Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2013
10/23/2013CN203251523U Screen printing plate used for PCB hole plugging
10/23/2013CN203251522U Connection structure of light emitting diode and circuit board
10/23/2013CN203251521U Central vacuum system used for chip mounter
10/23/2013CN203251520U Mounting head sliding locking mechanism of array chip mounter
10/23/2013CN203251519U Press-fit auxiliary structure of quick press machine
10/23/2013CN203251518U Structurally-improved printed circuit board-used insertion board frame
10/23/2013CN103370994A A method for mounting connection pins in a component carrier, a die tool for mounting connection pins, a component carrier forming a module for an electronic assembly, and such an assembly
10/23/2013CN103369875A 电路板及其制作方法 Circuit board and its manufacturing method
10/23/2013CN103369874A Method for manufacturing wiring substrate and wiring substrate
10/23/2013CN103369873A Packaging structure and redistribution layer substrate and formation method thereof
10/23/2013CN103369872A Method for laminating multilayer printed circuit board
10/23/2013CN103369871A Multi-layer printed circuit board and manufacturing method thereof
10/23/2013CN103369870A Method for making patterning conducting layer
10/23/2013CN103369869A Method of manufacturing multilayer printed circuit board and multilayer printed circuit board manufactured via the same
10/23/2013CN103369868A Manufacturing method of PCB (Printed Circuit Board) and PCB
10/23/2013CN103369867A Printed Circuit Board (PCB) and preparation method thereof
10/23/2013CN103369866A Method for manufacturing printed circuit board containing blind holes and manufactured printed circuit board
10/23/2013CN103369865A A method for producing a circuit board
10/23/2013CN103369864A Method of processing through hole on circuit board
10/23/2013CN103369863A Production process of softness and hardness combined printed circuit board with soft board at outer layer
10/23/2013CN103369862A Continuous circuit boards and manufacturing method for continuous circuit boards
10/23/2013CN103369861A Continuous circuit boards and manufacturing method for continuous circuit boards
10/23/2013CN103369860A Method for manufacturing circuit board
10/23/2013CN103369859A Solder paste printing jig and solder paste printing method
10/23/2013CN103369858A Electronic element mounting system
10/23/2013CN103369857A A method for processing a testing board before a conductive anodic filament experiment
10/23/2013CN103369856A Method for manufacturing PCB coil clamp head and PCB coil clamp head
10/23/2013CN103369855A Automatic insert pin supply equipment
10/23/2013CN103369854A Side-by-side double-layer single-rail surface mount system workbench
10/23/2013CN103369853A 夹取工具 Gripping tool
10/23/2013CN103369852A Manufacturing method for metallization blind slot-contained gold-plating plate surface pattern
10/23/2013CN103369851A Printed circuit board and manufacturing method thereof
10/23/2013CN103369850A PCB (printed circuit board) spraying and etching production line
10/23/2013CN103369849A Window-opening processing technology for covering layer of flexible circuit board
10/23/2013CN103369848A High-density interconnection printed circuit board laser alignment system and method
10/23/2013CN103369847A Anti-scratching method for printed circuit board
10/23/2013CN103369846A Special-shaped hole deburring method
10/23/2013CN103369845A Adhesive paper sticking head and adhesive paper sticking device using same
10/23/2013CN103369844A Adhesive paper sticking head and adhesive paper sticking device using same
10/23/2013CN103369843A Adhesive paper sticking head and adhesive paper sticking device using same
10/23/2013CN103369842A Adhesive paper sticking head and adhesive paper sticking device using same
10/23/2013CN103369841A Punching device
10/23/2013CN103369840A Substrate treating apparatus
10/23/2013CN103369839A Method of manufacturing substrate for LED module and substrate for LED module manufactured by the same
10/23/2013CN103369838A Hot-pressing device
10/23/2013CN103369837A Roll-type catalytic-slurry hole filling and circuit-formation double-sided flexible board process
10/23/2013CN103369836A Method and device for drilling band expansion/contraction
10/23/2013CN103369835A Method for blocking adhesive in mixed pressing process of printed circuit board plate
10/23/2013CN103369834A Target parameter processing method and device for PCB (printed circuit board) production
10/23/2013CN103369833A System provided with a solder joint
10/23/2013CN103369828A Circuit board system
10/23/2013CN103369826A A bonding pad layout structure of a circuit board used for soldering signal filtering modules
10/23/2013CN103369824A High heat conducting PCB (Printed circuit board) metal base and preparation method thereof
10/23/2013CN103369823A 印刷电路板及其制造方法 The method of manufacturing a printed circuit board and
10/23/2013CN103369822A Anti-reverse-plugging flexible printed circuit board and wiring method for same
10/23/2013CN103369821A PCB (printed circuit board) with high-density interconnection design and heat dissipation structure and manufacturing method thereof
10/23/2013CN103369820A PCB (printed circuit board) with high-density interconnection design and heat dissipation structure and manufacturing method thereof
10/23/2013CN103369816A Wiring board and method for manufacturing the same
10/23/2013CN103369811A Wiring board and method for manufacturing the same
10/23/2013CN103367299A Device and method for power interconnection of semiconductor module
10/23/2013CN103367274A Grid fan-out wafer level package and methods of manufacturing a grid fan-out wafer level package
10/23/2013CN103367169A Ultrathin buried die module and method of manufacturing thereof
10/23/2013CN103366923A Location short pin magnetic ring insertion piece
10/23/2013CN103365084A Photocurable resin composition, dry film, cured product and printed wiring board
10/23/2013CN103363944A Method for testing eroding rate and uniformity of drilling smear removal
10/23/2013CN103363896A Laminate inspection method, laminate inspection device and laminate manufacturing apparatus
10/23/2013CN103361706A Fixture for electroplating circuit board
10/23/2013CN103360963A Joining sheet, electronic component, and producing method thereof
10/23/2013CN102483571B Photosensitive composition and printed wiring board
10/23/2013CN102368890B Manufacturing method of PCB with embedded assembly
10/23/2013CN102300712B Screen printing device and screen printing method
10/23/2013CN102067742B Automatic soldering equipment
10/23/2013CN101869885B Ultrasonic soldering flux coating process and device
10/23/2013CN101631670B Metal-clad laminate, and method for production of metal-clad laminate
10/23/2013CN101533425B Power supply noise analysis apparatus, method and program for electronic circuit board
10/22/2013US8564971 Fixing apparatus for hard disk drive
10/22/2013US8563420 Multilayer printed wiring board
10/22/2013US8561292 Method for manufacturing an implantable electronic device
10/22/2013US8561291 Method for producing a number of chip cards
10/17/2013WO2013154203A1 Circuit connection material, connection structure, and fabrication method for same
10/17/2013WO2013153869A1 Multilayer wiring board, manufacturing method therefor and probe card
10/17/2013WO2013153745A1 Electrode bonding method, manufacturing method for electrode assembly, and manufacturing system for electrode assembly
10/17/2013WO2013153720A1 Information processing device, information processing method, program, and substrate production system
10/17/2013WO2013153674A1 Soldering device and method, and manufactured substrate and electronic component
10/17/2013WO2013153673A1 Wiring base material for mounting electronic component thereon, method for manufacturing wiring base material for mounting electronic component thereon, electronic circuit module, and land forming apparatus
10/17/2013WO2013153616A1 Ball mounting method and substrate-working machine
10/17/2013WO2013082094A3 Method for depositing materials on a substrate
10/17/2013WO2013082090A3 Material deposition system for depositing materials on a substrate
10/17/2013WO2013023926A3 Electronic device comprising a capacitor in a holder for a circuit board and method for production thereof
10/17/2013US20130273756 Electrical connector having ribbed ground plate with engagement members
10/17/2013US20130271930 Method Of Preparing A Flexible Substrate Assembly And Flexible Substrate Assembly Therefrom
10/17/2013US20130271907 Offset interposers for large-bottom packages and large-die package-on-package structures
10/17/2013US20130271820 Electrophoretic display apparatus and method of manufacturing the same
10/17/2013US20130271177 Printed circuit board, method of producing a printed circuit board and testing device for testing a printed circuit board
10/17/2013US20130270224 Corrugated interfaces for multilayered interconnects
10/17/2013US20130270220 Heat spreader with high heat flux and high thermal conductivity
10/17/2013US20130270218 Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit Using Same
10/17/2013US20130270216 Method of thin printed circuit board wet process consistency on the same carrier
10/17/2013US20130269989 Prepreg and printed circuit board comprising the same and manufacturing method printed circuit board
10/17/2013US20130269988 Peripheral circuit of touch panel and manufacturing method thereof
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