| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/24/2013 | DE102012003520B4 Anschlusselement für eine auf einer Platine angeordnete lichtemittierende Diode (LED) Connection element for a printed circuit board disposed on a light emitting diode (LED) |
| 12/19/2013 | WO2013187537A1 Microetching agent for copper, supplementary liquid for same, and manufacturing method for circuit board |
| 12/19/2013 | WO2013187362A1 Device for coating thin molten solder film, thin solder film-covered component and manufacturing method therefor |
| 12/19/2013 | WO2013187183A1 Conductive paste, and laminated ceramic electronic component and method for producing same |
| 12/19/2013 | WO2013187117A1 High frequency module |
| 12/19/2013 | WO2013186966A1 Composite multilayer wiring board and method for manufacturing same |
| 12/19/2013 | WO2013186927A1 Printed board |
| 12/19/2013 | WO2013186241A1 Method of producing an electronic circuit with protection of the conductive layer |
| 12/19/2013 | WO2013161996A3 Transparent conductive ink, and method for producing transparent conductive pattern |
| 12/19/2013 | WO2013160454A3 Electrically conductive polyamide substrate |
| 12/19/2013 | WO2013160160A3 Method and apparatus for electrolytically depositing a deposition metal on a workpiece |
| 12/19/2013 | WO2013079930A9 Electro -acoustic transducer for mounting on a substrate |
| 12/19/2013 | US20130337241 Method for selectively metallizing surface of ceramic substrate, ceramic product and use of ceramic product |
| 12/19/2013 | US20130337188 Resin composition and method for producing circuit board |
| 12/19/2013 | US20130337155 Manufacturing method of circuit pattern |
| 12/19/2013 | US20130336511 Micro-Sensor Package And Associated Method Of Assembling The Same |
| 12/19/2013 | US20130335931 Surface mount interconnection system for modular circuit board and method |
| 12/19/2013 | US20130335928 Carrier and method for fabricating coreless packaging substrate |
| 12/19/2013 | US20130335875 Integrated circuit with automatic deactivation upon exceeding a specific ion linear energy transfer (let) value |
| 12/19/2013 | US20130335808 Analog imod having high fill factor |
| 12/19/2013 | US20130335483 Inkjet print head and method for manufacturing the same |
| 12/19/2013 | US20130334400 Method of making lens modules and the lens module |
| 12/19/2013 | US20130334292 Printed Circuit Boards |
| 12/19/2013 | US20130334168 Manufacturing method of circuit pattern |
| 12/19/2013 | US20130333935 High reliability fluid-tight low-profile electrically conductive interconnects for large scale frame attachment |
| 12/19/2013 | US20130333934 Multilayer electronic structure with stepped holes |
| 12/19/2013 | US20130333933 Delta Arrangement of Hexagonal-Close-Packed Signal Pairs |
| 12/19/2013 | US20130333932 Printed circuit board and methods of manufacturing the same |
| 12/19/2013 | US20130333930 Wiring board and method of manufacturing the same |
| 12/19/2013 | US20130333928 Implementing feed-through and domain isolation using ferrite and containment barriers |
| 12/19/2013 | US20130333927 Printed circuit board and method of manufacturing the same |
| 12/19/2013 | US20130333926 Circuit substrate and method of manufacturing same |
| 12/19/2013 | US20130333925 Flexible-Rigid Circuit Board Composite and Method for Producing a Flexible-Rigid Circuit Board Composite |
| 12/19/2013 | US20130333924 Multilayer electronic support structure with integral metal core |
| 12/19/2013 | US20130333921 Oversized interposer |
| 12/19/2013 | US20130333208 Reduction of arc-tracking in chip on flexible circuit substrates |
| 12/19/2013 | US20130333207 Apparatus for manufacturing camera module |
| 12/19/2013 | US20130333206 Vertically separated pass through conveyor system and method in surface mount technology process equipment |
| 12/19/2013 | US20130333094 Appendage Mountable Electronic Devices COnformable to Surfaces |
| 12/19/2013 | DE112005000438B4 Eine Zwischenverbindungsstruktur und ein Verfahren zum Verbinden von vergrabenen Signalleitungen mit elektrischen Vorrichtungen An interconnect structure and a method of connecting signal lines with the buried electrical devices |
| 12/19/2013 | DE102012105765A1 Verfahren zur Herstellung einer dreidimensionalen Leiterbahnstruktur sowie eine nach diesem Verfahren hergestellte Leiterbahnstruktur A process for producing a three-dimensional wiring pattern and a wiring pattern prepared by this method |
| 12/19/2013 | DE102012105334A1 Method for contacting printed circuit board, involves producing pad on support substrate, and imprinting pad in thermosensitive functional layer in overlapping manner |
| 12/19/2013 | DE102012105297A1 Verfahren zum Verbinden eines Bauteils mit einem Träger über eine Lötung und Bauteil zum Verbinden mit einem Träger A method for connecting a component to a support via a solder component and for coupling to a carrier |
| 12/19/2013 | DE102012105110A1 Montageträger und Verfahren zur Montage eines Montageträgers auf einem Anschlussträger Mounting bracket and method for mounting a mounting bracket on a connection carrier |
| 12/19/2013 | DE102006016275B4 Verfahren zum Platzieren von elektrisch kontaktierbaren Bauelementen auf einem Schaltungsträger Method of placing electrically contactable components on a circuit carrier |
| 12/18/2013 | EP2675254A1 Surface mount interconnection system for modular circuit board and method |
| 12/18/2013 | EP2675253A1 Flexible-rigid circuit board composite and method for producing a flexible-rigid circuit board composite |
| 12/18/2013 | EP2675252A1 A method for mounting an electronic element on a substrate with conductive paths sensitive to high temperature |
| 12/18/2013 | EP2673802A1 Encapsulated component |
| 12/18/2013 | EP2424338B1 Multilayer printed wiring boards with holes requiring copper wrap plate |
| 12/18/2013 | CN203352974U PCB plate welding rotation blowing jig |
| 12/18/2013 | CN203352973U PCB plate buffer positioning hot pressing jig |
| 12/18/2013 | CN203352972U PCB plate heat insulation stroke-limiting hot pressing jig |
| 12/18/2013 | CN203352971U Stable PCB plate welding rotation limiting jig |
| 12/18/2013 | CN203352970U PCB plate welding rotation adsorption jig |
| 12/18/2013 | CN203352969U PCB plate welding rotation limiting jig |
| 12/18/2013 | CN203352968U Electronic component pin |
| 12/18/2013 | CN203352967U Carrier dedicated for SMT process |
| 12/18/2013 | CN203352966U PCB plate support jig |
| 12/18/2013 | CN203352965U PCB plate support jig with blowing adsorption function |
| 12/18/2013 | CN203352964U Fixture for producing double-sided board |
| 12/18/2013 | CN203352963U Fixed seat for circuit board printing |
| 12/18/2013 | CN203352962U Automatic back adhesive pasting machine used for printed circuit board (PCB) |
| 12/18/2013 | CN203352961U Novel circuit board printing chassis structure |
| 12/18/2013 | CN203352960U PCB plate blowing support adsorption jig |
| 12/18/2013 | CN203352959U PCB plate cooling adsorption jig |
| 12/18/2013 | CN203352958U PCB plate cooling compaction jig |
| 12/18/2013 | CN203352957U PCB plate support jig with blowing function |
| 12/18/2013 | CN203352956U PCB adsorption device for cooperating with film-sticking machine |
| 12/18/2013 | CN203352955U Circuit board clamping jig with rotating mechanism |
| 12/18/2013 | CN203352954U Line cutting die |
| 12/18/2013 | CN203352953U Line cutting die |
| 12/18/2013 | CN203352952U Jig with heating function |
| 12/18/2013 | CN203344458U Oil pressure bearing plate |
| 12/18/2013 | CN203343670U PCB (Printed Circuit Board) welding clamp |
| 12/18/2013 | CN103460823A Flexible multilayer substrate |
| 12/18/2013 | CN103460822A Multilayer substrate with integrated chip component and method for manufacturing same |
| 12/18/2013 | CN103460821A Resin substrate having built-in component and method for producing same |
| 12/18/2013 | CN103460820A Wiring board and method for manufacturing same |
| 12/18/2013 | CN103460819A Wiring substrate |
| 12/18/2013 | CN103460818A Multilayer ceramic substrate |
| 12/18/2013 | CN103460817A Method for forming copper wiring, method for manufacturing wiring substrate, and wiring substrate |
| 12/18/2013 | CN103460816A Electronic assembly |
| 12/18/2013 | CN103460815A Mounting structure and method for manufacturing same |
| 12/18/2013 | CN103460134A Positive-tone photosensitive resin composition, dry film, cured product, and printed wiring board |
| 12/18/2013 | CN103460132A Photosensitive composition, hardened coating films therefrom, and printed wiring boards using same |
| 12/18/2013 | CN103459679A Rolled copper or copper-alloy foil provided with roughened surface |
| 12/18/2013 | CN103459504A Curable resin composition, cured product thereof and printed circuit board using same |
| 12/18/2013 | CN103459075A Soldering device and method, and manufactured substrate and electronic component |
| 12/18/2013 | CN103458630A Method for overcoming limits of printed circuit board copper-clad substrate thin board operation |
| 12/18/2013 | CN103458629A Multi-layer circuit board and manufacturing method thereof |
| 12/18/2013 | CN103458628A Multi-layer circuit board and manufacturing method thereof |
| 12/18/2013 | CN103458627A Double-surface pressing connecting through hole structure of printed-circuit board and machining method thereof |
| 12/18/2013 | CN103458626A Method and device for manufacturing blind holes |
| 12/18/2013 | CN103458625A Mounting structure for electronic component, input device, and method of manufacturing mounting structure |
| 12/18/2013 | CN103458624A Technology and structure for double-faced flexible substrate pieces to be connected into rolls |
| 12/18/2013 | CN103458623A Method for recognizing and indicating assembling positions of printed board components |
| 12/18/2013 | CN103458622A Circuit board processing method |
| 12/18/2013 | CN103458621A Spraying method for thick copper circuit board |
| 12/18/2013 | CN103458620A PCB circuitous pattern development exposure method |