Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/2013
12/27/2013WO2013191194A1 Mesh member for screen printing and screen printing plate
12/27/2013WO2013191117A1 Method for manufacturing layered substrate, and layered substrate structure
12/27/2013WO2013191026A1 Printed circuit board, and manufacturing device and manufacturing method therefor
12/27/2013WO2013191022A1 Bonding member
12/27/2013WO2013190925A1 Electronic component module
12/27/2013WO2013190748A1 Substrate, imaging unit, and imaging device
12/27/2013WO2013190437A1 Systems and methods for millimeter-wave laminate structures
12/27/2013WO2013189911A1 Method for connecting a component to a carrier via soldering and component for connection to a carrier
12/27/2013WO2013189531A1 Injection moulded circuit carrier having an integrated circuit board
12/27/2013WO2013189486A1 Method for producing a three-dimensional conductor trace structure and a conductor trace structure produced according to this method
12/27/2013WO2013189157A1 Liquid crystal display device and liquid crystal screen module
12/27/2013WO2013189029A1 Printed circuit board processing method, printed circuit board and electronic device
12/26/2013US20130344703 Film forming method and film forming apparatus
12/26/2013US20130344232 Methods of forming conductive features on three-dimensional objects
12/26/2013US20130343022 Single layer low cost wafer level packaging for sff sip
12/26/2013US20130343020 Electro-Static Shielding Apparatus, Electronic Device, and Method for Manufacturing said Electro-Static Shielding Apparatus
12/26/2013US20130343008 Circuit board system with mechanical protection
12/26/2013US20130343000 Thermal management circuit board for stacked semiconductor chip device
12/26/2013US20130342998 Electronic Assembly with Detachable Components
12/26/2013US20130342986 Pin connector structure and method
12/26/2013US20130342936 Wiring circuit substrate, flexible substrate for suspension, and method of producing flexible substrate for suspension
12/26/2013US20130342429 Flexible display panel, display device having the display panel, and method of manufacturing the display panel
12/26/2013US20130342231 Semiconductor substrate with onboard test structure
12/26/2013US20130342221 Metal nanostructured networks and transparent conductive material
12/26/2013US20130341079 Transparent conductive substrate and method for manufacturing same
12/26/2013US20130341078 Z-directed printed circuit board components having a removable end portion and methods therefor
12/26/2013US20130341077 Method for repairing disconnection in wiring board, method for manufacturing wiring board, method for forming wiring in wiring board and wiring board
12/26/2013US20130341074 Metal nanowire networks and transparent conductive material
12/26/2013US20130341073 Packaging substrate and method for manufacturing same
12/26/2013US20130340250 Method for Forming a Circuit Board Via Structure for High Speed Signaling
12/26/2013US20130340249 Method of manufacturing multilayer circuit substrate
12/25/2013EP2677550A1 Conductive paste applying mechanism and cell wiring device
12/25/2013EP2676829A1 Carrier assembly for an instrument cluster
12/25/2013EP2676799A1 Thermoplastic resin composition, resin molding, and process for producing resin molding having plating layer attached thereto
12/25/2013EP2438802B1 Arrangement of printed circuit boards
12/25/2013EP2092810B1 Installation for producing a circuit board comprising additional copper wiring elements that are integrated and brought into contact by ultrasound
12/25/2013CN203368962U Multilayer plate laminating device
12/25/2013CN203368961U A SMT bridging structure
12/25/2013CN203368960U 回焊炉载具 Reflow oven carrier
12/25/2013CN203368959U Tin furnace carrier
12/25/2013CN203368958U Fixture used in electronic installation system
12/25/2013CN203368957U Conduction wire leading-out device of PCB plate
12/25/2013CN203368956U PCB board capable of firmly fixing conduction wires
12/25/2013CN203368955U Error-proof jig for pin header assembly
12/25/2013CN203368954U PCBA assembly needle implantation apparatus
12/25/2013CN203368953U Insertion rack for stripping and resistance welding of thin plate
12/25/2013CN203368952U Flexible printed circuit board tacking jig for automatically adjusting parallelism
12/25/2013CN203368951U High-precision adhesive small sticker attaching machine
12/25/2013CN203368950U Fixed-amount liquid medicine adding device of circuit board manufacturing equipment
12/25/2013CN203368949U PCB plate correction device
12/25/2013CN203368948U Reinforcement pressing device of soft and hard combine plate
12/25/2013CN203368947U Cooling device for PCB (printed circuit board) fixture
12/25/2013CN203368946U Processing plate for PCB (printed circuit board)
12/25/2013CN203368945U Fixation device for PCB (printed circuit board)
12/25/2013CN203368944U Automatic adhesive tape coating device of PCB plates
12/25/2013CN203368943U Exposure device for PCB plate
12/25/2013CN203368942U Adhesive-bonding device for PCB plate
12/25/2013CN203368941U PCB plate fixation frame
12/25/2013CN203366491U Sensing protection device for circuit board electroplating
12/25/2013CN203365911U Film structure used on semi-automatic exposing machine
12/25/2013CN203360611U Electroplating fixture
12/25/2013CN203360610U Vertical clamping device used for PCB (printed circuit board)
12/25/2013CN203360605U PCB (Printed Circuit Board) electroplating clamp
12/25/2013CN203360604U Stationary fixture for PCB (Printed Circuit Board)
12/25/2013CN203356804U PCB wave-soldering tin?stove tin-dipping adjustable tray
12/25/2013CN203356792U Tin furnace and hot air leveling machine with tin furnace
12/25/2013CN103477728A Printed circuit board, manufacturing method therefor, and metal-surface treatment liquid
12/25/2013CN103477727A Glass ceramic substrate and method for producing same
12/25/2013CN103477726A Printing conductive lines
12/25/2013CN103477723A Ceramic wiring board, multi-pattern ceramic wiring board, and method for producing same
12/25/2013CN103477722A Wiring board, multi-pattern wiring board, and method for producing same
12/25/2013CN103477425A Processing station for flat substrates, in particular solar cells
12/25/2013CN103477282A Photocurable resin composition, dry film, cured product, and printed wiring board
12/25/2013CN103476958A Stainless-steel sheet for metal mask
12/25/2013CN103476589A Combination stencil printer and dispenser and related methods
12/25/2013CN103476588A Methods for depositing viscous material on a substrate with a combination stencil printer and dispenser
12/25/2013CN103476541A Lead-free solder alloy
12/25/2013CN103476238A Conveying mechanism of automatic component inserter
12/25/2013CN103476204A Addition preparation method for double-side boards
12/25/2013CN103476203A Wet process film pasting method of flexible printed circuit board
12/25/2013CN103476202A Adjustable furnace-passing jig
12/25/2013CN103476201A Circuit substrate operation system
12/25/2013CN103476200A Printed circuit addition manufacturing method based on nickel catalysis and chemical copper plating
12/25/2013CN103476199A Printed circuit addition manufacturing method based on copper autocatalysis and chemical copper plating
12/25/2013CN103476198A Copper foil for printed wiring board, process for preparing the same, and printed wiring board using the copper foil
12/25/2013CN103476197A Manufacturing method for printed circuit board and printed circuit board
12/25/2013CN103465663A Circuit board double-face character printing technology and printing structure thereof
12/25/2013CN103465525A Engraved plate and base material having conductor layer pattern using the engraved plate
12/25/2013CN102573299B Method for preparing low temperature co-fired ceramic (LTCC) level substrate
12/25/2013CN102523688B Method for manufacturing PCB (Printed Circuit Board) with stepped grooves
12/25/2013CN102523685B Method for manufacturing PCB (Printed Circuit Board) with stepped grooves
12/25/2013CN102510664B Method for solving thin oil of circuit of PCB (printed circuit board)
12/25/2013CN102281703B Laminated circuit board and board producing method
12/25/2013CN102256453B Multilayer circuit board manufacturing method
12/25/2013CN102131958B Method of forming microstructure
12/25/2013CN102123561B Electronic sub-component used for electronic device
12/25/2013CN102046726B Epoxy resin composition for printed wiring board, solder resist composition, resin film, resin sheet, prepreg, metal foil with resin, cover lay, and flexible printed wiring board
12/25/2013CN101733439B Machining device and machining method
12/24/2013US8613135 Method for non-planar chip assembly
12/24/2013US8613134 Method of conveying printed circuit boards
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