Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/2013
08/14/2013CN203136324U Laminated draw ring structure and draw ring laminating device for laminated draw ring structure
08/14/2013CN203124904U Component fixing device
08/14/2013CN203124901U Tin furnace jig
08/14/2013CN203124889U Wave soldering machine with intelligent control system
08/14/2013CN203124887U Wave soldering machine with heat dissipating device
08/14/2013CN103250474A Multilayer printed wiring board and method of manufacturing same
08/14/2013CN103250472A Chip-integrated through-lating of multilayer substrates
08/14/2013CN103250245A Bumpless build-p layer and laminated core hybrid structures and methods of assembling same
08/14/2013CN103250236A Binding material, binding body, and binding method
08/14/2013CN103250154A Wiring check device and wiring check system
08/14/2013CN103249572A Laser direct structuring materials with all color capability
08/14/2013CN103249519A Pb-free solder alloy having Zn as main component
08/14/2013CN103249273A Stack type baseplate structure
08/14/2013CN103249266A Multilayer circuit board production method capable of preventing layer deviation
08/14/2013CN103249265A Blind hole filling method
08/14/2013CN103249264A Method for manufacturing multi-layer circuit board with internal connecting finger
08/14/2013CN103249263A Manufacturing method of circuit structure for circuit laminated board
08/14/2013CN103249262A Face mounting interconnected seat opening structure for soldering paste printing steel screen
08/14/2013CN103249261A Jig for assembling parts of circuit board
08/14/2013CN103249260A Display apparatus and method of manufacturing the same
08/14/2013CN103249259A Film sticking device and method
08/14/2013CN103249258A Automatic substrate loading device
08/14/2013CN103249257A Solder resist method for circuit board
08/14/2013CN103249256A Surface treatment structure for circuit patterns
08/14/2013CN103249255A Method for directly preparing conducting circuit on resin baseplate
08/14/2013CN103249254A Method of removing palladium in NPTHs of PCB
08/14/2013CN103249253A High precision aluminium base material circuit board manufacturing process and system
08/14/2013CN103249252A Control method for solder resist ink exposure precision
08/14/2013CN103249251A PCB correction method and correction device
08/14/2013CN103249250A Circuit board, method for manufacturing circuit board and illuminating device comprising circuit board
08/14/2013CN103249249A Circuit board system
08/14/2013CN103249248A Composite substrate, manufacturing method and LED vertical chip structure based on composite substrate
08/14/2013CN103249243A Circuit structure for circuit laminated board
08/14/2013CN103247604A Electronic module and method of manufacturing same
08/14/2013CN102762035B Method of manufacturing circuit board
08/14/2013CN102476229B Heating wire fixing structure for reflow soldering and reflow soldering equipment
08/14/2013CN102458051B Manufacture method of substrate and structure used for simplifying preparation technology
08/14/2013CN102438405B Method for cleaning through hole smears of rigid-flexible printed circuit board
08/14/2013CN102427676B Heat dissipation type rigid-flexible combined board and manufacturing method thereof
08/14/2013CN102265718B Multilayer wiring substrate, and method for producing multilayer wiring substrate
08/14/2013CN102232127B Method for improving the adhesion between silver surfaces and resin materials
08/14/2013CN102171382B 2-benzyl-4-(2,4-dichlorophenyl)-5-methylimidazole compound
08/14/2013CN102124826B Method for manufacturing printed wiring board and printed wiring board
08/14/2013CN101896037B Rigid-flex wiring board and method for producing same
08/14/2013CN101821111B Laser decal transfer of electronic materials
08/14/2013CN101542392B Photocurable resin composition, dry film, cured product, and printed wiring board
08/13/2013US8507400 Method of making a catalyst
08/13/2013US8507100 Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheet
08/13/2013US8506791 Linear guide
08/13/2013US8506550 Method and system for non-vascular sensor implantation
08/13/2013US8505198 Method for manufacturing an electronic assembly
08/13/2013US8505197 Methods of fabricating multilayer substrates
08/13/2013US8505178 Adjustable support tooling apparatus
08/13/2013DE202013006618U1 Draht-Biege-Vorrichtung Wire-bending device
08/13/2013CA2619997C Process for producing articles having an electrically conductive coating
08/08/2013WO2013116443A1 Micro-dispensing multi-layered 3d objects with curing steps
08/08/2013WO2013116278A1 System and method for operating a stencil printer
08/08/2013WO2013115851A1 Laser patterning of photovoltaic backsheet
08/08/2013WO2013114080A1 Method of making a flexible circuit
08/08/2013WO2013113995A1 Method and arrangement for producing an electrically conductive pattern on a surface
08/08/2013WO2013113994A1 Method and arrangement for transferring electrically conductive material in fluid form on a substrate to be printed
08/08/2013US20130203294 Printed circuit board, method of manufacturing the same and connection terminal
08/08/2013US20130202247 Optical module fabricated on folded printed circuit board
08/08/2013US20130201616 Three dimensional passive multi-component structures
08/08/2013US20130200516 Hybrid substrate, production method therefor, and semiconductor integrated circuit package
08/08/2013US20130199832 Composite build-up materials for embedding of active components
08/08/2013US20130199829 Printed circuit board with cavity
08/08/2013US20130199825 Composite build-up material for embedding of circuitry
08/08/2013US20130199824 Microelectronics device including anisotropic conductive layer and method of forming the same
08/08/2013US20130199295 Damping device for a micromechanical sensor device
08/08/2013US20130199035 Carrier for manufacturing printed circuit board and method for manufacturing the carrier
08/08/2013US20130199034 Methods and Apparatuses of Using Metal Needle Arrays for Specimen Lift-Out and Circuit Edit
08/08/2013DE10357837B4 Verfahren zur Oberflächenmontage von akustischen Wandlern A method of surface mounting of acoustic transducers
08/08/2013DE102013202017A1 System for mechanically connecting flexible printed circuit board with touch sensor, has processing circuit electrically connected to connection pads such that signals from electrodes is communicated to circuit via connection pads
08/08/2013DE102013201755A1 Antennenanordnung und Verfahren zum Herstellen einer Antennenanordnung Antenna arrangement and method for manufacturing an antenna assembly
08/07/2013EP2624673A1 Substrate with built-in component and method for manufacturing substrate with built-in component
08/07/2013EP2624672A1 Method for manufacturing substrate with built-in component, and substrate with built-in component manufactured using the method
08/07/2013EP2624671A1 Copper foil for printed wiring board, method for producing said copper foil, resin substrate for printed wiring board, and printed wiring board
08/07/2013EP2624670A1 Cabled condenser, in particular for a radiofrequency circuit and device comprising same
08/07/2013EP2623632A2 Method of forming a microstructure
08/07/2013EP2622949A1 Resistor shield to minimize crosstalk and power supply interference
08/07/2013EP2622687A1 Wire connecting device for connecting fiber-core conductor
08/07/2013CN203120383U Component transfer device for feeding detector
08/07/2013CN203120381U Component transferring device for fork piece feeding
08/07/2013CN203120304U Traceable stitching mirror plate
08/07/2013CN203120303U Apparatus used for manufacturing heat dissipation structure of printed circuit board
08/07/2013CN203120302U Fixing clamp for circuit boards
08/07/2013CN203120301U Device for pasting capacitors on circuit board
08/07/2013CN203120300U Full-automatic PCB positioning clamp
08/07/2013CN203120299U Laminating device
08/07/2013CN203120298U Semicircular ring-shaped reinforced steel sheet split positioning device
08/07/2013CN203120297U Reinforced steel sheet precise arrangement and assembly cover plate split positioning device
08/07/2013CN203120296U Soft circuit board dark transparency character screen printing plate assembly
08/07/2013CN203112956U PLC (Programmable Logic Controller) current control based circuit board electroplating system
08/07/2013CN203110476U Voltage heating type circuit board pressing system based on Industry Ethernet
08/07/2013CN203109527U Jig used for welding circuit board
08/07/2013CN203109398U Vapor reflow oven
08/07/2013CN103238380A Metallized substrate, metal paste composition, and method for producing metallized substrate
08/07/2013CN103238379A Process machine, in particular for treating and/or inspecting substrates
08/07/2013CN103237423A Indium tile copper interlayer graph making method for multilayer printed board
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