2013DE102013204565A1 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same
10/31/2013DE102012206973A1 Method for producing conductor tracks in copper layer of substrate e.g. direct copper bonded (DCB) substrate used for mounting LED in LED module, involves forming copper layer with specific region having reduced thickness
10/30/2013EP2658357A1 Multilayer wiring substrate, production method for multilayer wiring substrate, and via paste
10/30/2013EP2658356A1 Manufacturing method for printed circuit board with insulated micro radiator
10/30/2013EP2656955A1 Bonding method, bonding structure, electronic device, manufacturing method for electronic device, and electronic component
10/30/2013EP2656703A2 Printed circuit board and method for manufacturing the same
10/30/2013EP2656702A2 Printed circuit board and method for manufacturing the same
10/30/2013EP2656701A1 Method for obtaining a palladium surface finish for copper wire bonding on printed circuit boards and ic-substrates
10/30/2013EP2656699A1 Method of manufacturing a surface mounted device and corresponding surface mounted device
10/30/2013EP2656698A2 Printed circuit board with an insulated metal substrate
10/30/2013EP2655468A1 Epoxy resin compositions containing epoxy and vinyl ester groups
10/30/2013EP2655246A1 Graphene windows, methods for making same, and devices containing same
10/30/2013EP2655068A1 Printing table assembly, method for operating a printing table assembly
10/30/2013CN203261581U Automatic welding installing positioning tool for power module of variable frequency air conditioner
10/30/2013CN203261580U Steel web plate of sensor
10/30/2013CN203261579U High-speed welding alignment plate
10/30/2013CN203261578U SMT line body layout
10/30/2013CN203261577U SMT line body layout
10/30/2013CN203261576U Carrying device of vertical circuit board
10/30/2013CN203261575U Forming processing machine automatic stripping device
10/30/2013CN203261574U 软板载具 Soft-board with
10/30/2013CN203261573U Material cutting frame
10/30/2013CN203256362U Flexible circuit board electroplating hanger
10/30/2013CN203256356U Fixture used for electroplating ceramic printed circuit board
10/30/2013CN203255730U Device capable of reducing amount of brought-out workpieces on gantry type electroless nickel gold line and electrolytic nickel gold line
10/30/2013CN203254103U Welding jig for circuit board
10/30/2013CN203254033U Tin pot or tin furnace with rugged bottom
10/30/2013CN103380662A Circuit board and method for manufacturing circuit board
10/30/2013CN103380000A Screen printer and screen printing method
10/30/2013CN103379751A Manufacturing method of combined printed-circuit board, printed-circuit board and manufacturing method thereof
10/30/2013CN103379750A Multilayer circuit board and manufacturing method thereof
10/30/2013CN103379749A Multilayer circuit board and manufacturing method thereof
10/30/2013CN103379748A High-frequency mixed-compression board and manufacturing method thereof
10/30/2013CN103379747A Method of preparing circuit with high adhesive force and high conductivity in additive mode
10/30/2013CN103379746A Automatic wire bonder with flexible circuit board in line connection with glass
10/30/2013CN103379745A Manufacturing method of electronic component mounting substrate
10/30/2013CN103379744A Automatic plate withdrawing machine
10/30/2013CN103379743A Electrical component and method of arranging individual metal bodies on conductive pathways of a flexible carrier material
10/30/2013CN103379742A 电子元件安装系统 An electronic component mounting system
10/30/2013CN103379741A Automatic bonding machine for connection between chip and glass circuit
10/30/2013CN103379740A Vacuum switching device for chip mounter
10/30/2013CN103379739A Multi-stack cure system
10/30/2013CN103379738A Method for processing surface of printed circuit board
10/30/2013CN103379735A Semiconductor device and method of manufacturing the same
10/30/2013CN103379734A Wiring board with built-in electronic component and method for manufacturing the same
10/30/2013CN103379731A Circuit board and method of manufacturing circuit board
10/30/2013CN103379726A Multiple layer line structure of line laminated board
10/30/2013CN103377661A Printed circuit board and method of manufacturing the same
10/30/2013CN103376653A Photosensitive water-developable resistance welding composition and photosensitive water-developable resistance welding dry film
10/30/2013CN103374307A Gummed copper foil, production method for same, multilayer flexible circuit board and production method for same
10/30/2013CN103373050A Soldermask double-surfaced printing method and device for circuit board
10/30/2013CN103373027A Prepreg and printed circuit board comprising the same and manufacturing method printed circuit board
10/30/2013CN103372730A Joining sheet, electronic component, and producing method thereof
10/30/2013CN102449192B Electroless palladium plating solution
10/30/2013CN102427675B PIN disassembly machine
10/30/2013CN102404943B 除泡装置 Debubblers device
10/30/2013CN102361535B Flexible circuit board with impending splicing fingers and manufacturing method for flexible circuit board
10/30/2013CN102209434B Printed circuit board and method of fabricating printed circuit board
10/30/2013CN102083270B Circuit board and manufacturing method thereof
10/30/2013CN102043332B Photosensitive resin composition, metal-base-containing circuit board and production method thereof
10/30/2013CN101528458B Metal-film-coated material and process for producing same, metallic-pattern-bearing material and process for producing same, composition for polymer layer formation, nitrile polymer and method
10/29/2013US8571614 Low-power biasing networks for superconducting integrated circuits
10/29/2013US8569880 Multilayer printed wiring board
10/29/2013US8569630 Flex-rigid wiring board and method for manufacturing the same
10/29/2013US8567051 Process for the vertical interconnection of 3D electronic modules by vias
10/29/2013US8567050 Single shot molding method for COB USB/EUSB devices with contact pad ribs
10/29/2013US8567049 Method for interconnecting electrical device to a module
10/24/2013WO2013158834A1 Thermoset / thermoplastic powder coating formulations
10/24/2013WO2013158178A2 Micro cold spray direct write systems and methods for printed micro electronics
10/24/2013WO2013157514A1 Electroconductive ink composition
10/24/2013WO2013157378A1 Circuit connection material, and manufacturing method for assembly using same
10/24/2013WO2013157197A1 Electronic component mounting method and electronic component mounting line
10/24/2013WO2013157121A1 Robot system
10/24/2013WO2013157064A1 Soldering device and method, and manufactured substrate and electronic component
10/24/2013WO2013156538A1 Twisted cables by means of printing technology
10/24/2013WO2013155836A1 Method for dismantling electronic components on a circuit board by fine sand
10/24/2013WO2013155693A1 Circuit board
10/24/2013WO2013119117A3 A foil processing device
10/24/2013US20130280417 Hydrophobic Silane Coating for Preventing Conductive Anodic Filament (CAF) Growth in Printed Circuit Boards
10/24/2013US20130279138 Touch panel and method for manufacturing the same
10/24/2013US20130279125 Injection molded control panel with in-molded decorated plastic film that includes an internal connector
10/24/2013US20130279052 Esd protection device with a tunable holding voltage for a high voltage programming pad
10/24/2013US20130278568 Metal-insulator-metal capacitors on glass substrates
10/24/2013US20130278549 Display device and method for manufacturing the same
10/24/2013US20130277330 Methods of patterning a conductor on a substrate
10/24/2013US20130277100 Touch panel and method of manufacturing the same
10/24/2013US20130277097 Method for manufacturing printed circuit board
10/24/2013US20130277094 Touch panel and method for manufacturing the same
10/24/2013US20130276896 Micro-electro-mechanical systems (mems) and corresponding manufacturing process
10/24/2013US20130276284 Method for recycling of obsolete printed circuit boards
10/24/2013DE102011010407B4 Verfahren und Vorrichtung zum Herstellen einer polymerbasierten Leiterbahn Method and device for manufacturing a polymer-based conductor track
10/23/2013EP2654390A2 Structure of via hole of electrical circuit board
10/23/2013EP2654389A1 Joining sheet, electronic component, and producing method thereof
10/23/2013EP2654388A2 Semiconductor package, semiconductor apparatus and method for manufacturing semiconductor package
10/23/2013EP2654077A1 Ceramic via substrate, metallized ceramic via substrate, and method for manufacturing both
10/23/2013CN203251572U Novel upper tool integral structure
10/23/2013CN203251526U Printed circuit board screen printing hole plugging backing plate
10/23/2013CN203251525U Printed circuit board screen printing hole plugging general backing plate
10/23/2013CN203251524U Printed circuit board screen printing hole plugging general-purpose backing plate
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