| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 10/09/2013 | CN103342969A Printed circuit board (PCB) shading tape and preparation method thereof |
| 10/09/2013 | CN102446575B Sintering composition and sintering method |
| 10/09/2013 | CN102387664B Circuit board printing method |
| 10/09/2013 | CN102348339B Circuit board manufacturing method |
| 10/09/2013 | CN102340933B Manufacturing method of circuit board |
| 10/09/2013 | CN102137546B Manufacturing method of circuit structure of circuit board |
| 10/09/2013 | CN102056402B Printed circuit board with cooling-prevention grooves and manufacturing method thereof |
| 10/09/2013 | CN101842856B Methods of treating a surface to promote binding of molecule(s) of interest, coatings and devices formed therefrom |
| 10/09/2013 | CN101842166B Apparatus for anisotropic focusing |
| 10/09/2013 | CN101827490B Multilayer printed wiring board |
| 10/08/2013 | US8551315 Method for electromechanical fabrication |
| 10/08/2013 | US8551308 Biosensor and method of making |
| 10/08/2013 | US8549743 Method for hot embossing at least one conductive track onto a substrate |
| 10/08/2013 | US8549742 High-voltage power supply device and image forming apparatus having same |
| 10/08/2013 | US8549741 Suspension method for compliant thermal contact of electronics modules |
| 10/08/2013 | US8549740 Method of manufacturing a folded waveguide |
| 10/08/2013 | US8549738 Flex circuit with single sided routing and double sided attach |
| 10/08/2013 | US8549737 Method of connecting a grid array package to a printed circuit board |
| 10/08/2013 | CA2666037C Photochemical synthesis of metallic nanoparticles for ink applications |
| 10/03/2013 | WO2013147535A1 Synthetic method of suppressing metal nano-particle from having oxidized film and method of manufacturing conductive metal thin film via solution-processed |
| 10/03/2013 | WO2013147442A1 Copper paste composition for printing, and method of forming metal pattern using same |
| 10/03/2013 | WO2013147122A1 Maskless exposure device |
| 10/03/2013 | WO2013147050A1 Laminate body, conductive pattern, electrical circuit, and method for producing laminate body |
| 10/03/2013 | WO2013147047A1 Conductive ink composition, method for producing conductive patterns, and conductive circuit |
| 10/03/2013 | WO2013147018A1 Photo-curable thermosetting resin composition, cured product, printed wiring board, and light source module |
| 10/03/2013 | WO2013146931A1 Multilayer wiring board |
| 10/03/2013 | WO2013146888A1 Circuit connection material and manufacturing method for assembly using same |
| 10/03/2013 | WO2013146789A1 Sintered silicon nitride substrate and process for producing same |
| 10/03/2013 | WO2013146717A1 Copper foil with carrier, method for manufacturing copper foil with carrier, copper foil with carrier for printed circuit board, and printed circuit board |
| 10/03/2013 | WO2013146706A1 Photo-curable thermosetting composition, method of manufacturing cured product thereof, cured product, and printed circuit board having same |
| 10/03/2013 | WO2013146612A1 Entry sheet for drilling |
| 10/03/2013 | WO2013146573A1 Electroconductive particle, circuit connecting material, mounting body, and method for manufacturing mounting body |
| 10/03/2013 | WO2013146572A1 Connected body manufacturing method, connection method |
| 10/03/2013 | WO2013146479A1 Method for manufacturing connector, method for connecting electronic component, connecting member, and method for manufacturing connecting member |
| 10/03/2013 | WO2013146389A1 Method for producing conductor film |
| 10/03/2013 | WO2013146331A1 Conductive element and method of manufacture thereof, wiring element, and master |
| 10/03/2013 | WO2013146254A1 Conductive composition and conducting film |
| 10/03/2013 | WO2013146239A1 Photosensitive conductive paste and method for manufacturing conductive substrate with wiring |
| 10/03/2013 | WO2013146195A1 Electroconductive pattern, electric circuit, electromagnetic wave shield, and method for manufacturing electroconductive pattern |
| 10/03/2013 | WO2013145798A1 Exposure writing device and exposure writing method |
| 10/03/2013 | WO2013145622A1 Substrate bonding apparatus and substrate bonding method |
| 10/03/2013 | WO2013145043A1 Built-up substrate, method for manufacturing same, and semiconductor integrated circuit package |
| 10/03/2013 | WO2013143732A1 Method for manufacture of fine line circuitry |
| 10/03/2013 | US20130258658 Ceramic-based light emitting diode (led) devices, components and methods |
| 10/03/2013 | US20130258625 Wiring board and method for manufacturing the same |
| 10/03/2013 | US20130258623 Package structure having embedded electronic element and fabrication method thereof |
| 10/03/2013 | US20130258619 Stiffener frame with circuit board corner protection |
| 10/03/2013 | US20130258615 Method for producing an electronic assembly having a shaped body |
| 10/03/2013 | US20130258610 Semiconductor chip device with vented lid |
| 10/03/2013 | US20130258578 Package including an underfill material in a portion of an area between the package and a substrate or another package |
| 10/03/2013 | US20130257624 Visually detecting electrostatic discharge events |
| 10/03/2013 | US20130257525 Circuit board with integrated voltage regulator |
| 10/03/2013 | US20130257519 Touch panel and method of fabricating the same |
| 10/03/2013 | US20130256023 Printed circuit board and method of manufacturing the same |
| 10/03/2013 | US20130256016 Printed circuit board and manufacturing method thereof |
| 10/03/2013 | US20130256014 Metallized substrate, metal paste composition, and method for manufacturing metallized substrate |
| 10/03/2013 | US20130256010 Method of manufacturing multilayer printed circuit board and multilayer printed circuit board manufactured via the same |
| 10/03/2013 | US20130256007 Wiring board with built-in electronic component and method for manufacturing the same |
| 10/03/2013 | US20130256006 Method for Forming Circuit on Flexible Laminate Substrate |
| 10/03/2013 | US20130256005 Mounting adapter, printed board, and manufacturing method thereof |
| 10/03/2013 | US20130256004 Deformable Apparatus and Method |
| 10/03/2013 | US20130256000 Wiring board and method for manufacturing the same |
| 10/03/2013 | US20130255998 Method of manufacturing conductive sheet, conductive sheet, and recording medium |
| 10/03/2013 | US20130255997 Processes for producing conductive and/or piezoresistive traces on polymeric substrates |
| 10/03/2013 | US20130255996 Layered structure having layered conductive patterns, manufacturing process thereof and touchscreen with layered structure |
| 10/03/2013 | US20130255878 Printed circuit board manufacturing method |
| 10/03/2013 | US20130255079 Method and arrangement for attaching a chip to a printed conductive surface |
| 10/03/2013 | US20130255078 Information carrying card comprising a cross-linked polymer composition, and method of making the same |
| 10/02/2013 | EP2645830A1 Method for manufacture of fine line circuitry |
| 10/02/2013 | EP2645829A2 Printed circuit board and method for manufacturing same |
| 10/02/2013 | EP2645828A2 Printed circuit board and method for manufacturing same |
| 10/02/2013 | EP2645827A1 Joining sheet, electronic component, and producing method thereof |
| 10/02/2013 | EP2645408A1 Binding material, binding body, and binding method |
| 10/02/2013 | EP2644010A2 Printed circuit board and method for manufacturing the same |
| 10/02/2013 | EP2643851A1 A method and an apparatus for forming electrically conductive vias in a substrate, an automated robot-based manufacturing system, a component comprising a substrate with via holes, and an interposer device |
| 10/02/2013 | EP2643795A1 Conductor track arrangement for portable data storage medium |
| 10/02/2013 | DE112011104328T5 Pb-freie Lotlegierung, die überwiegend Zn enthält Pb-free solder alloy containing mainly Zn |
| 10/02/2013 | DE112011104211T5 Bondhügellose Aufbauschicht- und Laminatkernhybridstrukturen und Verfahren für ihre Montage Bump lots Aufbauschicht- and laminate core hybrid structures and methods for their assembly |
| 10/02/2013 | CN203225958U Material cutting platform |
| 10/02/2013 | CN203225957U Resin hole plugging tool for printed circuit board |
| 10/02/2013 | CN203225956U Support structure for window cover of SMD buffer conveyor |
| 10/02/2013 | CN203225955U Surface mount technology (SMT) board-splicing printing device |
| 10/02/2013 | CN203225954U Substrate cleaner |
| 10/02/2013 | CN203225953U Paper static elimination device |
| 10/02/2013 | CN203225952U Plugboard frame for inserting printed circuit board |
| 10/02/2013 | CN203225951U Fixture for flexible circuit board adhesive tape surface mounting alignment |
| 10/02/2013 | CN203225950U Special-purpose rack for drying plate |
| 10/02/2013 | CN203225945U A container used for copper block browning and a printed circuit board horizontal line |
| 10/02/2013 | CN103340023A Method for producing printed wiring board |
| 10/02/2013 | CN103340022A Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate |
| 10/02/2013 | CN103340021A 印刷电路板装配件 Printed circuit board assemblies |
| 10/02/2013 | CN103339722A Resin for electrical components, semiconductor device, and wiring board |
| 10/02/2013 | CN103339685A Electroconductive paste and method for manufacturing same |
| 10/02/2013 | CN103339537A Light-shielding composition, method for producing a light-shielding composition, solder resist, method for forming a pattern, and solid-state imaging device |
| 10/02/2013 | CN103338893A Reflow method for lead-free solder |
| 10/02/2013 | CN103338625A Component inserter with double overhead machine heads |
| 10/02/2013 | CN103338624A Polyfunctional positioning device for PCB for insert-in machine |
| 10/02/2013 | CN103338600A PCB structure and production method thereof, and embedded device PCB production method |
| 10/02/2013 | CN103338599A Manufacturing process of rigid-flex combined PCB (printed circuit board) |
| 10/02/2013 | CN103338598A Automatic conveying device and electronic installation system |