Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/2013
09/18/2013CN103313519A Jig for binding elastic sheets of flexible circuit boards
09/18/2013CN103313518A Manufacturing method for flexible printed circuit (FPC) single-side ultra-thin base material line
09/18/2013CN103313517A Drilling positioning method for PCB (printed circuit board)
09/18/2013CN103313516A Conductive pattern film base material and manufacturing method thereof
09/18/2013CN103313515A Manufacturing method of printed circuit board stepped slot and printed circuit board comprising stepped slot
09/18/2013CN103313514A Vertical circuit board processing and conveying device
09/18/2013CN103313513A Method for improving reliable grounding of microwave printed circuit board
09/18/2013CN103313512A Microwave assembly high-density substrate design method based on composite dielectric materials
09/18/2013CN103313510A Circuit board and manufacturing method of circuit board
09/18/2013CN103313509A Metal-based conducting circuit board and manufacturing method thereof
09/18/2013CN103313508A Electronic component board and production method of the same
09/18/2013CN103313505A Conductor track structure on non-conductive bearing material and manufacturing method of conductor track structure
09/18/2013CN103313504A Film-free flexible printed circuit board and production method thereof
09/18/2013CN103311139A Bonding components to each other using exothermic reactions by simultaneous current pulses
09/18/2013CN103311132A Plating-then-etching technical method for multi-layer circuit substrate with metal frame
09/18/2013CN103310907A Method for producing conductive material, and conductive material
09/18/2013CN103309541A Manufacturing method for capacitance type touch screen wire circuit
09/18/2013CN103309526A Manufacturing method for narrow circuit
09/18/2013CN103305882A Electroplating method for PCB plate and apparatus
09/18/2013CN103302206A Base pin bending fixture of 4PIN receiver optical subassembly
09/18/2013CN102387673B Processing method of multilayer circuit board
09/18/2013CN102360852B Heavy-current planar transformer
09/18/2013CN102202468B Methods of patterning a deposit metal on a substrate
09/18/2013CN102118922B 印制电路板 Printed circuit board
09/18/2013CN102036462B Printed circuit board and protection method thereof
09/18/2013CN101836268B Method of forming copper wiring pattern and copper oxide particle dispersion for use in the same
09/18/2013CN101772262B Welding structure of circuit board as well as method thereof
09/18/2013CN101742811B Printed circuit board and method of manufacturing the same
09/18/2013CN101323557B Low temperature thermal conductive inks
09/17/2013US8536714 Interposer, its manufacturing method, and semiconductor device
09/17/2013US8536696 Conductive pin attached to package substrate
09/17/2013US8536485 Systems and methods for forming apertures in microfeature workpieces
09/17/2013US8536463 Printed-circuit board and manufacturing method thereof
09/17/2013US8536461 Printed circuit board having stiff and flexible characteristics
09/17/2013US8536457 Multilayer wiring board and method for manufacturing the same
09/17/2013US8533943 Printed wiring board and method for producing the same
09/17/2013US8533942 Production method of multilayer printed wiring board and multilayer printed wiring board
09/17/2013US8533941 Method of bonding two structures together with an adhesive line of controlled thickness
09/17/2013CA2741925C Improvements relating to additive manufacturing processes
09/12/2013WO2013133560A1 Printed circuit board and method of manufacturing the same
09/12/2013WO2013133420A1 Method for manufacturing transparent conductive pattern
09/12/2013WO2013133269A1 Method for manufacturing printed wiring board and copper foil for laser processing
09/12/2013WO2013133196A1 Pattern forming method and pattern forming substrate manufacturing method
09/12/2013WO2013133116A1 Connection method using anisotropic conductive material and anisotropic conductive connected structure
09/12/2013WO2013133041A1 Halogen-free flame-retardant adhesive composition
09/12/2013WO2013132954A1 Bonding method, bond structure, and manufacturing method for same
09/12/2013WO2013132953A1 Bonding method, electronic device manufacturing method, and electronic component
09/12/2013WO2013132930A1 Three-dimensional laminated wiring substrate
09/12/2013WO2013132837A1 Entry sheet for drilling use
09/12/2013WO2013132815A1 Module with embedded electronic components, electronic device, and method for manufacturing module with embedded electronic components
09/12/2013WO2013132758A1 Printed semiconductor, fabrication method for same, and stamp
09/12/2013WO2013132680A1 Carrier-attached metal foil
09/12/2013WO2013132638A1 Electronic component inspecting apparatus and electronic component inspecting method
09/12/2013WO2013132569A1 Semiconductor device
09/12/2013WO2013132542A1 Printed circuit board and electronic apparatus
09/12/2013WO2013132250A1 Coated electrical assembly
09/12/2013US20130236210 Motherboard mounting structure and image forming apparatus with same
09/12/2013US20130235630 Multiple driver power supply
09/12/2013US20130235573 Led array for replacing flourescent tubes
09/12/2013US20130235544 Integrated circuit stack
09/12/2013US20130235535 Composite substrate, module, and composite-substrate production method
09/12/2013US20130235527 Power electronic system and method of assembly
09/12/2013US20130234797 Broadband Transistor Bias Network
09/12/2013US20130234782 Sensor arrangement for detection of proximity and/or touching, as well as a kit and method for assembling a sensor arrangement
09/12/2013US20130233607 Wiring substrate and method for manufacturing wiring substrate
09/12/2013US20130233603 Method for mounting a component in or on a circuit board, and circuit board
09/12/2013US20130233600 Integrated plated circuit heat sink and method of manufacture
09/12/2013US20130233598 Flexible film carrier to increase interconnect density of modules and methods thereof
09/12/2013US20130232784 Method of manufacturing wiring substrate
09/12/2013US20130232782 Method of Producing an Interposer with Microspring Contacts
09/11/2013EP2637175A1 Low-temperature sintering conductive paste, conductive film using same, and method for forming conductive film
09/11/2013EP2636427A1 Elevated hermetic feedthrough insulator adapted for side attachment of electrical conductors on the body fluid side of an active implantable medical device
09/11/2013EP2636287A1 Chip-integrated through-plating of multilayer substrates
09/11/2013EP2421342B1 Method of manufacturing an electronic component
09/11/2013EP2421341B1 Electronic component and method of manufacturing the same
09/11/2013CN203194030U Welding structure of mouse electronic component
09/11/2013CN203194029U Novel paster material-connecting belt
09/11/2013CN203194028U Absorbent cotton immersing barrel device of cleaning machine for PCB circuit board finished products
09/11/2013CN203194027U Photosensitive dry film for printed circuit board
09/11/2013CN203194026U PCB board rectification apparatus
09/11/2013CN203194025U Board-clamping jig
09/11/2013CN203194024U Air supply apparatus for automatic copper plating set for producing PCB circuit boards
09/11/2013CN203194023U Novel recycled phenolic resin plate
09/11/2013CN203192299U Circuit board etching device used for training room
09/11/2013CN203191682U PCB (printed circuit board) and film aligning device
09/11/2013CN203191681U PCB (printed circuit board) via hole and plug hole film structure
09/11/2013CN103299724A Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods
09/11/2013CN103299723A Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices
09/11/2013CN103299722A Drill entry sheet
09/11/2013CN103299721A Method of making an electronic device having a liquid crystal polymer solder mask and related devices
09/11/2013CN103299408A Manufacturing method for electronic component module, and electronic component module
09/11/2013CN103299177A Solder-attachment inspection method, PCB-inspection system, and solder-attachment inspection device
09/11/2013CN103298612A Insulating substrate, metal-clad laminate, printed wiring board, and semiconductor device
09/11/2013CN103298275A Metal circuit plating and etching successive method for multilayer circuit base board with metal frame
09/11/2013CN103298274A Manufacturing method for capacitor-buried printed-circuit board and capacitor-buried printed-circuit board
09/11/2013CN103298273A Method for preventing bottom holes of circuit board from being blocked in copper plating
09/11/2013CN103298272A Method of manufacturing rigid-flexible printed circuit board
09/11/2013CN103298271A Device for bonding flexible pcb to camera module
09/11/2013CN103298270A 印刷电路板及其制造方法 The method of manufacturing a printed circuit board and
09/11/2013CN103298269A Method for manufacturing PCB (printed circuit board)
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